HP t730 Thin Client
Feature
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Description
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Operating systems
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HP Smart Zero Core
HP ThinPro
Windows Embedded Standard 7P
Windows 10 IoT Enterprise for Thin Clients
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Processor
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AMD RX-427BB
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Environmental
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Operating temperature: 10° to 40° C (50° to 104° F)
Non-operating temperature: -30° to 60° C (-22° to 140° F)
Humidity (non-condensing): 10% to 90%
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Feature
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Description
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Introduction
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The AMD FirePro W2100 graphics board utilizes state-of-the-art professional GPU technologies to deliver outstanding professional 3D performance in a cost effective low profile package.
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Performance and features
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AMD Graphics Core Next (GCN) architecture designed to effortlessly balance GPU compute and 3D workloads efficiently
Optimized and certified for leading workstation ISV applications. The AMD FirePro professional graphics family is certified on more than 100 different applications for reliable performance.
AMD PowerTune and AMD ZeroCore Power technologies that allows for state-of-the-art dynamic power management of the GPU
Two (2) native display DisplayPort 1.2 outputs
PCI Express 3.0 compliant
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Form factor
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Low profile, half length
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Graphics controller
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AMD FirePro W2100 professional graphics based on Oland GPU
GPU: 320 Stream processors organized into 5 compute units
GPU frequency: 630 Mhz
Power: 26 W
Cooling: active
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Bus type
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PCI Express x8, Generation 3.0
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Memory
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2 GB DDR3
Bandwidth up to 28.8 GB/s
Width: 128 bit
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Connectors
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2 x DisplayPort 1.2
No video cables are provided. Several aftermarket kits are available
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Maximum resolution
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DisplayPort 1.2: up to 4096 x 2160 x 24 bpp at 60 Hz
Dual Link DVI-I: up to 2560 x 1600 x 32 bpp at 60 Hz (requires DP to DL DVI-I adapter)
Single Link DVI-I: up to 1920 x 1200 x 32 bpp at 60 Hz (requires DP to SL DVI-I adapter)
VGA: up to 1920 x 1200 x 32 bpp at 60 Hz (requires DP to VGA adapter)
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Image quality features
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Advanced support for 8-bit, 10-bit and 16-bit per RGB color component. High bandwidth scaler for high quality up and down scaling
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Display output
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Maximum of 2 displays supported
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Shading architecture
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Shader model 5.0
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Supported graphics APIs
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OpenCL 1.2, DirectX 11.2/12, OpenGL 4.4
OpenGL 4.4 support with driver release 14.301.xxx
OpenCL 1.2 conformance expected with drive release 14.301.xxx
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Feature
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Description
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Type
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Dual channel
DDR3L SDRAM
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Data rate
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Transfer rates up to 1,600 MT/s
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Peak transfer rate
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12,800 MB/s
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Number of slots
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2 x SODIMM
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Available capacities
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4 GB (1 x 4 GB)
8 GB (2 x 4 GB)
16 GB (2 x 8 GB)
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Reserved for graphics
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512 MB
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Feature
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Description
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Type
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NAND flash memory; non-volatile
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Number of sockets
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1 x M.2
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Capacities
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8 GB MLC (multi-level cell)
16 GB MLC
16 GB UMLC (ultra multi-level cell)
32 GB MLC
32 GB UMLC
64 GB MLC
128 GB MLC
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Feature
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Description
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Keyboard
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USB or PS/2 (varies by region)
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Mouse
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USB or PS/2 (varies by region)
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Printer
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Local and/or network printers (RDP, ICA, LPD)
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Display/monitor
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All models include four (4) DisplayPort 1.2 digital video outputs supporting up to 4096 x 2160 resolution.
Models can be configured with an optional AMD FirePro W2100 discrete graphics solution that provides two (2) additional digital video streams for a system total of six (6) video outputs
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Feature
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Description
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Audio subsystem
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Internal amplified speaker system for basic audio playback
3.5 mm headset socket (front access)
3.5 mm headphone/microphone socket (front access)
3.5 mm line out socket (rear access)
3.5 mm line in socket (rear access)
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Audio CODECs
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MP3
AAC stereo
HE AAC
Includes hardware acceleration support
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Video CODECs
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MPEG-4 part 2 (DivX, Xvid)
MPEG-4 part 10 (H.264, AVC)
WMV 7/8/9 VC-1 & ASF Demuxer
Includes hardware acceleration support
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Feature
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Description
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Adapter
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Broadcom 802.11a/b/g/n
Intel 802.11a/b/g/n/ac
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Feature
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Description
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Adapter option
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Allied Telesis AT-27M2/SC Fiber Fast Ethernet Network Interface
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Form factor
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M.2
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Connector
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SC; compliant with IEC 61754-4
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Features
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IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-Based Buffer Management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power; the PHY interface, Link detection and Link LED should be enabled by default at power-up
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Performance
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Receive: up to 85 Mbit/s
Utilization: 30% CPU
Transmit: up to 85 Mbit/s
Utilations: 30% CPU
Bi-directional: up to 170 Mbit/s total
Utilations: 30% CPU
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External interface
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Complies with IEEE 802.3 1000BASE-X operation
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Power
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Uses less than 1775 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1 and L2
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Non-volatile storage
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The MAC address is unique for each system; assigned from the board assembly manufacturer’s IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.
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Feature
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Description
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Adapter option
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Allied Telesis AT-29M2/SC Fiber Gigabit Network Interface
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Form factor
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M.2
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Connector
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SC; compliant with IEC 61754-4
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Features
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IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-Based Buffer Management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power; the PHY interface, Link detection and Link LED should be enabled by default at power-up
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Performance
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Receive: up to 800 Mbit/s
Utilization: 30% CPU
Transmit: up to 800 Mbit/s
Utilations: 30% CPU
Bi-directional: up to 1500 Mbit/s total
Utilations: 30% CPU
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External interface
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Complies with IEEE 802.3 1000BASE-X operation
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Power
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Uses less than 2100 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1 and L2
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Non-volatile storage
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The MAC address is unique for each system; assigned from the board assembly manufacturer’s IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.
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Feature
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Description
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Adapter option
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Allied Telesis AT-29M2/SC Fiber Gigabit Network Interface
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Form factor
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M.2
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Connector
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SC; compliant with IEC 61754-4
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Features
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IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-Based Buffer Management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power; the PHY interface, Link detection and Link LED should be enabled by default at power-up
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Performance
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Receive: up to 800 Mbit/s
Utilization: 30% CPU
Transmit: up to 800 Mbit/s
Utilations: 30% CPU
Bi-directional: up to 1500 Mbit/s total
Utilations: 30% CPU
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External interface
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Complies with IEEE 802.3 1000BASE-X operation
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Power
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Uses less than 2100 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1 and L2
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Non-volatile storage
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The MAC address is unique for each system; assigned from the board assembly manufacturer’s IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.
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Feature
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Description
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Weight
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1.8 kg (3.9 lb)
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Dimensions (W x D x H)
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221 x 67 x 240 mm (8.7 x 2.6 x 9.4 in)
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Feature
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Description
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Security
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Security lock slot (cable lock sold separately)
Built-in power cord retention clip
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Networking
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Realtek Gigabit Ethernet (RJ-45)
Wake on LAN (WOL)
PXE
TCP/IP with DNS and DHCP
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