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HP Compaq dx2710 Business PC - Specifications

Hardware Specifications
Features
Description
Weight & Dimensions (MT)
Chassis Dimensions (H x W x D)
385 x 185 x 416 mm (15.16 x 7.28 x 16.38 inches) with bezel
378 x 165 x 409 mm (14.88 x 6.50 x 16.10 inches) without bezel
Packaged Dimensions (L x W x H)
498.6 x 613 x 268.2 mm (19.63 x 24.13 x 10.56 inches)
System Weight
8.3 kg (18.3 lb)
Shipping Weight
12.1 kg (26.7 lb)
Weight & Dimensions (SFF)
Chassis Dimensions (H x W x D)
100 x 339 x 411 mm (3.94 x13.34 x 16.18 inches)
Packaged Dimensions (L x W x H)
495 x 595 x 219 mm (19.48 x 23.425 x 8.62 inches)
System Weight
8.6 kg (18.96 lb)
Shipping Weight
12.4 kg (27.3 lb)
Temperature Range
Operating
5o degree to 35o degree Celsius
Non-operating
-30o degree to 65o degree Celsius
Relative Humidity
Operating
15% to 80% (non-condensing at ambient)
Non-operating
90% (non-condensing at ambient)
Maximum Altitude (unpressurized)
Operating
7500 feet (2286 m)
Non-operating
15,000 feet (4572 m)
Shock
Listed are the levels of shock the product can withstand with NO damage being incurred. The values represent peak input acceleration during a 2 to 3 ms half-sine shock pulse, 11 ms trapezoidal shock pulse.
Non-Operating
35 G's (Half-sine Shock)
35 G's (Trapezoidal Shock)
Vibration
Listed are the levels of vibration the product can withstand with NO damage being incurred. The values represent a flat random vibration input acceleration profile across the given frequency range.
Operating
Random Operating: ~0.21 Grms (5-500 Hz) Swept Sine: 0.5 g (5-500 Hz) 5 min. dwell at 4 resonance’s
Non-Operating
~2.09 Grms (5-500Hz), Non-Operational
Acoustic Noise
Listed are the declared A-WEIGHTED SOUND POWER LEVELS (LWAd) and declared average desktop seated operator position A-WEIGHTED SOUND PRESSURE LEVELS (LpAm) when the product is operating in a 73.4o degree Fahrenheit (23o degree Celsius) ambient environment. Noise emissions were measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109).
IDLE (Fixed disk drive spinning)
LWAd = 4.3 Bels, Desktop Average LpAm = 32 dBA
FIXED DISK (Random write)
LWAd = 4.8 Bels, Desktop Average LpAm = 37 dBA
CD-ROM (Sequential Reads)
LWAd = 5.0 Bels, Deskside Average LpAm = 39 dBA
  note:
Operating temperature is de-rated 1.0o degree Celsius per 1000 feet (300 m) to 7500 feet (2286 m) above sea level, no direct sustained sunlight. Maximum rate of change is 7.5o degree Celsius per Hour. The upper limit may be limited by the type and number of options installed.
Chassis
Feature
Description
Front Panel
  • Power button
  • Power On LED
  • HDD Activity LED
Cooling Solutions Supported
  • Power Supply Fan (variable speed)
  • Active heatsink (variable speed)
  • Chassis fan
Slots Supported
Four (4) full-height expansion slots
Front I/O
Two (2) USB 2.0 ports
Rear I/O
Standard Micro ATX I/O connectors, including eight (8 ) USB 2.0 ports
Drive Bays (MT)
  • Two (2) 5.25-inch (13.335 cm) half height external
  • One (1) 3.5-inch (8.89 cm) half height external
  • Two (2) 3.5-inch (8.89 cm) half height internal
Drive Bays (SFF)
  • One (1) 5.25-inch (13.335 cm) half height external
  • One (1) 3.5-inch (8.89 cm) half height external
  • One (1) 3.5-inch (8.89 cm) half height internal
Security
  • Padlock loop
  • Kensington Lock Support
Power Supply
250 W / 300 W ATX Power Supply – PFC with a 115 v / 230 v line switch (varies by country/region), with HV immunity up to 410 V/s
System Board
Feature
Description
Processor
  • Socket T; LGA775 industry standard Micro ATX form factor
  • Support single Intel Core 2 Duo or Quad, Pentium Dual Core, Celeron 4xx or Dual Core
PWM
ON NCP5385 – 3 Phase
Chipset
  • Intel G33 Express
  • Intel I/O Controller Hub 9 (ICH9)
Super I/O
ITE IT8718F
Front Side Bus Frequency
800/1066/1333 MHz
Memory
  • DDR2 SDRAM
  • 4 x DIMM slots
Clock Generator
ICS ICS9LP505-2HFLFT
Integrated Graphics
Intel Graphics Media Accelerator (GMA) 3100
Audio
Realtek ALC662-GR HD Audio compatible codec with 5.1 channel audio 3D audio
LOM
Realtek RTL8111C-VB--GR GbE Ethernet controller
Storage
Four Serial ATA interfaces
Expansion Slots
  • 2 x PCI 2.3 slots
  • 1 x PCI Express x1 slot
  • 1 x PCI Express x16 slot
BIOS
SPI EEPROM
Industrial Standard
  • PCI 2.3 compliant
  • USB 2.0
Rear Side I/O Ports
  • 1 x PS/2 keyboard port
  • 1 x PS/2 mouse port
  • 8 x USB 2.0 ports
  • 1 x RJ-45 10/100/1000 port
  • 1 x D-sub 15 pin analog VGA port
  • 1x D-sub 25 pin parallel (print) port
  • 1xD-sub 9 pin serial (RS232) port
  • 3 x audio ports
On Board I/O Interfaces
  • 1 x ATX power connector
  • 1 x +12V power connector
  • 1 x Floppy connector
  • 1 x Front panel connector, Switch, LED (ON/Flash/OFF)
  • 2 x Fan headers for CPU, chassis, with voltage/fan speed control
  • 1 x header to support 2 USB 2.0 ports at front side
  • 1 x header to support 2 front (Headphone/Mic) audio ports
  • 1 x header to support USB media reader
  • 1 x serial (COM2) header to support 2nd serial port
Board Size
  • Micro-ATX, PCB Size: 9.6 x 9.6 in (24.38 x 24.38 cm)
  • 4-layer PCB with green color
Additional Features
  • Bootable without keyboard, mouse or monitor
  • Keyboard/mouse/USB wake up
  • Support S1, S3, S4 and S5
  • ACPI status
  • Hardware monitor capability
  • CPU fan speed control
Network
Feature
Description
Network Interface
  • Integrated Realtek 8111C-VB-GR GbE Ethernet Controller
  • Intel PRO/1000 PT Gigabit PCIe Adapter (optional)
  • Broadcom NetXtreme 5751Gigabit PCIe NIC (optional)
Power
Feature
Description
Power Supply
  • 250 W / 300 W ATX Power Supply – Passive PFC with a 115 v / 230 v line switch, with HV immunity up to 410 V/s
  • 90 to 132 VAC, or 180 to 264 VAC operating voltage range
  • 100 to 127 VAC, or 200 to 240 VAC rated voltage range
  • 50–60 Hz rated line frequency
  • 47–63 Hz operating line frequency range
  • 250 or 300 W maximum rated power
  • High voltage immunity up to 410 V/s
  • 80 mm power supply fan – variable speed for optimum acoustics
Power Conservation ‘Energy Saver‘
  • APM 1.2 support
  • Screen blanking
  • Hard drive 'Idle' mode
  • System Idle mode
  • 3 W power consumption in ES mode – suspend to RAM (S3) (instantly available PC)
  • Processor/Cache memory power-down (S3)
  • CECP – China Only (< 3 w in S5 – power off)

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