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HP t730 Thin Client PC Product Specifications

Product image

HP t730 Thin Client

Product features

Feature
Description
Operating systems
HP Smart Zero Core
HP ThinPro
Windows Embedded Standard 7P
Windows 10 IoT Enterprise for Thin Clients
Processor
AMD RX-427BB
Environmental
Operating temperature: 10° to 40° C (50° to 104° F)
Non-operating temperature: -30° to 60° C (-22° to 140° F)
Humidity (non-condensing): 10% to 90%

Graphics

AMD FirePro W2100 2 GB professional graphics

Feature
Description
Introduction
The AMD FirePro W2100 graphics board utilizes state-of-the-art professional GPU technologies to deliver outstanding professional 3D performance in a cost effective low profile package.
Performance and features
AMD Graphics Core Next (GCN) architecture designed to effortlessly balance GPU compute and 3D workloads efficiently
Optimized and certified for leading workstation ISV applications. The AMD FirePro professional graphics family is certified on more than 100 different applications for reliable performance.
AMD PowerTune and AMD ZeroCore Power technologies that allows for state-of-the-art dynamic power management of the GPU
Two (2) native display DisplayPort 1.2 outputs
PCI Express 3.0 compliant
Form factor
Low profile, half length
Graphics controller
AMD FirePro W2100 professional graphics based on Oland GPU
GPU: 320 Stream processors organized into 5 compute units
GPU frequency: 630 Mhz
Power: 26 W
Cooling: active
Bus type
PCI Express x8, Generation 3.0
Memory
2 GB DDR3
Bandwidth up to 28.8 GB/s
Width: 128 bit
Connectors
2 x DisplayPort 1.2
No video cables are provided. Several aftermarket kits are available
Maximum resolution
DisplayPort 1.2: up to 4096 x 2160 x 24 bpp at 60 Hz
Dual Link DVI-I: up to 2560 x 1600 x 32 bpp at 60 Hz (requires DP to DL DVI-I adapter)
Single Link DVI-I: up to 1920 x 1200 x 32 bpp at 60 Hz (requires DP to SL DVI-I adapter)
VGA: up to 1920 x 1200 x 32 bpp at 60 Hz (requires DP to VGA adapter)
Image quality features
Advanced support for 8-bit, 10-bit and 16-bit per RGB color component. High bandwidth scaler for high quality up and down scaling
Display output
Maximum of 2 displays supported
Shading architecture
Shader model 5.0
Supported graphics APIs
OpenCL 1.2, DirectX 11.2/12, OpenGL 4.4
OpenGL 4.4 support with driver release 14.301.xxx
OpenCL 1.2 conformance expected with drive release 14.301.xxx

Memory

Feature
Description
Type
Dual channel
DDR3L SDRAM
Data rate
Transfer rates up to 1,600 MT/s
Peak transfer rate
12,800 MB/s
Number of slots
2 x SODIMM
Available capacities
4 GB (1 x 4 GB)
8 GB (2 x 4 GB)
16 GB (2 x 8 GB)
Reserved for graphics
512 MB

Storage

Feature
Description
Type
NAND flash memory; non-volatile
Number of sockets
1 x M.2
Capacities
8 GB MLC (multi-level cell)
16 GB MLC
16 GB UMLC (ultra multi-level cell)
32 GB MLC
32 GB UMLC
64 GB MLC
128 GB MLC

Input/output

Feature
Description
Keyboard
USB or PS/2 (varies by region)
Mouse
USB or PS/2 (varies by region)
Printer
Local and/or network printers (RDP, ICA, LPD)
Display/monitor
All models include four (4) DisplayPort 1.2 digital video outputs supporting up to 4096 x 2160 resolution.
Models can be configured with an optional AMD FirePro W2100 discrete graphics solution that provides two (2) additional digital video streams for a system total of six (6) video outputs

Audio/video

Feature
Description
Audio subsystem
Internal amplified speaker system for basic audio playback
3.5 mm headset socket (front access)
3.5 mm headphone/microphone socket (front access)
3.5 mm line out socket (rear access)
3.5 mm line in socket (rear access)
Audio CODECs
MP3
AAC stereo
HE AAC
Includes hardware acceleration support
Video CODECs
MPEG-4 part 2 (DivX, Xvid)
MPEG-4 part 10 (H.264, AVC)
WMV 7/8/9 VC-1 & ASF Demuxer
Includes hardware acceleration support

Wi-Fi networking

Feature
Description
Adapter
Broadcom 802.11a/b/g/n
Intel 802.11a/b/g/n/ac

Fiber optic networking

Allied Telesis AT-27M2/SC Fiber Fast Ethernet Network Interface

Feature
Description
Adapter option
Allied Telesis AT-27M2/SC Fiber Fast Ethernet Network Interface
Form factor
M.2
Connector
SC; compliant with IEC 61754-4
Features
IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-Based Buffer Management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power; the PHY interface, Link detection and Link LED should be enabled by default at power-up
Performance
Receive: up to 85 Mbit/s
Utilization: 30% CPU
Transmit: up to 85 Mbit/s
Utilations: 30% CPU
Bi-directional: up to 170 Mbit/s total
Utilations: 30% CPU
External interface
Complies with IEEE 802.3 1000BASE-X operation
Power
Uses less than 1775 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1 and L2
Non-volatile storage
The MAC address is unique for each system; assigned from the board assembly manufacturer’s IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.

Allied Telesis AT-29M2/SC Fiber Gigabit Network Interface

Feature
Description
Adapter option
Allied Telesis AT-29M2/SC Fiber Gigabit Network Interface
Form factor
M.2
Connector
SC; compliant with IEC 61754-4
Features
IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-Based Buffer Management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power; the PHY interface, Link detection and Link LED should be enabled by default at power-up
Performance
Receive: up to 800 Mbit/s
Utilization: 30% CPU
Transmit: up to 800 Mbit/s
Utilations: 30% CPU
Bi-directional: up to 1500 Mbit/s total
Utilations: 30% CPU
External interface
Complies with IEEE 802.3 1000BASE-X operation
Power
Uses less than 2100 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1 and L2
Non-volatile storage
The MAC address is unique for each system; assigned from the board assembly manufacturer’s IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.

Allied Telesis AT-29M2/SC Fiber Gigabit Network Interface

Feature
Description
Adapter option
Allied Telesis AT-29M2/SC Fiber Gigabit Network Interface
Form factor
M.2
Connector
SC; compliant with IEC 61754-4
Features
IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-Based Buffer Management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power; the PHY interface, Link detection and Link LED should be enabled by default at power-up
Performance
Receive: up to 800 Mbit/s
Utilization: 30% CPU
Transmit: up to 800 Mbit/s
Utilations: 30% CPU
Bi-directional: up to 1500 Mbit/s total
Utilations: 30% CPU
External interface
Complies with IEEE 802.3 1000BASE-X operation
Power
Uses less than 2100 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1 and L2
Non-volatile storage
The MAC address is unique for each system; assigned from the board assembly manufacturer’s IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.

Physical specifications

Feature
Description
Weight
1.8 kg (3.9 lb)
Dimensions (W x D x H)
221 x 67 x 240 mm (8.7 x 2.6 x 9.4 in)

Hardware

Feature
Description
Security
Security lock slot (cable lock sold separately)
Built-in power cord retention clip
Networking
Realtek Gigabit Ethernet (RJ-45)
Wake on LAN (WOL)
PXE
TCP/IP with DNS and DHCP

Warranty information

Terms of warranty apply to the individual model purchased. To see if your HP product is still in warranty, go to the HP Product Warranty Check page.

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Country/Region: Flag United States

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