HP EliteBook 850 G3 and 750 G3 Notebook PCs Product Specifications
Product image
Product features
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Feature
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Description
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Operating system
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Preinstalled
Windows 10 Pro 64
Windows 10 Home 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 64
Windows 7 Professional 32
FreeDOS 2.0
NeoKylin Linux 64
Web supported
Windows 10 Pro 64
Windows 10 Home 641
Windows 10 Enterprise 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 8.1 Enterprise 64
Windows 7 Professional 64
Windows 7 Professional 32
Windows 7 Enterprise 64
Windows 7 Enterprise 32
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Processor
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Intel Core i7-6600U (2.6 GHz, up to 3.4 GHz with Intel Turbo Boost Technology, 4 MB cache, 2 cores)
Intel Core i7-6500U (2.5 GHz, up to 3.1 GHz with Intel Turbo Boost Technology, 4 MB cache, 2 cores)
Intel Core i5-6300U (2.4 GHz, up to 3 GHz with Intel Turbo Boost Technology, 3 MB cache, 2 cores)
Intel Core i5-6200U (2.3 GHz, up to 2.8 GHz with Intel Turbo Boost Technology, 3 MB cache, 2 cores)
Intel Core i3-6100U (2.3 GHz, 3 MB cache, 2 cores)
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Chipset
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Chipset is integrated with processor
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Graphics
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Integrated
Intel HD Graphics 520
Discrete
AMD Radeon R7 M365X
1GB GDDR5 dedicated
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Display
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Non-Touch
15.6 diagonal LED backlight HD Slim eDP SVA Anti-glare (1366 x 768)
15.6 diagonal LED backlight HD Slim eDP SVA Anti-glare (1366 x 768) with camera
15.6 diagonal LED backlight FHD Slim eDP SVA Anti-glare (1920 x 1080)
15.6 diagonal LED backlight FHD Slim eDP SVA Anti-glare (1920 x 1080) with camera
15.6 diagonal LED backlight UHD Slim eDP UWVA Anti-glare (3840 x 2160)
15.6 diagonal LED backlight UHD Slim eDP UWVA Anti-glare (3840x 2160) with camera
Touch
15.6 diagonal LED backlight FHD Slim eDP SVA (1920 x 1080) Touch with camera
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Storage and drives
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Primary storage
SATA, 2.5 in hard drives
500 GB 7200rpm self encrypting drive (FIPS-140-2) (Opal 2)
500 GB 7200rpm hard drive
500 GB 7200rpm self-encrypting drive (Opal 2)
1 TB 5400rpm hard drive
500 GB hybrid, 8 GB cache
Mini Card Solid State Drive
M.2 (NGFF) 2280 solid State Drive
128 GB SATA-3 TLC solid State Drive
180 GB SATA-3 MLC solid State Drive
180 GB SATA-3 self-encrypting (Opal 2) MLC solid state drive
240 GB SATA-3 MLC solid state drive
256 GB SATA-3 TLC solid state drive
256 GB SATA-3 self-encrypting (Opal 2) MLC solid state drive
256 GB PCIe-3x4 NVMe solid state drive
512 GB SATA-3 TLC solid state drive
HP 3D DriveGuard (Windows and Hard Drives only)
The hard drive is mounted directly to the notebook frame, reducing the transmission of shock to the hard drive.
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Memory
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Standard
DDR4 PC4-17000 (Transfer rates up to 2133 MT/s)
Two SODIMM slots supporting dual-channel memory
Both slots are customer accessible/upgradeable
Supports
4096 MB total system memory (4096 MB x 1)
8192 MB total system memory (4096 MB x 2)
8192 MB total system memory (8192 MB x 1)
16384 MB total system memory (8192 MB x 2)
Maximum
Up to 16 GB
Dual-channel
Maximized dual-channel performance requires SODIMMs of the same size and speed in both memory slots.
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Networking / communications
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Broadband Wireless (WWAN)
HP lt4120 Qualcomm SnapdragonT X5 LTE Mobile Broadband Module
HP hs3110 HSPA+ Intel Mobile Broadband Module
Wireless LAN (WLAN) Via M.2 MiniCard
Intel Dual Band Wireless-AC 8260 802.11 a/b/g/n/ac (2x2) WiFi and Bluetooth 4.2 combo (vPro)
Intel Dual Band Wireless-AC 8260 802.11 a/b/g/n/ac (2x2) WiFi and Bluetooth 4.2 combo (non-vPro)
Intel Wireless-AC 3165 802.11 a/b/g/n/ac (1x1) WiFi and Bluetooth 4.0 combo (vPro)
Near Field Communication (NFC)1
HP Module with NXP NFC Controller NPC100
Support for Miracast
note:
Communications
Intel Ethernet Connection I219-V 10/100/1000 Ethernet (with Intel i3-6100U, i5-6200U, and i7-6500U)
Intel Ethernet Connection I219-LM 10/100/1000 Ethernet (with Intel i5-6300U and i7-6600U)
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Audio / multimedia
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Audio
Audio by Bang & Olufsen
HP Clear Sound amp
HP noise reduction software
Digital microphones (Dual Array)
2 premium stereo speakers
Webcam
Optional 720 p webcam
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Keyboards / pointing devices / buttons
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The HP spill-resistant keyboard is designed using a thin layer of Mylar film under the keyboard and includes an all-metal keyboard deck for greater rigidity. The 101/102-key compatible keyboard features a full-pitch key layout with desktop keyboard features, such as editing keys, both left and right control and alt keys, and function keys.
US and International key layouts are available. Backlit keyboard with HP DuraKeys available as an option.
Pointing Device
Glass touchpad
On/off button
Taps enabled as default
Gestures enabled by default - 2 finger scrolling, 2 finger zoom (pinch)
Buttons and Function Keys
F1 - Sleep
F2 - Blank
F3 - Backlit Toggle
F4 - Display Switching
F5 - Brightness Down
F6 - Brightness Up
F7 - Blank
F8 - Volume Down
F9 - Volume Up
F10 - Mic Mute
F11 - Blank
F12 - Blank
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Ports and slots
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Specification
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Description
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Ports and slots
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USB 3.0 charging port
USB 3.0 port
USB Basic Type-C
Display Port
VGA
RJ-45 / Ethernet
Docking connector
Headphone/microphone combo
AC port
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Slots
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External Micro SIM slot
SD Media Reader Slot Supports SD, SDHC, SDXC
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Displays
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Specification
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Description
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15.6 diagonal LED backlight HD Slim eDP SVA Anti-glare
(1366 x 768)
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Outline dimensions: 360 x 224.3 x 3.2 mm (14.7 x 8.8 x 0.13 in)
Active area: 344.2 x 193.5 mm (13.6 x 7.6 in)
Weight: 370 g
Diagonal size: 15.6 in
Surface treatment: AG
Contrast ratio: 300:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 220 nits
Pixel resolution:
Configuration: RGB stripe
Interface: eDP 1.2 (1 lane)
LCD Mode: TN
PPI: 101
Viewing angle: SVA 40/40/15/30
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15.6 diagonal LED backlight FHD Slim eDP SVA Anti-glare
(1920 x 1080)
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Outline dimensions: 360 x 224.3 x 3.2 mm (14.7 x 8.8 x 0.13 in)
Active area: 344.2 x 193.5 mm (13.6 x 7.6 in)
Weight: 360 g
Diagonal size: 15.6 in
Surface treatment: AG
Contrast ratio: 400:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 300 nits
Pixel resolution:
Configuration: RGB stripe
Interface: eDP 1.2 (1 lane)
LCD Mode: TN
PPI: 142
Viewing angle: SVA 45/45/25/35
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15.6 diagonal LED backlight UHD Slim eDP UWVA Anti-glare (3840 x 2160)
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Outline dimensions: 13.62 x 7.59 (in) (3.6 x 19.4 cm)
Weight: 345 g
Diagonal size: 15.6 in
Surface treatment: AG
Contrast ratio: 1000:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 340 nits.
Pixel resolution:
Format: 3840 x 2160
Configuration: RGB stripe
PPI: 282
Viewing angle: UWVA 80/80/80/80
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15.6 diagonal LED backlight FHD Slim eDP SVA (1920 x 1080)
Touch with Camera
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Outline dimensions: 360 x 224.3 x 3.2 mm (14.7 x 8.8 x 0.13 in)
Active area: 344.2 x 193.5 mm (13.6 x 7.6 in)
Weight: 360 g
Diagonal size: 15.6 in
Surface treatment: AG/BV
Contrast ratio: 500:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 300 nits.
Pixel resolution:
Format: 1920 x 1080 (FHD)
Configuration: RGB stripe
Interface: eDP 1.2 (2 lane)
LCD Mode: TN
PPI: 142
Viewing angle: SVA 45/45/25/35
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Storage and drives
500 GB 7200 rpm self encrypting drive (FIPS-140-2) (Opal 2)
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Specifications
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Description
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Drive weight
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95 g (0.21 lb)
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Capacity
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500 GB
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Height
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7 mm (0.28 in)
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Width
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69.85 mm (2.75 in)
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Interface
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ATA-8, SATA 3.0
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Transfer rate
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Synchronous: 600 MB/s
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Seek time
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Single track: 1.5 ms
Average: 12 ms
Maximum: 18-22 ms
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Cache
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32 GB
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Rotational speed
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7200 rpm
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Logical blocks
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976,773,168
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Operating temperature
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0° to 60° C (32° to 140° F) (case temperature)
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Features
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ATA security; TCG Opal 2.x, FIPS, S.M.A.R.T., NCQ, Ultra DMA
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500 GB 7200 rpm hard drive
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Specifications
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Description
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Drive weight
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92-95 g (0.2 - 0.21 lb)
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Capacity
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500 GB
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Height
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7 mm (0.28 in)
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Width
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70 mm (2.75 in)
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Interface
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ATA-8, SATA 2.6, 3.0 Gb/s, NCQ
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Transfer rate
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Synchronous: 600 MB/s
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Seek time
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Single track: 1.5 - 2 ms
Average: 11 - 13 ms
Maximum: 18 - 22 ms
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Rotational speed
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7200 rpm
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Cache
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32 GB
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Logical blocks
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976,773,168
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Operating temperature
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0° to 60° C (32° to 140° F) (case temperature)
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Features
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ATA security
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500 GB 7200 rpm self-encrypting drive (Opal 2)
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Specifications
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Description
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Drive weight
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95 g (0.21 lb)
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Capacity
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500 GB
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Height
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7 mm (0.28 in)
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Width
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70 mm (2.75 in)
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Interface
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ATA-8, SATA 3.0
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Transfer rate
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Synchronous: 600 MB/s
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Seek time
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Single track: 1.5 ms
Average: 12 ms
Maximum: 18 - 22 ms
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Rotational speed
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7200 rpm
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Cache
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32 GB
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Logical blocks
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976,773,168
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Operating temperature
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0° to 60° C (32° to 140° F) (case temperature)
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Features
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ATA security; TCG Opal 2.x, FIPS, S.M.A.R.T., NCQ, Ultra DMA
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1 TB 5400 rpm hard drive
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Specifications
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Description
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Drive weight
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94 - 99 g (0.21 lb)
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Capacity
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1 TB
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Height
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7 mm (0.28 in)
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Width
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70 mm (2.75 in)
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Interface
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ATA-8, SATA 3.0
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Transfer rate
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Synchronous: 600 MB/s
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Seek time
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Single track: 2 ms
Average: 12 - 13 ms
Maximum: 18 - 23 ms
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Rotational speed
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5400 rpm
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Cache
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Up to 32 GB
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Logical blocks
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976,773,168
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Operating temperature
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0° to 60° C (32° to 140° F) (case temperature)
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Features
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S.M.A.R.T., NCQ, Ultra DMA
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500 GB hybrid, 8 GB cache
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Specifications
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Description
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Drive weight
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95 g (0.21 lbs)
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Capacity
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500 GB
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Height
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7 mm (0.28 in)
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Width
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70.1 mm (2.76 in)
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Interface
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ATA-8, SATA 2.6, 6.0 Gb/s, NCQ
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Transfer rate
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Synchronous: 600 MB/s
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Seek time
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Single track: 2 ms
Average: 12 ms
Maximum: NIL ms
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Rotational speed
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5400 rpm
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Cache
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64 GB
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Logical blocks
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976,773,168
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Operating temperature
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0° to 60° C (32° to 140° F) (case temperature)
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Features
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ATA security
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128 GB 2280 M2 SATA-3 solid state drive
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Specifications
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Description
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Drive weight
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8.5 - 10 g (0.019 - 0.022 lb)
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Capacity
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128 GB
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Height
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2.23 - 3.58 mm (0.09 - 0.14 in)
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Width
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22 mm (0.87 in)
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Interface
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ATA-8, SATA 3.0
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Performance
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Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 300 MB/s
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Logical blocks
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250,069,680
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA security, DIPM; TRIM; DEVSLP
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180 GB M2 2280 SATA-3 MLC solid state drive
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Specifications
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Description
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Drive weight
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< 10 g (0.022 lb)
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Capacity
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180 GB
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Height
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2.23 mm (0.09 in)
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Width
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22 mm (0.87 in)
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Interface
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ATA-8, SATA 3.0
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Performance
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Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 490 MB/s
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Logical blocks
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351,651,888
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA security, DIPM; TRIM; DEVSLP
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180 GB M2 2280 SATA-3 self-encrypting drive (Opal 2) MLC solid state drive
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Specifications
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Description
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Drive weight
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< 10 g (0.022 lb)
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Capacity
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180 GB
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Height
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2.23 mm (0.09 in)
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Width
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22 mm (0.87 in)
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Interface
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ATA-8, SATA 3.0
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Performance
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Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 490 MB/s
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Logical blocks
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351,651,888
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA security, TCG OPAL 2.x, DIPM; TRIM; DEVSLP
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240 GB 2280 SATA-3 MLC Solid State Drive
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Specifications
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Description
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Drive weight
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8.5 - 10 g (0.019 lb)
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Capacity
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256 GB
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Height
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2.3 - 3.58 mm (0.09 - 0.14 in)
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Width
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22 mm (0.87 in)
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Interface
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ATA-8, SATA 3.0
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Performance
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Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 455 MB/s
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Logical blocks
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500,118,192
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA Security, DIPM; TRIM; DEVSLP
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256 GB 2280 SATA-3 TLC Solid State Drive
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Specifications
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Description
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Drive weight
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10 g (0.02 lb)
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Capacity
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240 GB
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Height
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2.23 - 3.58 mm (0.14 - 0.09 in)
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Width
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22 mm (0.87 in)
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Interface
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ACS-3, SATA 3.2
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Performance
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Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 490 MB/s
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Logical blocks
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468,862,128
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA Security; DIPM; TRIM; DEVSLP
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256 GB M2 2280 SATA-3 Self-Encrypting Drive (Opal 2) MLC Solid State Drive
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Specifications
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Description
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Drive weight
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10 g (0.02 lb)
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Capacity
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256 GB
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Height
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2.23 - 3.58 mm (0.14 - 0.09 in)
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Width
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22 mm (0.87 in)
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Interface
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ACS-3, SATA 3.2
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Performance
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Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 460 MB/s
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Logical blocks
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500,118,192
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA Security; TCG Opal 2.0, DIPM; TRIM; DEVSLP
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256 GB PCIe-3x4 NVMe Solid State Drive
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Specifications
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Description
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Drive weight
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10 g (0.02 lb)
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Capacity
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256 GB
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Height
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2.23 - 3.58 mm (0.14 - 0.09 in)
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Width
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22 mm (0.87 in)
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Interface
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ACS-3, SATA 3.2
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Performance
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Maximum sequential read: up to 2,260 MB/s
Maximum sequential write: up to 1,260 MB/s
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Logical blocks
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500,118,192
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA Security, TRIM; L1.2
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512 GB M2 2280 TLC solid state drive
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Specifications
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Description
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Drive weight
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8.5 - 10 g (0.019 - 0.02 lb)
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Capacity
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512 GB
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Height
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2.3 mm (0.09 in)
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Width
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22 mm (0.87 in)
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Interface
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ATA-8, SATA 3.0
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Performance
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Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 500 MB/s
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Logical blocks
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1,000,215,216
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Operating temperature
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0° to 70° C (32° to 158° F) (ambient temperature)
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Security features
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ATA Security, DIPM; TRIM; DEVSLP
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Networking/communications
HP hs3110/3114 HSPA+ Intel mobile broadband module
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Specification
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Description
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Technology/operating bands
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HSPA+: 2100 (Band1), 1900 (Band 2), 1700 (Band 4), 850 (Band 5), 900 (Band 8) MHz
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 MHz (Band 5), 900 (Band 8) MHz
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Wireless protocol standards
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E-GPRS: Class B, multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9.
UMTS/WCDMA: 5, 6 and 7 UMTS Specification
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GPS
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Standalone, A-GPS
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GPS bands
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1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607 MHz
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Maximum data rates
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HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)
HSPA: 7.2 Mbps (Download), 5.76 Mbps (Upload)
E-GPRS: 296 Kbps (Download), 236.8 Kbps (Upload)
GPRS: 107 Kbps (Download), 85.6 Kbps (Upload)
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Maximum output power
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HSPA+: 24 dBm
E-GPRS 1800/1900: 26 dBm
E-GPRS 850/900: 27 dBm
GPRS 1800/1900: 30 dBm
GPRS 850/900: 33 dBm
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Maximum power consumption
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HSPA+: 1,100 mA (peak); 800 mA (average)
E-GPRS: 2,800 mA (peak); 700 mA (average)
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Form factor
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M.2, 3042-S3 Key B
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Weight
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6 g
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Dimensions (L x W x T)
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42 x 30 x 2.3 mm (1.65 x 1.18 x 0.09 in)
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HP lt4120 Qualcomm Snapdragon X5 LTE mobile broadband module
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Specification
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Description
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Technology/operating bands
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LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),
1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8),
700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 17 lower),
800 (Band 20), 700 (Band 28)
HSPA+: 2100 (Band1), 1900 (Band 2), 1700/2100 (Band 4), 850 (Band 5), 900 (Band 8) MHz
EV-DO: 850 (BC0), 1900 (BC1) MHz (Only work with Verizon)
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 MHz (Band 5), 900 (Band 8) MHz
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Wireless protocol standards
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3GPP release 10 LTE specification CAT.4, 20MHz BW
WCDMA R99, 3GPP release 5, 6, 7 and 8 UMTS specification
1xEVDO release 0, A and B.
E-GPRS: Class B, multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9.
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GPS
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Standalone, A-GPS (MS-A, MS-B and XTRA)
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GPS bands
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1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607 MHz
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Maximum data rates
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LTE: 150 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21 Mbps (Download), 5.76 Mbps (Upload)
CDMA 1xRTT: 153.6 Kbps (Download), 153.6 Kbps (Upload)
EVDO Rel.A: 3.1 Mbps (Download), 1.8 Mbps (Upload)
EVDO Rel.B: 14.7 Mbps (Download), 5.4 Mbps (Upload)
EDGE: 236.8 Kbps (Download), 236.8 Kbps (Upload)
GPRS: 85.6 Kbps (Download), 85.6 Kbps (Upload)
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Maximum output power
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LTE: 23 dBm
HSPA+: 23.5 dBm
1xRTT/EVDO: 24dBm
E-GPRS 1900/1800: 26 dBm
E-GPRS 850/900: 27 dBm
GPRS 1800/1900: 29.5 dBm
GPRS 850/900: 32/5 dBm
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Maximum power consumption
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LTE: 1,200 mA (peak); 900 mA (average)
HSPA+: 1,100 mA (peak); 800 mA (average)
1xRTT/EVDO: 1,000 mA (peak); 700 mA (average)
E-GPRS: 2,800 mA (peak); 500 mA (average)
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Form factor
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M.2, 3042-S3 Key B
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Weight
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6.2 g
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Dimensions (L x W x T)
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42 x 30 x 2.3 mm (1.65 x 1.18 x 0.09 in)
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Intel Dual Band Wireless-N 8260AC 802.11 a/b/g/n (2x2) WiFi + Bluetooth 4.2 Combo Adaptor (vPro)
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Specification
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Description
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Wireless LAN standards
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IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
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Interoperability
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Wi-Fi certified
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Frequency band
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802.11b/g/n (2.40 - 2.48 GHz)
note:
802.11a (4.9 - 4.95 GHz (Japan))
(5.15 - 5.25 GHz)
(5.25 - 5.35 GHz)
(5.47 - 5.725 GHz)
(5.825 - 5.850 GHz)
note: |
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Antenna structure
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2 transmit; 2 receive (2x2)
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Data rates
|
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
|
|
Modulation
|
Direct Sequence Spread Spectrum
CCK, BPSK, QPSK, 16-QAM, 64-QAM
|
|
Security
|
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
|
|
Form factor
|
PCI-Express M.2 MiniCard
|
|
Weight
|
Type 2230: 2.8g
or
Type 1630: 2g
|
|
Dimensions (L x W x T)
|
Type 2230: 2.3 x 22.0 x 30.0 mm
or
Type 1630: 2.3 x 16.0 x 30.0 mm
|
|
Sub-channels
|
Multinational support with frequency bands and channels compliant to local regulations
|
|
Network architecture
models
|
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
|
|
Roaming
|
IEEE 802.11 compliant roaming between band Access Points
|
|
Output power
|
802.11b : +16dBm minimum
802.11g : +14dBm minimum
802.11a : +14dBm minimum
802.11n HT20(2.4GHz) : +13dBm minimum
802.11n HT40(2.4GHz) : +13dBm minimum
802.11n HT20(5GHz) : +12dBm minimum
802.11n HT40(5GHz) : +12dBm minimum
|
|
Power consumption
|
Transmit: 2.0 Watts (max)
Receive: 1.6 Watts (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio off: 30 mW
|
|
Power management
|
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
|
|
Receiver sensitivity
|
802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum
802.11g, 54Mbps : -74dBm maximum
802.11a, 6Mbps : -86dBm maximum
802.11a, 54Mbps : -72dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
|
|
Antenna type
|
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO and Bluetooth communications
|
|
Operating voltage
|
3.3v +/- 9%
|
|
Temperature
|
Operating temperature
14° to 158° F (-10° to 70° C)
Non-operating temperature
-40° to 176° F (-40° to 80° C)
|
|
Humidity
|
Operating temperature
10% to 90% (non-condensing)
Non-operating temperature
5% to 95% (non-condensing)
|
|
Altitude
|
Operating temperature
3,048 m (0 to 10,000 ft)
Non-operating temperature
15,240 m (0 to 50,000 ft)
|
|
LED activity
|
LED Off - Radio OFF; Solid LED On - Radio ON
|
Intel Dual Band Wireless-N 8260AC 802.11 a/b/g/n (2x2) WiFi + Bluetooth 4.2 Combo Adaptor (non-vPro)
|
Specification
|
Description
|
|
Wireless LAN standards
|
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
|
|
Interoperability
|
Wi-Fi certified
|
|
Frequency band
|
802.11b/g/n (2.40 - 2.48 GHz)
note:
802.11a (4.9 - 4.95 GHz (Japan))
(5.15 - 5.25 GHz)
(5.25 - 5.35 GHz)
(5.47 - 5.725 GHz)
(5.825 - 5.850 GHz)
note: |
|
Antenna structure
|
2 transmit; 2 receive (2x2)
|
|
Data rates
|
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
|
|
Modulation
|
Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
|
|
Security
|
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
|
|
Form factor
|
PCI-Express M.2 MiniCard
|
|
Weight
|
3.1g
|
|
Dimensions (L x W x T)
|
0.134 x 1.06 x 1.18 in (3.4 x 26.8 x 30 mm)
|
|
Network architecture
models
|
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
|
|
Roaming
|
IEEE 802.11 compliant roaming between band Access Points
|
|
Output power
|
802.11b : +16dBm minimum
802.11g : +14dBm minimum
802.11a : +14dBm minimum
802.11n HT20(2.4GHz) : +13dBm minimum
802.11n HT40(2.4GHz) : +13dBm minimum
802.11n HT20(5GHz) : +12dBm minimum
802.11n HT40(5GHz) : +12dBm minimum
802.11ac 80MHz(5GHz) : +11dBm minimum
|
|
Power consumption
|
Transmit: 2.0 Watts (max)
Receive: 1.6 Watts (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
|
|
Power management
|
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
|
|
Receiver sensitivity
|
802.11g:-90 dBm (6 Mbps), -89 dBm (9 Mbps), -87 dBm (12 Mbps), -85 dBm (18 Mbps), -82 dBm (24 Mbps), -79 dBm (36 Mbps), -76 dBm (48 Mbps), -74 dBm (54 Mbps)
802.11b:-95 dBm (1 Mbps), -93 dBm (2 Mbps), -91 dBm (5.5 Mbps), -88 dBm (11 Mbps)
802.11g:-90 dBm (6 Mbps), -89 dBm (9 Mbps), -87 dBm (12 Mbps), -85 dBm (18 Mbps), -82 dBm (24 Mbps), -79 dBm (36 Mbps), -76 dBm (48 Mbps), -74 dBm (54 Mbps)
|
|
Antenna type
|
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO and Bluetooth communications
|
|
Operating voltage
|
3.3v +/- 9%
|
|
Temperature
|
Operating temperature
14° to 158° F (-10° to 70° C)
Non-operating temperature
-40° to 176° F (-40° to 80° C)
|
|
Humidity
|
Operating temperature
10% to 90% (non-condensing)
Non-operating temperature
5% to 95% (non-condensing)
|
|
Altitude
|
Operating temperature
3,048 m (0 to 10,000 ft)
Non-operating temperature
15,240 m (0 to 50,000 ft)
|
|
LED activity
|
LED Amber - Radio OFF; LED White - Radio ON
|
HP integrated module with Bluetooth 4.0+ EDR wireless technology
|
Specifications
|
Description
|
||||||||||||
|
Bluetooth specification
|
4.0+ EDR compliant
|
||||||||||||
|
Frequency band
|
2402 to 2480 MHz
|
||||||||||||
|
Number of available channels
|
79 (1 MHz) available channels
|
||||||||||||
|
Data rates and throughput
|
3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 Kbps, voice channel
Asynchronous Connection Less links 2178.1 Kbps/177.1 Kbps asymmetric or 1306.9 Kbps symmetric
|
||||||||||||
|
Transmit power
|
The Bluetooth component operates as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
|
||||||||||||
|
Receiver sensitivity
|
|
||||||||||||
|
Power consumption
|
Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
|
||||||||||||
|
Range
|
Up to 10 m (33 ft)
|
||||||||||||
|
Electrical interface
|
USB 2.0 compliant
|
||||||||||||
|
Bluetooth software supported
|
Full support of Bluetooth Security Provisions
|
||||||||||||
|
Power management
|
Microsoft Windows ACPI, and USB Bus Support
Self-configurable to optimize power conservation in all operating modes, including Standby, Hold, Park, and Sniff
|
||||||||||||
|
Security certifications
|
All necessary regulatory approvals for supported countries, including FCC (47 CFR) Part 15C, Section 15.247 and 15.249
|
||||||||||||
|
Power management
|
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
|
||||||||||||
|
Certifications
|
UL, CSA, and CE Mark
Serial Port Profile (SPP)
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)
Generic Object Exchange Profile (GOEP)
Object Push Profile (OPP)
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)
Personal Area Networking Profile (PAN)
Human Interface Device Profile (HID)
FAX Profile (FAX)
Basic Imaging Profile (BIP)
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
|
Intel Dual Band Wireless-AC 3160 802.11 ac (1x1) WiFi and Bluetooth 4.0 Combo Adapter (non-vPro) Wireless LAN Standards
|
Specification
|
Description
|
|
Wireless LAN standards
|
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
|
|
Interoperability
|
Wi-Fi certified
|
|
Frequency band
|
802.11b/g/n (2.402 - 2.482 GHz)
note:
802.11a (4.9 - 4.95 GHz (Japan))
(5.15 - 5.25 GHz)
(5.25 - 5.35 GHz)
(5.47 - 5.725 GHz)
(5.825 - 5.850 GHz)
note: |
|
Data rates
|
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
|
|
Modulation
|
Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
|
|
Security
|
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
|
|
Form factor
|
PCI-Express M.2 MiniCard
|
|
Weight
|
Type 2230: 2.8g
or
Type 1630: 2g
|
|
Dimensions (L x W x T)
|
Type 2230: 2.3 x 22.0 x 30.0 mm
or
Type 1630: 2.3 x 16.0 x 30.0 mm
|
|
Network architecture
models
|
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
|
|
Roaming
|
IEEE 802.11 compliant roaming between band Access Points
|
|
Output power
|
802.11b : +16dBm minimum
802.11g : +14dBm minimum
802.11a : +14dBm minimum
802.11n HT20(2.4GHz) : +13dBm minimum
802.11n HT40(2.4GHz) : +13dBm minimum
802.11n HT20(5GHz) : +12dBm minimum
802.11n HT40(5GHz) : +12dBm minimum
802.11ac 80MHz(5GHz) : +11dBm minimum
|
|
Power consumption
|
Transmit: 2.0 Watts (max)
Receive: 1.6 Watts (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
|
|
Power management
|
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
|
|
Receiver sensitivity
|
802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum
802.11g, 54Mbps : -74dBm maximum
802.11a, 6Mbps : -86dBm maximum
802.11a, 54Mbps : -72dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum
802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum
|
|
Antenna type
|
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO and Bluetooth communications
|
|
Operating voltage
|
3.3v +/- 9%
|
|
Temperature
|
Operating temperature
14° to 158° F (-10° to 70° C)
Non-operating temperature
-40° to 176° F (-40° to 80° C)
|
|
Humidity
|
Operating temperature
10% to 90% (non-condensing)
Non-operating temperature
5% to 95% (non-condensing)
|
|
Altitude
|
Operating temperature
3,048 m (0 to 10,000 ft)
Non-operating temperature
15,240 m (0 to 50,000 ft)
|
Intel I219-V Gigabit Network Connection
|
Specification
|
Description
|
|
Ethernet features
|
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023. Clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE(Energy Efficient Ethernet)
Jumbo Frame 9K
Auto MDI/MDIX Crossover cable detection
|
|
Power management
|
ACPI compliant - multiple power modes
Energy Detect Low Power Mode(Green Ethernet)
|
|
Performance
features
|
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
MACSec Offload (802.3ae)
Intel Non-vPro
iSCSI Boot
|
|
Manageability
|
Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
|
|
Interface
|
PCI Express 1.1 x1 to fully support ASPM L0s/L1 and CLKREQ
note: |
|
NIC Device Driver Name
|
Intel 82579LM/82579V Ethernet Network Connection
|
Intel I219-LM Gigabit Network Connection
|
Specification
|
Description
|
|
Ethernet features
|
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023. Clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE(Energy Efficient Ethernet)
Jumbo Frame 9K
Auto MDI/MDIX Crossover cable detection
|
|
Power management
|
ACPI compliant - multiple power modes
Energy Detect Low Power Mode(Green Ethernet)
|
|
Performance
features
|
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
MACSec Offload (802.3ae)
Intel vPro
iSCSI Boot
|
|
Manageability
|
Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
|
|
Interface
|
PCI Express 1.1 x1 to fully support ASPM L0s/L1 and CLKREQ
note: |
|
NIC Device Driver Name
|
Intel 82579LM/82579V Ethernet Network Connection
|
Near field communications controller
|
Specification
|
Description
|
||||||||||||
|
Dimensions (L x W x H)
|
Module 25 x 10 x 2 mm
(1) USB 3.0 Port
(1) USB Basic Type-C
DisplayPort
VGA
RJ-45 / Ethernet
Docking connector
Headphone/microphone Combo
AC port
|
||||||||||||
|
Chipset
|
NPC100
|
||||||||||||
|
System interface
|
IC
One NGFF slot (2280) for SSD
|
||||||||||||
|
NFC RF standards
|
ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
|
||||||||||||
|
NFC forum support
|
Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
|
||||||||||||
|
Reader (PCD-VCD) mode
|
ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
|
||||||||||||
|
Card emulation (PICC-VICC) mode
|
ISO/IEC 14443 B and B
note: MIFARE
FeliCa
|
||||||||||||
|
Frequency
|
13.56 MHz
|
||||||||||||
|
NFC modes supported
|
Reader/Writer Peer-to-Peer, Card Emulation
|
||||||||||||
|
Raw RF sata rates
|
106, 212, 424, 848 kbps
|
||||||||||||
|
Operating temperature
|
0° C to 70° C
|
||||||||||||
|
Humidity
|
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
|
||||||||||||
|
Supply operating voltage
|
2.97 to 5.5 V
|
||||||||||||
|
I/O Voltage
|
1.8 V or 3.3 V
|
||||||||||||
|
Power consumption
|
|
Audio/multimedia
|
Specifications
|
Description
|
|
Hardware
|
Implementation:
CX7501
Function key volume controls:
Volume up, volume down, and mute
Full duplex:
Yes
Line in/line out
Yes via dock
Headphone/microphone in:
Yes combo jack
Integrated microphone:
Yes, dual digital microphone array
|
|
Audio output quality
|
Frequency response:
20 Hz - 20 kHz
Signal to noise ratio:
> 85 dB
Total harmonic distortion:
0.01%
Noise floor
-110 dB
Play/record sampling rate:
8 kHz – 48 kHz
DAC:
16, 20, or 24-bit
ADC:
16 or 20-bit
|
|
Integrated stereo speakers
|
Power rating:
2 watts
Impedance:
4 ohms
|
Power
HP 45W Smart AC Adapter
|
Specifications
|
Description
|
|
Dimensions (H x W x D)
|
9.5 x 4 x 2.65 cm (3.74 x 1.57 x 1.04 in )
|
|
Weight
|
175 g (0.386 lb) max
|
|
Input
|
90 to 265 VAC
Input Efficiency:
87.74% at 11 5 VAC and 88.4% at 230 VAC
Input frequency range:
47 to 63 Hz
Input AC current:
1.4 A at 90 VAC
|
|
Output
|
Output power:
45 W
DC output:
9.50 V
Hold-up time:
5 msec at 115 VAC input
Output current limit:
< 8.0A
|
|
Connector
|
3 pin/grounded, mates with interchangeable cords
|
|
Environmental design
|
Operating
temperature:
0° to 35° C (32° to 95° F)
Non-operating (storage)
temperature:
-20° to 85° C (-4° to 185° F)
Altitude:
0 to 5,000 m (0 to 16,400 ft)
Humidity:
20% to 95%
Storage humidity:
10% to 95%
|
|
EMI and safety certifications
|
CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE
MTBF - over 200,000 hours at 25°C ambient condition
|
HP 65W Smart AC Adapter EM
|
Specifications
|
Description
|
|
Dimensions
|
12.65 x 5 x 3 cm (4.98 x 1.97 x 1.18 in )
|
|
Weight
|
290 g (0.62 lb)
|
|
Input
|
90 to 265 VAC
Input Efficiency:
87.74% at 11/230 VAC
Input frequency range:
47 to 63 Hz
Input AC current:
1.7 A at 90 VAC, 0.85 A at 180 VAC
|
|
Output
|
Output power:
65 W
DC output:
19.5 V
Hold-up time:
5 msec at 115 VAC input
Output current limit:
< 11A, over voltage protection -29 V max automatic shutdown
|
|
Connector
|
3 pin/grounded, mates with interchangeable cords
|
|
Environmental design
|
Operating
temperature:
0° to 35° C (32° to 95° F)
Non-operating (storage)
temperature:
-20° to 85° C (-4° to 185° F)
Altitude:
0 to 16,400 ft (0 to 3,048 m)
Humidity:
20% to 95%
Storage humidity:
10% to 95%
|
|
EMI and safety certifications
|
CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE
MTBF - over 200,000 hours at 25°C ambient condition
|
HP 3-cell Long Life Li-Ion (46.5 WHr)
|
Specifications
|
Description
|
|
Dimensions
|
8.30 x 127.5 x 160.25 mm
|
|
Weight
|
216.3 g, (0.48 lb) (ATL), 217.8 g, (0.48 lb) (COS)
|
|
Cells/type
|
ATL 505295, SDI 505295
|
|
Energy
|
Voltage:
11.4 V
Amp-hour capacity:
3910 mAh
Watt-hour capacity:
44.5 Wh
|
|
Temperature
|
Operating (Charging):
0° to 45° C (32° to 113° F)
Operating (Discharging):
-10° to 60° C (14° to 140° F)
Non-operating temperature:
-5° to 40° C (41° to 104° F)
|
|
Fuel gauge LED
|
NA
|
|
Warranty
|
1000 cycles >65% (at 23˚C)
|
|
Optional travel battery available
|
No
|
HP 3-cell Long Life Li-Ion (46.5 WHr)
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Specifications
|
Description
|
|
Dimensions
|
6.8mm x 102.8mm x 198 mm
|
|
Weight
|
216.3 g, (0.48 lb) (ATL), 217.8 g
|
|
Cells/type
|
ATL 506480, COSLIGHT 506480
|
|
Energy
|
Voltage:
11.4 V
Amp-hour capacity:
4080mAh
Watt-hour capacity:
46.5 Wh
|
|
Temperature
|
Operating (Charging):
0° to 45° C (32° to 113° F)
Operating (Discharging):
-10° to 60° C (14° to 140° F)
Non-operating temperature:
-5° to 40° C (41° to 104° F)
|
|
Fuel gauge LED
|
NA
|
|
Warranty
|
1000 cycles >65% (at 23˚C)
|
|
Optional travel battery available
|
No
|
Physical specifications
|
Specification
|
Description
|
|
Weight
|
Starting at 1.86 kg (4.10 lb)
|
|
Dimensions (W x D x H)
|
Non-touch
38.33 x 25.77 x 1.94 cm (15.09 x 10.1 x 0.76 in)
Touch
38.33 x 25.77 x 2.08 cm (15.09 x 10.1 x 0.82 in)
note: |
Software/OS
|
Specifications
|
Description
|
|
BIOS
|
HP BIOSphere
note: HP SureStart
HP DriveLock, HP Automatic DriveLock
HP BIOS protection
note: BIOS update via network
Master boot record security
Power on authentication
Pre-boot security
Secure erase
note: Hybrid boot
Measure boot
HP SpareKey
Pre-boot Authentication
|
|
Multimedia
|
Cyberlink Power DVD, BD
Cyberlink YouCam BE (Windows 7 only)
|
|
Communication
|
HP GPS and Location (Windows 7 only)
note: HP Connection Manager with support for HP Mobile Connect (Windows 7 only)
HP Mobile Connect Pro (Windows 8.1 & later)
note: Intel Wireless Display (WiDi) Software for Windows
Native Miracast support
note: |
|
HP value add software
|
HP 3D DriveGuard (requires Windows)
HP ePrint Driver
note: HP Hotkey
HP Recovery Manager
HP Recovery Disc Creator
HP Registration App (Windows 8.1 only)
HP Support Assistant
HP Noise Reduction Software
|
|
3rd Party
|
Foxit PhantomPDF Express for HP
|
|
Microsoft products
|
Buy Office
Bing search
Skype
note: |
|
Manageability
|
Preinstalled
Not preinstalled (available on manageability website)
|
|
Client security software
|
HP Security Manager
HP Drive Lock
HP Fingerprint Sensor
HP Password Manager
Absolute Persistence Module
note: Power On Authentication
Microsoft Security Essentials
note: Microsoft Defender
|
|
Security
|
Trusted Platform Module (TPM ) 1.2 Embedded Security Chip (Common Criteria EAL4+ Certified)
Upgradeable to TPM 2.0 (not available on Win 7 32-bit)
HP Fingerprint Reader (
|
note:HP Cloud Recovery download tool (Cloud Recovery Client) is available under Software and Drivers section on the support page.
Security
HP fingerprint reader (optional)
|
Specifications
|
Description
|
|
Mobile voltage operations
|
3.0 V-3.6 V
|
|
Operating temperature
|
-10° – 75° C (14° – 167° F)
|
|
Current consumption image
|
36 mA peak
|
|
Low latency wait for finger
|
950 uA
|
|
Capture rate
|
59000 lines/sec
|
|
ESD resistance
|
IEC 61000-4-2 4B (±15KV)
|
|
Detection matrix
|
200*1 (plus another secondary line)
508 dpi
10*1 mm sensor area
|
Smart card reader
|
Specifications
|
Description
|
|
Smart card standard
|
PC/SC 2.0 for Windows smart card standard
|
|
Dimensions (L x W x H)
|
10.5 x 2 x 8.2 mm (0.41x 0.08 x 0.32 in)
|
|
Smart card support
|
ISO 7816 Class A and AB smart cards
|
|
Smart card interface
|
Smart card interface with T = 0 and T = 1
Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442, SLE4436
SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via external EEPROM
|
|
Smart card interface
|
950 uA
|
|
Operating systems
|
No driver is required for this device. Native support is provided by the operating system.
|
|
Power
|
Normal mode:
With card present, before being suspended: 40.9 mA
Without card present, before being suspended: 33.16 mA
After being suspended with smart card present: 380 μA
After being suspended without smart card present: 380 μA
Power saving mode:
With card present, before being suspended: 40.6 mA
Without card present: 380 μA
After being suspended with smart card present: 380 μA
|
|
Features
|
Support single slot
Support T0, T1 protocol
Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442, SLE4436, SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via external EEPROM
Support ISO7816 Class A, B and C (5V/3V/1.8V) card
Implemented as an USB full speed device with bulk transfer endpoint, Mass
Storage endpoint
Built-in PLL for USB and smart card clocks requirement
Support EEPROM for USB descriptors customization (PID/VID/ iManufacturer/iProduct/Serial Number), Direct Web Page Link, and accessing memory card module.
EEPROM programmable via USB interface
Support software update for memory card module
Support Direct Web Page Link via configuration in external EEPROM
Support short APDU and extended APDU
Compatible with Microsoft USB-CCID driver
Support remote wake up through inserting card/removing card
Support USB selective suspend
Support power saving mode (Using one pin to select between Normal/PWR Saving Mode)
Support card power over current protection mechanism
Built in resonator
Support USB LPM (Link Power Management) features
Embedded clock source.
|
Warranty information
Terms of warranty apply to the individual model purchased. To see if your HP product is still in warranty, go to the HP Product Warranty Check page.
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