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HP EliteBook 850 G3 and 750 G3 Notebook PCs Product Specifications

Product image
Product features
Ports and slots
Displays
Storage and drives
Networking/communications
Audio/multimedia
Power
Physical specifications
Software/OS
Security
Warranty information

Product image

HP EliteBook 850 G3 Notebook PC

Product features

Feature
Description
Operating system
Preinstalled
Windows 10 Pro 64
Windows 10 Home 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 64
Windows 7 Professional 32
FreeDOS 2.0
NeoKylin Linux 64
Web supported
Windows 10 Pro 64
Windows 10 Home 641
Windows 10 Enterprise 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 8.1 Enterprise 64
Windows 7 Professional 64
Windows 7 Professional 32
Windows 7 Enterprise 64
Windows 7 Enterprise 32
note:
Not all features are available in all editions and versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers and/or software to take full advantage of Windows functionality.
Processor
Intel Core i7-6600U (2.6 GHz, up to 3.4 GHz with Intel Turbo Boost Technology, 4 MB cache, 2 cores)
Intel Core i7-6500U (2.5 GHz, up to 3.1 GHz with Intel Turbo Boost Technology, 4 MB cache, 2 cores)
Intel Core i5-6300U (2.4 GHz, up to 3 GHz with Intel Turbo Boost Technology, 3 MB cache, 2 cores)
Intel Core i5-6200U (2.3 GHz, up to 2.8 GHz with Intel Turbo Boost Technology, 3 MB cache, 2 cores)
Intel Core i3-6100U (2.3 GHz, 3 MB cache, 2 cores)
note:
Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
Chipset
Chipset is integrated with processor
Graphics
Integrated
Intel HD Graphics 520
Discrete
AMD Radeon R7 M365X
1GB GDDR5 dedicated
Display
Non-Touch
15.6 diagonal LED backlight HD Slim eDP SVA Anti-glare (1366 x 768)
15.6 diagonal LED backlight HD Slim eDP SVA Anti-glare (1366 x 768) with camera
15.6 diagonal LED backlight FHD Slim eDP SVA Anti-glare (1920 x 1080)
15.6 diagonal LED backlight FHD Slim eDP SVA Anti-glare (1920 x 1080) with camera
15.6 diagonal LED backlight UHD Slim eDP UWVA Anti-glare (3840 x 2160)
15.6 diagonal LED backlight UHD Slim eDP UWVA Anti-glare (3840x 2160) with camera
Touch
15.6 diagonal LED backlight FHD Slim eDP SVA (1920 x 1080) Touch with camera
Storage and drives
Primary storage SATA, 2.5 in hard drives
500 GB 7200rpm self encrypting drive (FIPS-140-2) (Opal 2)
500 GB 7200rpm hard drive
500 GB 7200rpm self-encrypting drive (Opal 2)
1 TB 5400rpm hard drive
500 GB hybrid, 8 GB cache
Mini Card Solid State Drive
M.2 (NGFF) 2280 solid State Drive
128 GB SATA-3 TLC solid State Drive
180 GB SATA-3 MLC solid State Drive
180 GB SATA-3 self-encrypting (Opal 2) MLC solid state drive
240 GB SATA-3 MLC solid state drive
256 GB SATA-3 TLC solid state drive
256 GB SATA-3 self-encrypting (Opal 2) MLC solid state drive
256 GB PCIe-3x4 NVMe solid state drive
512 GB SATA-3 TLC solid state drive
HP 3D DriveGuard (Windows and Hard Drives only)
The hard drive is mounted directly to the notebook frame, reducing the transmission of shock to the hard drive.
note:
For solid state drives or hard drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 16 GB (for Windows 7) and up to 30 GB (for Windows 8.1 and 10) is reserved for system recovery software.
Memory
Standard
DDR4 PC4-17000 (Transfer rates up to 2133 MT/s)
Two SODIMM slots supporting dual-channel memory
Both slots are customer accessible/upgradeable
Supports
4096 MB total system memory (4096 MB x 1)
8192 MB total system memory (4096 MB x 2)
8192 MB total system memory (8192 MB x 1)
16384 MB total system memory (8192 MB x 2)
Maximum
Up to 16 GB
Dual-channel
Maximized dual-channel performance requires SODIMMs of the same size and speed in both memory slots.
note:
Improved system performance when memory is added in pairs (dual channel). Due to the non-industry standard nature of some third-party memory modules, we recommend HP branded memory to ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.
Networking / communications
Broadband Wireless (WWAN)
HP lt4120 Qualcomm SnapdragonT X5 LTE Mobile Broadband Module
HP hs3110 HSPA+ Intel Mobile Broadband Module
Wireless LAN (WLAN) Via M.2 MiniCard
Intel Dual Band Wireless-AC 8260 802.11 a/b/g/n/ac (2x2) WiFi and Bluetooth 4.2 combo (vPro)
Intel Dual Band Wireless-AC 8260 802.11 a/b/g/n/ac (2x2) WiFi and Bluetooth 4.2 combo (non-vPro)
Intel Wireless-AC 3165 802.11 a/b/g/n/ac (1x1) WiFi and Bluetooth 4.0 combo (vPro)
Near Field Communication (NFC)1
HP Module with NXP NFC Controller NPC100
Support for Miracast
note:
Wireless access point and Internet service is required and is not included. Availability of public wireless access points limited.
Communications
Intel Ethernet Connection I219-V 10/100/1000 Ethernet (with Intel i3-6100U, i5-6200U, and i7-6500U)
Intel Ethernet Connection I219-LM 10/100/1000 Ethernet (with Intel i5-6300U and i7-6600U)
note:
The term "10/100/1000" or "Gigabit" Ethernet indicates compatibility with IEEE standard 802.3ab for Gigabit Ethernet, and does not connote actual operating speed of 1 Gb/s. For high-speed transmission, connection to a Gigabit Ethernet server and network infrastructure is required.
Audio / multimedia
Audio
Audio by Bang & Olufsen
HP Clear Sound amp
HP noise reduction software
Digital microphones (Dual Array)
2 premium stereo speakers
Webcam
Optional 720 p webcam
Keyboards / pointing devices / buttons
The HP spill-resistant keyboard is designed using a thin layer of Mylar film under the keyboard and includes an all-metal keyboard deck for greater rigidity. The 101/102-key compatible keyboard features a full-pitch key layout with desktop keyboard features, such as editing keys, both left and right control and alt keys, and function keys. US and International key layouts are available. Backlit keyboard with HP DuraKeys available as an option.
Pointing Device
Glass touchpad
On/off button
Taps enabled as default
Gestures enabled by default - 2 finger scrolling, 2 finger zoom (pinch)
Buttons and Function Keys
F1 - Sleep
F2 - Blank
F3 - Backlit Toggle
F4 - Display Switching
F5 - Brightness Down
F6 - Brightness Up
F7 - Blank
F8 - Volume Down
F9 - Volume Up
F10 - Mic Mute
F11 - Blank
F12 - Blank

Ports and slots

Specification
Description
Ports and slots
USB 3.0 charging port
USB 3.0 port
USB Basic Type-C
Display Port
VGA
RJ-45 / Ethernet
Docking connector
Headphone/microphone combo
AC port
Slots
External Micro SIM slot
SD Media Reader Slot Supports SD, SDHC, SDXC

Displays

Specification
Description
15.6 diagonal LED backlight HD Slim eDP SVA Anti-glare (1366 x 768)
Outline dimensions: 360 x 224.3 x 3.2 mm (14.7 x 8.8 x 0.13 in)
Active area: 344.2 x 193.5 mm (13.6 x 7.6 in)
Weight: 370 g
Diagonal size: 15.6 in
Surface treatment: AG
Contrast ratio: 300:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 220 nits
Pixel resolution:
Configuration: RGB stripe
Interface: eDP 1.2 (1 lane)
LCD Mode: TN
PPI: 101
Viewing angle: SVA 40/40/15/30
15.6 diagonal LED backlight FHD Slim eDP SVA Anti-glare (1920 x 1080)
Outline dimensions: 360 x 224.3 x 3.2 mm (14.7 x 8.8 x 0.13 in)
Active area: 344.2 x 193.5 mm (13.6 x 7.6 in)
Weight: 360 g
Diagonal size: 15.6 in
Surface treatment: AG
Contrast ratio: 400:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 300 nits
Pixel resolution:
Configuration: RGB stripe
Interface: eDP 1.2 (1 lane)
LCD Mode: TN
PPI: 142
Viewing angle: SVA 45/45/25/35
15.6 diagonal LED backlight UHD Slim eDP UWVA Anti-glare (3840 x 2160)
Outline dimensions: 13.62 x 7.59 (in) (3.6 x 19.4 cm)
Weight: 345 g
Diagonal size: 15.6 in
Surface treatment: AG
Contrast ratio: 1000:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 340 nits.
Pixel resolution:
Format: 3840 x 2160
Configuration: RGB stripe
PPI: 282
Viewing angle: UWVA 80/80/80/80
15.6 diagonal LED backlight FHD Slim eDP SVA (1920 x 1080) Touch with Camera
Outline dimensions: 360 x 224.3 x 3.2 mm (14.7 x 8.8 x 0.13 in)
Active area: 344.2 x 193.5 mm (13.6 x 7.6 in)
Weight: 360 g
Diagonal size: 15.6 in
Surface treatment: AG/BV
Contrast ratio: 500:1 (typ) - AG
Refresh rate: 60 Hz
Brightness: 300 nits.
Pixel resolution:
Format: 1920 x 1080 (FHD)
Configuration: RGB stripe
Interface: eDP 1.2 (2 lane)
LCD Mode: TN
PPI: 142
Viewing angle: SVA 45/45/25/35

Storage and drives

500 GB 7200 rpm self encrypting drive (FIPS-140-2) (Opal 2)

Specifications
Description
Drive weight
95 g (0.21 lb)
Capacity
500 GB
Height
7 mm (0.28 in)
Width
69.85 mm (2.75 in)
Interface
ATA-8, SATA 3.0
Transfer rate
Synchronous: 600 MB/s
Seek time
Single track: 1.5 ms
Average: 12 ms
Maximum: 18-22 ms
Cache
32 GB
Rotational speed
7200 rpm
Logical blocks
976,773,168
Operating temperature
0° to 60° C (32° to 140° F) (case temperature)
Features
ATA security; TCG Opal 2.x, FIPS, S.M.A.R.T., NCQ, Ultra DMA

500 GB 7200 rpm hard drive

Specifications
Description
Drive weight
92-95 g (0.2 - 0.21 lb)
Capacity
500 GB
Height
7 mm (0.28 in)
Width
70 mm (2.75 in)
Interface
ATA-8, SATA 2.6, 3.0 Gb/s, NCQ
Transfer rate
Synchronous: 600 MB/s
Seek time
Single track: 1.5 - 2 ms
Average: 11 - 13 ms
Maximum: 18 - 22 ms
Rotational speed
7200 rpm
Cache
32 GB
Logical blocks
976,773,168
Operating temperature
0° to 60° C (32° to 140° F) (case temperature)
Features
ATA security

500 GB 7200 rpm self-encrypting drive (Opal 2)

Specifications
Description
Drive weight
95 g (0.21 lb)
Capacity
500 GB
Height
7 mm (0.28 in)
Width
70 mm (2.75 in)
Interface
ATA-8, SATA 3.0
Transfer rate
Synchronous: 600 MB/s
Seek time
Single track: 1.5 ms
Average: 12 ms
Maximum: 18 - 22 ms
Rotational speed
7200 rpm
Cache
32 GB
Logical blocks
976,773,168
Operating temperature
0° to 60° C (32° to 140° F) (case temperature)
Features
ATA security; TCG Opal 2.x, FIPS, S.M.A.R.T., NCQ, Ultra DMA

1 TB 5400 rpm hard drive

Specifications
Description
Drive weight
94 - 99 g (0.21 lb)
Capacity
1 TB
Height
7 mm (0.28 in)
Width
70 mm (2.75 in)
Interface
ATA-8, SATA 3.0
Transfer rate
Synchronous: 600 MB/s
Seek time
Single track: 2 ms
Average: 12 - 13 ms
Maximum: 18 - 23 ms
Rotational speed
5400 rpm
Cache
Up to 32 GB
Logical blocks
976,773,168
Operating temperature
0° to 60° C (32° to 140° F) (case temperature)
Features
S.M.A.R.T., NCQ, Ultra DMA

500 GB hybrid, 8 GB cache

Specifications
Description
Drive weight
95 g (0.21 lbs)
Capacity
500 GB
Height
7 mm (0.28 in)
Width
70.1 mm (2.76 in)
Interface
ATA-8, SATA 2.6, 6.0 Gb/s, NCQ
Transfer rate
Synchronous: 600 MB/s
Seek time
Single track: 2 ms
Average: 12 ms
Maximum: NIL ms
Rotational speed
5400 rpm
Cache
64 GB
Logical blocks
976,773,168
Operating temperature
0° to 60° C (32° to 140° F) (case temperature)
Features
ATA security

128 GB 2280 M2 SATA-3 solid state drive

Specifications
Description
Drive weight
8.5 - 10 g (0.019 - 0.022 lb)
Capacity
128 GB
Height
2.23 - 3.58 mm (0.09 - 0.14 in)
Width
22 mm (0.87 in)
Interface
ATA-8, SATA 3.0
Performance
Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 300 MB/s
Logical blocks
250,069,680
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA security, DIPM; TRIM; DEVSLP

180 GB M2 2280 SATA-3 MLC solid state drive

Specifications
Description
Drive weight
< 10 g (0.022 lb)
Capacity
180 GB
Height
2.23 mm (0.09 in)
Width
22 mm (0.87 in)
Interface
ATA-8, SATA 3.0
Performance
Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 490 MB/s
Logical blocks
351,651,888
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA security, DIPM; TRIM; DEVSLP

180 GB M2 2280 SATA-3 self-encrypting drive (Opal 2) MLC solid state drive

Specifications
Description
Drive weight
< 10 g (0.022 lb)
Capacity
180 GB
Height
2.23 mm (0.09 in)
Width
22 mm (0.87 in)
Interface
ATA-8, SATA 3.0
Performance
Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 490 MB/s
Logical blocks
351,651,888
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA security, TCG OPAL 2.x, DIPM; TRIM; DEVSLP

240 GB 2280 SATA-3 MLC Solid State Drive

Specifications
Description
Drive weight
8.5 - 10 g (0.019 lb)
Capacity
256 GB
Height
2.3 - 3.58 mm (0.09 - 0.14 in)
Width
22 mm (0.87 in)
Interface
ATA-8, SATA 3.0
Performance
Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 455 MB/s
Logical blocks
500,118,192
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA Security, DIPM; TRIM; DEVSLP

256 GB 2280 SATA-3 TLC Solid State Drive

Specifications
Description
Drive weight
10 g (0.02 lb)
Capacity
240 GB
Height
2.23 - 3.58 mm (0.14 - 0.09 in)
Width
22 mm (0.87 in)
Interface
ACS-3, SATA 3.2
Performance
Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 490 MB/s
Logical blocks
468,862,128
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA Security; DIPM; TRIM; DEVSLP

256 GB M2 2280 SATA-3 Self-Encrypting Drive (Opal 2) MLC Solid State Drive

Specifications
Description
Drive weight
10 g (0.02 lb)
Capacity
256 GB
Height
2.23 - 3.58 mm (0.14 - 0.09 in)
Width
22 mm (0.87 in)
Interface
ACS-3, SATA 3.2
Performance
Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 460 MB/s
Logical blocks
500,118,192
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA Security; TCG Opal 2.0, DIPM; TRIM; DEVSLP

256 GB PCIe-3x4 NVMe Solid State Drive

Specifications
Description
Drive weight
10 g (0.02 lb)
Capacity
256 GB
Height
2.23 - 3.58 mm (0.14 - 0.09 in)
Width
22 mm (0.87 in)
Interface
ACS-3, SATA 3.2
Performance
Maximum sequential read: up to 2,260 MB/s
Maximum sequential write: up to 1,260 MB/s
Logical blocks
500,118,192
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA Security, TRIM; L1.2

512 GB M2 2280 TLC solid state drive

Specifications
Description
Drive weight
8.5 - 10 g (0.019 - 0.02 lb)
Capacity
512 GB
Height
2.3 mm (0.09 in)
Width
22 mm (0.87 in)
Interface
ATA-8, SATA 3.0
Performance
Maximum sequential read: up to 540 MB/s
Maximum sequential write: up to 500 MB/s
Logical blocks
1,000,215,216
Operating temperature
0° to 70° C (32° to 158° F) (ambient temperature)
Security features
ATA Security, DIPM; TRIM; DEVSLP

Networking/communications

HP hs3110/3114 HSPA+ Intel mobile broadband module

Specification
Description
Technology/operating bands
HSPA+: 2100 (Band1), 1900 (Band 2), 1700 (Band 4), 850 (Band 5), 900 (Band 8) MHz
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 MHz (Band 5), 900 (Band 8) MHz
Wireless protocol standards
E-GPRS: Class B, multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9.
UMTS/WCDMA: 5, 6 and 7 UMTS Specification
GPS
Standalone, A-GPS
GPS bands
1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607 MHz
Maximum data rates
HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)
HSPA: 7.2 Mbps (Download), 5.76 Mbps (Upload)
E-GPRS: 296 Kbps (Download), 236.8 Kbps (Upload)
GPRS: 107 Kbps (Download), 85.6 Kbps (Upload)
Maximum output power
HSPA+: 24 dBm
E-GPRS 1800/1900: 26 dBm
E-GPRS 850/900: 27 dBm
GPRS 1800/1900: 30 dBm
GPRS 850/900: 33 dBm
Maximum power consumption
HSPA+: 1,100 mA (peak); 800 mA (average)
E-GPRS: 2,800 mA (peak); 700 mA (average)
Form factor
M.2, 3042-S3 Key B
Weight
6 g
Dimensions (L x W x T)
42 x 30 x 2.3 mm (1.65 x 1.18 x 0.09 in)

HP lt4120 Qualcomm Snapdragon X5 LTE mobile broadband module

Specification
Description
Technology/operating bands
LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3), 1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8), 700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 17 lower), 800 (Band 20), 700 (Band 28)
HSPA+: 2100 (Band1), 1900 (Band 2), 1700/2100 (Band 4), 850 (Band 5), 900 (Band 8) MHz
EV-DO: 850 (BC0), 1900 (BC1) MHz (Only work with Verizon)
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 MHz (Band 5), 900 (Band 8) MHz
Wireless protocol standards
3GPP release 10 LTE specification CAT.4, 20MHz BW WCDMA R99, 3GPP release 5, 6, 7 and 8 UMTS specification
1xEVDO release 0, A and B.
E-GPRS: Class B, multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9.
GPS
Standalone, A-GPS (MS-A, MS-B and XTRA)
GPS bands
1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607 MHz
Maximum data rates
LTE: 150 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21 Mbps (Download), 5.76 Mbps (Upload)
CDMA 1xRTT: 153.6 Kbps (Download), 153.6 Kbps (Upload)
EVDO Rel.A: 3.1 Mbps (Download), 1.8 Mbps (Upload)
EVDO Rel.B: 14.7 Mbps (Download), 5.4 Mbps (Upload)
EDGE: 236.8 Kbps (Download), 236.8 Kbps (Upload)
GPRS: 85.6 Kbps (Download), 85.6 Kbps (Upload)
Maximum output power
LTE: 23 dBm
HSPA+: 23.5 dBm
1xRTT/EVDO: 24dBm
E-GPRS 1900/1800: 26 dBm
E-GPRS 850/900: 27 dBm
GPRS 1800/1900: 29.5 dBm
GPRS 850/900: 32/5 dBm
Maximum power consumption
LTE: 1,200 mA (peak); 900 mA (average)
HSPA+: 1,100 mA (peak); 800 mA (average)
1xRTT/EVDO: 1,000 mA (peak); 700 mA (average)
E-GPRS: 2,800 mA (peak); 500 mA (average)
Form factor
M.2, 3042-S3 Key B
Weight
6.2 g
Dimensions (L x W x T)
42 x 30 x 2.3 mm (1.65 x 1.18 x 0.09 in)

Intel Dual Band Wireless-N 8260AC 802.11 a/b/g/n (2x2) WiFi + Bluetooth 4.2 Combo Adaptor (vPro)

Specification
Description
Wireless LAN standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Interoperability
Wi-Fi certified
Frequency band
802.11b/g/n (2.40 - 2.48 GHz)
note:
The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
802.11a (4.9 - 4.95 GHz (Japan)) (5.15 - 5.25 GHz) (5.25 - 5.35 GHz) (5.47 - 5.725 GHz) (5.825 - 5.850 GHz)
note:
Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)
Antenna structure
2 transmit; 2 receive (2x2)
Data rates
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
Modulation
Direct Sequence Spread Spectrum
CCK, BPSK, QPSK, 16-QAM, 64-QAM
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
Form factor
PCI-Express M.2 MiniCard
Weight
Type 2230: 2.8g or Type 1630: 2g
Dimensions (L x W x T)
Type 2230: 2.3 x 22.0 x 30.0 mm or Type 1630: 2.3 x 16.0 x 30.0 mm
Sub-channels
Multinational support with frequency bands and channels compliant to local regulations
Network architecture models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between band Access Points
Output power
802.11b : +16dBm minimum
802.11g : +14dBm minimum
802.11a : +14dBm minimum
802.11n HT20(2.4GHz) : +13dBm minimum
802.11n HT40(2.4GHz) : +13dBm minimum
802.11n HT20(5GHz) : +12dBm minimum
802.11n HT40(5GHz) : +12dBm minimum
Power consumption
Transmit: 2.0 Watts (max)
Receive: 1.6 Watts (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio off: 30 mW
Power management
ACPI and PCI Express compliant power management 802.11 compliant power saving mode
Receiver sensitivity
802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum
802.11g, 54Mbps : -74dBm maximum
802.11a, 6Mbps : -86dBm maximum
802.11a, 54Mbps : -72dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO and Bluetooth communications
Operating voltage
3.3v +/- 9%
Temperature
Operating temperature
14° to 158° F (-10° to 70° C)
Non-operating temperature
-40° to 176° F (-40° to 80° C)
Humidity
Operating temperature
10% to 90% (non-condensing)
Non-operating temperature
5% to 95% (non-condensing)
Altitude
Operating temperature
3,048 m (0 to 10,000 ft)
Non-operating temperature
15,240 m (0 to 50,000 ft)
LED activity
LED Off - Radio OFF; Solid LED On - Radio ON

Intel Dual Band Wireless-N 8260AC 802.11 a/b/g/n (2x2) WiFi + Bluetooth 4.2 Combo Adaptor (non-vPro)

Specification
Description
Wireless LAN standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability
Wi-Fi certified
Frequency band
802.11b/g/n (2.40 - 2.48 GHz)
note:
The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
802.11a (4.9 - 4.95 GHz (Japan)) (5.15 - 5.25 GHz) (5.25 - 5.35 GHz) (5.47 - 5.725 GHz) (5.825 - 5.850 GHz)
note:
Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)
Antenna structure
2 transmit; 2 receive (2x2)
Data rates
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
Form factor
PCI-Express M.2 MiniCard
Weight
3.1g
Dimensions (L x W x T)
0.134 x 1.06 x 1.18 in (3.4 x 26.8 x 30 mm)
Network architecture models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between band Access Points
Output power
802.11b : +16dBm minimum
802.11g : +14dBm minimum
802.11a : +14dBm minimum
802.11n HT20(2.4GHz) : +13dBm minimum
802.11n HT40(2.4GHz) : +13dBm minimum
802.11n HT20(5GHz) : +12dBm minimum
802.11n HT40(5GHz) : +12dBm minimum
802.11ac 80MHz(5GHz) : +11dBm minimum
Power consumption
Transmit: 2.0 Watts (max)
Receive: 1.6 Watts (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power management
ACPI and PCI Express compliant power management 802.11 compliant power saving mode
Receiver sensitivity
802.11g:-90 dBm (6 Mbps), -89 dBm (9 Mbps), -87 dBm (12 Mbps), -85 dBm (18 Mbps), -82 dBm (24 Mbps), -79 dBm (36 Mbps), -76 dBm (48 Mbps), -74 dBm (54 Mbps)
802.11b:-95 dBm (1 Mbps), -93 dBm (2 Mbps), -91 dBm (5.5 Mbps), -88 dBm (11 Mbps)
802.11g:-90 dBm (6 Mbps), -89 dBm (9 Mbps), -87 dBm (12 Mbps), -85 dBm (18 Mbps), -82 dBm (24 Mbps), -79 dBm (36 Mbps), -76 dBm (48 Mbps), -74 dBm (54 Mbps)
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO and Bluetooth communications
Operating voltage
3.3v +/- 9%
Temperature
Operating temperature
14° to 158° F (-10° to 70° C)
Non-operating temperature
-40° to 176° F (-40° to 80° C)
Humidity
Operating temperature
10% to 90% (non-condensing)
Non-operating temperature
5% to 95% (non-condensing)
Altitude
Operating temperature
3,048 m (0 to 10,000 ft)
Non-operating temperature
15,240 m (0 to 50,000 ft)
LED activity
LED Amber - Radio OFF; LED White - Radio ON

HP integrated module with Bluetooth 4.0+ EDR wireless technology

Specifications
Description
Bluetooth specification
4.0+ EDR compliant
Frequency band
2402 to 2480 MHz
Number of available channels
79 (1 MHz) available channels
Data rates and throughput
3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 Kbps, voice channel
Asynchronous Connection Less links 2178.1 Kbps/177.1 Kbps asymmetric or 1306.9 Kbps symmetric
Transmit power
The Bluetooth component operates as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Receiver sensitivity
Modulation
0.01% BER
0.001% BER
GFSK
-80 dBm
-70 dBm
π/4-DQPSK
-80 dBm
-70 dBm
8DPSK
-80 dBm
-70 dBm
Power consumption
Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range
Up to 10 m (33 ft)
Electrical interface
USB 2.0 compliant
Bluetooth software supported
Full support of Bluetooth Security Provisions
Power management
Microsoft Windows ACPI, and USB Bus Support
Self-configurable to optimize power conservation in all operating modes, including Standby, Hold, Park, and Sniff
Security certifications
All necessary regulatory approvals for supported countries, including FCC (47 CFR) Part 15C, Section 15.247 and 15.249
Power management
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
Certifications
UL, CSA, and CE Mark
Serial Port Profile (SPP)
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)
Generic Object Exchange Profile (GOEP)
Object Push Profile (OPP)
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)
Personal Area Networking Profile (PAN)
Human Interface Device Profile (HID)
FAX Profile (FAX)
Basic Imaging Profile (BIP)
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)

Intel Dual Band Wireless-AC 3160 802.11 ac (1x1) WiFi and Bluetooth 4.0 Combo Adapter (non-vPro) Wireless LAN Standards

Specification
Description
Wireless LAN standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability
Wi-Fi certified
Frequency band
802.11b/g/n (2.402 - 2.482 GHz)
note:
The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
802.11a (4.9 - 4.95 GHz (Japan)) (5.15 - 5.25 GHz) (5.25 - 5.35 GHz) (5.47 - 5.725 GHz) (5.825 - 5.850 GHz)
note:
Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)
Data rates
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
Form factor
PCI-Express M.2 MiniCard
Weight
Type 2230: 2.8g or Type 1630: 2g
Dimensions (L x W x T)
Type 2230: 2.3 x 22.0 x 30.0 mm or Type 1630: 2.3 x 16.0 x 30.0 mm
Network architecture models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between band Access Points
Output power
802.11b : +16dBm minimum
802.11g : +14dBm minimum
802.11a : +14dBm minimum
802.11n HT20(2.4GHz) : +13dBm minimum
802.11n HT40(2.4GHz) : +13dBm minimum
802.11n HT20(5GHz) : +12dBm minimum
802.11n HT40(5GHz) : +12dBm minimum
802.11ac 80MHz(5GHz) : +11dBm minimum
Power consumption
Transmit: 2.0 Watts (max)
Receive: 1.6 Watts (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power management
ACPI and PCI Express compliant power management 802.11 compliant power saving mode
Receiver sensitivity
802.11b, 1Mbps : -94dBm maximum
802.11b, 11Mbps : -86dBm maximum
802.11g, 6Mbps : -88dBm maximum
802.11g, 54Mbps : -74dBm maximum
802.11a, 6Mbps : -86dBm maximum
802.11a, 54Mbps : -72dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum
802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO and Bluetooth communications
Operating voltage
3.3v +/- 9%
Temperature
Operating temperature
14° to 158° F (-10° to 70° C)
Non-operating temperature
-40° to 176° F (-40° to 80° C)
Humidity
Operating temperature
10% to 90% (non-condensing)
Non-operating temperature
5% to 95% (non-condensing)
Altitude
Operating temperature
3,048 m (0 to 10,000 ft)
Non-operating temperature
15,240 m (0 to 50,000 ft)

Intel I219-V Gigabit Network Connection

Specification
Description
Ethernet features
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023. Clauses 40)
Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE(Energy Efficient Ethernet)
Jumbo Frame 9K
Auto MDI/MDIX Crossover cable detection
Power management
ACPI compliant - multiple power modes
Energy Detect Low Power Mode(Green Ethernet)
Performance features
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
MACSec Offload (802.3ae)
Intel Non-vPro
iSCSI Boot
Manageability
Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Interface
PCI Express 1.1 x1 to fully support ASPM L0s/L1 and CLKREQ
note:
Intel 82579 PCIe interface is not PCIe compliant. It operates at half of PCIe specification V1.1 (2.5GT/S) speed.
NIC Device Driver Name
Intel 82579LM/82579V Ethernet Network Connection

Intel I219-LM Gigabit Network Connection

Specification
Description
Ethernet features
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023. Clauses 40)
Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE(Energy Efficient Ethernet)
Jumbo Frame 9K
Auto MDI/MDIX Crossover cable detection
Power management
ACPI compliant - multiple power modes
Energy Detect Low Power Mode(Green Ethernet)
Performance features
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
MACSec Offload (802.3ae)
Intel vPro
iSCSI Boot
Manageability
Manageability Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Interface
PCI Express 1.1 x1 to fully support ASPM L0s/L1 and CLKREQ
note:
Intel 82579 PCIe interface is not PCIe compliant. It operates at half of PCIe specification V1.1 (2.5GT/S) speed.
NIC Device Driver Name
Intel 82579LM/82579V Ethernet Network Connection

Near field communications controller

Specification
Description
Dimensions (L x W x H)
Module 25 x 10 x 2 mm
(1) USB 3.0 Port
(1) USB Basic Type-C
DisplayPort
VGA
RJ-45 / Ethernet
Docking connector
Headphone/microphone Combo
AC port
Chipset
NPC100
System interface
IC
One NGFF slot (2280) for SSD
NFC RF standards
ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
NFC forum support
Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
Reader (PCD-VCD) mode
ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
Card emulation (PICC-VICC) mode
ISO/IEC 14443 B and B
note:
With application or UICC support
MIFARE
FeliCa
Frequency
13.56 MHz
NFC modes supported
Reader/Writer Peer-to-Peer, Card Emulation
Raw RF sata rates
106, 212, 424, 848 kbps
Operating temperature
0° C to 70° C
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Supply operating voltage
2.97 to 5.5 V
I/O Voltage
1.8 V or 3.3 V
Power consumption
Mode
Power consumption (typical)
Polling
7.3 mA
Detected test tag type 1
Total 283.8 mA
Net module 236.8 mA
Detected test tag type 2
Total 288.8 mA
Net module 241.8 mA
Detected test tag type 3
Total 287.7 mA
Net module 240.7 mA
Detected test tag type 4
Total 282.3 mA
Net module 235.3 mA

Audio/multimedia

Specifications
Description
Hardware
Implementation:
CX7501
Function key volume controls:
Volume up, volume down, and mute
Full duplex:
Yes
Line in/line out
Yes via dock
Headphone/microphone in:
Yes combo jack
Integrated microphone:
Yes, dual digital microphone array
Audio output quality
Frequency response:
20 Hz - 20 kHz
Signal to noise ratio:
> 85 dB
Total harmonic distortion:
0.01%
Noise floor
-110 dB
Play/record sampling rate:
8 kHz – 48 kHz
DAC:
16, 20, or 24-bit
ADC:
16 or 20-bit
Integrated stereo speakers
Power rating:
2 watts
Impedance:
4 ohms

Power

HP 45W Smart AC Adapter

Specifications
Description
Dimensions (H x W x D)
9.5 x 4 x 2.65 cm (3.74 x 1.57 x 1.04 in )
Weight
175 g (0.386 lb) max
Input
90 to 265 VAC
Input Efficiency:
87.74% at 11 5 VAC and 88.4% at 230 VAC
Input frequency range:
47 to 63 Hz
Input AC current:
1.4 A at 90 VAC
Output
Output power:
45 W
DC output:
9.50 V
Hold-up time:
5 msec at 115 VAC input
Output current limit:
< 8.0A
Connector
3 pin/grounded, mates with interchangeable cords
Environmental design
Operating temperature:
0° to 35° C (32° to 95° F)
Non-operating (storage) temperature:
-20° to 85° C (-4° to 185° F)
Altitude:
0 to 5,000 m (0 to 16,400 ft)
Humidity:
20% to 95%
Storage humidity:
10% to 95%
EMI and safety certifications
CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE
MTBF - over 200,000 hours at 25°C ambient condition

HP 65W Smart AC Adapter EM

Specifications
Description
Dimensions
12.65 x 5 x 3 cm (4.98 x 1.97 x 1.18 in )
Weight
290 g (0.62 lb)
Input
90 to 265 VAC
Input Efficiency:
87.74% at 11/230 VAC
Input frequency range:
47 to 63 Hz
Input AC current:
1.7 A at 90 VAC, 0.85 A at 180 VAC
Output
Output power:
65 W
DC output:
19.5 V
Hold-up time:
5 msec at 115 VAC input
Output current limit:
< 11A, over voltage protection -29 V max automatic shutdown
Connector
3 pin/grounded, mates with interchangeable cords
Environmental design
Operating temperature:
0° to 35° C (32° to 95° F)
Non-operating (storage) temperature:
-20° to 85° C (-4° to 185° F)
Altitude:
0 to 16,400 ft (0 to 3,048 m)
Humidity:
20% to 95%
Storage humidity:
10% to 95%
EMI and safety certifications
CE Mark - full compliance with LVD and EMC directives
Worldwide safety standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22 Class B, CCC, NOM-1 NYCE
MTBF - over 200,000 hours at 25°C ambient condition

HP 3-cell Long Life Li-Ion (46.5 WHr)

Specifications
Description
Dimensions
8.30 x 127.5 x 160.25 mm
Weight
216.3 g, (0.48 lb) (ATL), 217.8 g, (0.48 lb) (COS)
Cells/type
ATL 505295, SDI 505295
Energy
Voltage:
11.4 V
Amp-hour capacity:
3910 mAh
Watt-hour capacity:
44.5 Wh
Temperature
Operating (Charging):
0° to 45° C (32° to 113° F)
Operating (Discharging):
-10° to 60° C (14° to 140° F)
Non-operating temperature:
-5° to 40° C (41° to 104° F)
Fuel gauge LED
NA
Warranty
1000 cycles >65% (at 23˚C)
Optional travel battery available
No

HP 3-cell Long Life Li-Ion (46.5 WHr)

Specifications
Description
Dimensions
6.8mm x 102.8mm x 198 mm
Weight
216.3 g, (0.48 lb) (ATL), 217.8 g
Cells/type
ATL 506480, COSLIGHT 506480
Energy
Voltage:
11.4 V
Amp-hour capacity:
4080mAh
Watt-hour capacity:
46.5 Wh
Temperature
Operating (Charging):
0° to 45° C (32° to 113° F)
Operating (Discharging):
-10° to 60° C (14° to 140° F)
Non-operating temperature:
-5° to 40° C (41° to 104° F)
Fuel gauge LED
NA
Warranty
1000 cycles >65% (at 23˚C)
Optional travel battery available
No

Physical specifications

Specification
Description
Weight
Starting at 1.86 kg (4.10 lb)
Dimensions (W x D x H)
Non-touch
38.33 x 25.77 x 1.94 cm (15.09 x 10.1 x 0.76 in)
Touch
38.33 x 25.77 x 2.08 cm (15.09 x 10.1 x 0.82 in)
note:
Height varies depending upon where on the notebook the measurement is made. Weight varies by configuration and components.

Software/OS

Specifications
Description
BIOS
HP BIOSphere
note:
Available only on business PCs with HP BIOS.
HP SureStart
HP DriveLock, HP Automatic DriveLock
HP BIOS protection
note:
May require a manual recovery step if all copies of BIOS are compromised or deleted.
BIOS update via network
Master boot record security
Power on authentication
Pre-boot security
Secure erase
note:
For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88.
Hybrid boot
Measure boot
HP SpareKey
Pre-boot Authentication
Multimedia
Cyberlink Power DVD, BD
Cyberlink YouCam BE (Windows 7 only)
Communication
HP GPS and Location (Windows 7 only)
note:
GPS access requires an unobstructed path to multiple satellites. Performance may be affected if/when used inside of buildings, bridges or heavily congested metropolitan areas. Requires separately purchased GPS navigation software available from multiple GPS applications.
HP Connection Manager with support for HP Mobile Connect (Windows 7 only)
HP Mobile Connect Pro (Windows 8.1 & later)
note:
HP Mobile Connect is only available on preconfigured devices with WWAN.
Intel Wireless Display (WiDi) Software for Windows
Native Miracast support
note:
Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming media players that also support Miracast. You can use Miracast to share what you’re doing on your PC and present a slide show.
HP value add software
HP 3D DriveGuard (requires Windows)
HP ePrint Driver
note:
Requires an Internet connection to HP web-enabled printer and HP ePrint account registration. Requires optional broadband module. Broadband use requires separately purchased service contract. Check with service provider for coverage and availability in your area. Separately purchased data plans or usage fees may apply. Print times and connection speeds may vary.
HP Hotkey
HP Recovery Manager
HP Recovery Disc Creator
HP Registration App (Windows 8.1 only)
HP Support Assistant
HP Noise Reduction Software
3rd Party
Foxit PhantomPDF Express for HP
Microsoft products
Buy Office
Bing search
Skype
note:
Skype is not offered in China.
Manageability
Preinstalled
  • HP SoftPaq Download Manager (SDM)
  • LANDESK Management (subscription required)
Not preinstalled (available on manageability website)
  • HP Driver Packs
  • HP BIOS Config Utility (BCU)
  • HP Client Catalog
  • HP CIK for Microsoft SCCM
  • HP System Software Manager (SSM)
Client security software
HP Security Manager
HP Drive Lock
HP Fingerprint Sensor
HP Password Manager
Absolute Persistence Module
note:
Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply
Power On Authentication
Microsoft Security Essentials
note:
Opt in and internet connection required for updates.
Microsoft Defender
Security
Trusted Platform Module (TPM ) 1.2 Embedded Security Chip (Common Criteria EAL4+ Certified)
Upgradeable to TPM 2.0 (not available on Win 7 32-bit)
HP Fingerprint Reader (
note:
HP Cloud Recovery download tool (Cloud Recovery Client) is available under Software and Drivers section on the support page.

Security

HP fingerprint reader (optional)

Specifications
Description
Mobile voltage operations
3.0 V-3.6 V
Operating temperature
-10° – 75° C (14° – 167° F)
Current consumption image
36 mA peak
Low latency wait for finger
950 uA
Capture rate
59000 lines/sec
ESD resistance
IEC 61000-4-2 4B (±15KV)
Detection matrix
200*1 (plus another secondary line)
508 dpi
10*1 mm sensor area

Smart card reader

Specifications
Description
Smart card standard
PC/SC 2.0 for Windows smart card standard
Dimensions (L x W x H)
10.5 x 2 x 8.2 mm (0.41x 0.08 x 0.32 in)
Smart card support
ISO 7816 Class A and AB smart cards
Smart card interface
Smart card interface with T = 0 and T = 1
Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442, SLE4436
SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via external EEPROM
Smart card interface
950 uA
Operating systems
No driver is required for this device. Native support is provided by the operating system.
Power
Normal mode:
With card present, before being suspended: 40.9 mA
Without card present, before being suspended: 33.16 mA
After being suspended with smart card present: 380 μA
After being suspended without smart card present: 380 μA
Power saving mode:
With card present, before being suspended: 40.6 mA
Without card present: 380 μA
After being suspended with smart card present: 380 μA
Features
Support single slot
Support T0, T1 protocol
Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442, SLE4436, SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via external EEPROM
Support ISO7816 Class A, B and C (5V/3V/1.8V) card
Implemented as an USB full speed device with bulk transfer endpoint, Mass
Storage endpoint
Built-in PLL for USB and smart card clocks requirement
Support EEPROM for USB descriptors customization (PID/VID/ iManufacturer/iProduct/Serial Number), Direct Web Page Link, and accessing memory card module.
EEPROM programmable via USB interface
Support software update for memory card module
Support Direct Web Page Link via configuration in external EEPROM
Support short APDU and extended APDU
Compatible with Microsoft USB-CCID driver
Support remote wake up through inserting card/removing card
Support USB selective suspend
Support power saving mode (Using one pin to select between Normal/PWR Saving Mode)
Support card power over current protection mechanism
Built in resonator
Support USB LPM (Link Power Management) features
Embedded clock source.

Warranty information

Terms of warranty apply to the individual model purchased. To see if your HP product is still in warranty, go to the HP Product Warranty Check page.

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