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HP t630 Thin Client Specifications

Product image

Figure : HP t630 Thin Client
HP t630 Thin Client

Processor/graphics

Feature
Description
AMD GX-420GI
2.2/2.0 GHz
Cores: 4
TDP: 16.1W
L2 cache: 2 MB
GPU: 626 MHz
Memory: DDR4

Memory

Feature
Description
Type
DDR4 dual channel SDRAM
Data transfer rate
Up to 1,866 MT/s
Peak transfer rate
14,933 MB/s
Number of slots
2 x SODIMM
Capacities
4 GB
8 GB
16 GB
32 GB
note:
WES 7E is a 32-bit operating system and only recognizes up to 3.2 GB RAM.
Reserved for graphics
256 MB, 512 MB (default), or 1 GB
note:
The system Graphics Processing Unit (GPU) uses part of the total system memory. System memory dedicated to graphics performance is not available for use by other programs.

Storage

Feature
Description
Type
NAND flash memory, non-volatile
Number of sockets
(2) M.2 designated as primary and secondary*
Primary storage options
No OS, Smart Zero and ThinPro: 8 GB, 16 GB, 32 GB, 64 GB, 128 GB
WES 7E, 32bit: 16 GB, 32 GB, 64 GB, 128 GB
Win 10 IoT, 64 bit: 32 GB, 64 GB, 128 GB
note:
*The primary socket supports M.2 flash up to size 2280 modules; the secondary socket accommodates up to size 2242 modules. The highest capacity offered in the secondary slot is 64 GB.
Capacities
Secondary storage options*
All configurations: 8 GB, 16 GB, 32 GB, 64 GB
WES 7E, 32bit restrictions for factory: The secondary drive must be equal to or greater than the capacity of the primary drive.
note:
*Secondary SSD capacity restrictions are for factory only. Secondary storage can be changed to any capacity desired after received from factory.
Flash memory
Multi-level Cell (MLC)
Bits per cell: 2
Terabytes written (TBW)*: 5 TBW – 8GB, 10 TBW – 16GB, 20 TBW – 32GB
Ultra MLC (UMLC)
Bits per cell: 2 (only 1 is used)
Terabytes written (TBW)*: 50 TBW – 16GB, 100 TBW – 32GB
Triple-level Cell (TLC )
Bits per cell: 3
Terabytes written (TBW)*: 70 TBW - 128GB
note:
*Terabytes written (TBW) calculated based on JESD-219 SSD Client workload.

Input/output

Feature
Description
Keyboard
USB or PS/2
Mouse
USB or PS/2
Display/monitor
Number of displays supported: 2*
(2) DisplayPort 1.2, 3840 x 2160 at 60 Hz**
(1) VGA (optional), 1920 x 1200 at 60 Hz**
note:
*Adding the optional VGA output does not increase the number of displays supported.
note:
**The system should be configured with dual channel memory (two SODIMMs) for optimal display resolution performance. Dual channel memory (two SODIMMs) is required to achieve maximum resolution on dual UHD displays.
Ports and slots
(4) Hi-Speed USB 2.0 ports (2 front, 2 rear)
(3) SuperSpeed USB 3.0 ports (2 front, 1 inside chassis)
(2) DisplayPort 1.2 digital outputs
(1) VGA analog output (optional)*
(2) PS/2 keyboard/mouse ports
(1) RJ45 network interface connector
(1) Serial port, can be configured to produce 5V of power
(1) 3.5 mm headset port (front)
(1) 3.5 mm audio combo line-out/ line-in port (rear)
note:
*A single position at the back of the system is utilized for one of four optional outputs. One of the following can be configured to any system:
VGA video output
Second serial port
Fiber Optic NIC interface
External Wi-Fi antenna

Audio/video

Feature
Description
Audio subsystem
Internal amplified speaker system for basic audio playback
3.5 mm headset socket (front)
3.5 mm combo line-out/ line-in socket (rear)
Audio CODECs
MP3
AAC stereo
HE AAC
Includes hardware acceleration support
Video CODECs
MPEG-4 part 2 (DivX, Xvid)
MPEG-4 part 10 (H.264, AVC)
WMV 7/8/9 VC-1 and ASF Demuxer
Includes hardware acceleration support

Hardware

Feature
Description
Security
Security lock slot (cable lock sold separately)
Power cord retention clip
Internal SuperSpeed USB 3.0 port
Trusted Platform Module (version 1.2 or 2.0 depending upon the configured operating system)
Networking
Realtek Gigabit Ethernet (GbE), RJ45 connector access
Wake on LAN (WOL)
Preboot Execution Environment (PXE)
TCP/IP with DNS and DHCP
Secure Socket Tunneling Protocol (SSTP), supported with Windows OS

Wi-Fi networking

Feature
Description
Wi-Fi adapter options:
Intel Dual Band Wireless-AC 3168 Wi-Fi/Bluetooth combo adapter
Intel Dual Band Wireless-AC 8260 Wi-Fi/Bluetooth combo adapter
note:
Wireless access point and internet access required. Availability of public wireless access points limited.

Fiber optic networking

Feature
Description
Fiber optic adapter option: Allied Telesis AT-27M2/SC Fiber Fast Ethernet network interface
Form factor: M.2
Connector: SC, compliant with IEC 61754-4
External Interface: Complies with IEEE 802.3 1000BASE-X operation
Features:
IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 2K transmit and 2K receive
Loopback mode
Descriptor-based buffer management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power (The PHY interface, Link detection, and Link LED are enabled by default at power up.)
Performance:
>= 85 Mbit/s receive, <= 30% CPU utilization
>= 85 Mbit/s transmit, <= 30% CPU utilization
>= 170 Mbit/s total bi-directional, <= 30% CPU utilization
Power:
Uses less than 1775 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1, and L2
Non-volatile storage:
The MAC address is unique for each system, assigned from the board assembly manufacturer IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.
Fiber optic adapter option: Allied Telesis AT-29M2/SC or AT-29M2/LC fiber Gigabit network interface
Form factor: M.2
Connector: SC, compliant with IEC 61754-4
External Interface: Complies with IEEE 802.3 1000BASE-X operation
Features:
IEEE 802.1p priority encoding/tagging (QoS, CoS)
IEEE 802.1q VLAN tagging
IEEE 802.3x flow control
Buffer/FIFO: 22K transmit and 40K receive
Loopback mode
Descriptor-based buffer management
Wake-on-LAN from S3 (Sleep) and S4 (Hibernate) not supported
Link Detection and PHY interface power (The PHY interface, Link detection, and Link LED are enabled by default at power up.)
Performance:
>= 800 Mbit/s receive, <= 30% CPU utilization
>= 800 Mbit/s transmit, <= 30% CPU utilization
>= 1500 Mbit/s total bi-directional, <= 30% CPU utilization
note:
The minimum transfer size at 1000 Mbit/s is 1500 Gbps.
Power:
Uses less than 2100 mW of power at full performance
Supports all PCI Express bus states L0, L0s, L1, and L2
Non-volatile storage:
The MAC address is unique for each system, assigned from the board assembly manufacturer IEEE registered allocation.
The PCI subsystem ID is unique to HP and unique to each design to allow Windows Update to be finely controlled.

External power supply

Feature
Description
Power supply
65W external power adapter
Worldwide auto-sensing 100-240 VAC, 50-60 Hz
Energy-saving automatic power down
Surge tolerant
note:
The dimensions of the power brick vary by supplier.

Physical specifications

Feature
Description
H x W x D: (vertical orientation)
25.1 x 12 x 22 cm (9.88 x 4.72 x 8.66 in)
Without stand: 24 x 4.2 x 22 cm (9.45 x 1.65 x 8.66 in)
Volume
2.21 liters (74.73 fl oz)
System weight
1.52 kg (3.35 lb)
Without stand: 1.45 kg (3.2 lb)
note:
All measurements are approximate; the addition of optional modules will increase the weight.

Operating system

Feature
Description
Operating systems
HP Smart Zero Core
HP ThinPro
Windows Embedded Standard 7E
Windows 10 IoT Enterprise

Environmental specifications

Feature
Description
Operating temperature range
10° to 40° C (50° to 104° F)
Using Quick Release with a flat panel monitor: 10° to 35° C (50° to 95° F)
Non-operating temperature range
-30° to 60° C (-22° to 140° F)
Humidity
Condensing: 20% to 80%
Non-condensing: 10% to 90%
note:
Specifications are at sea level with altitude derating of 1° C/300m (33.8° F/984 ft) to a maximum of 3 km (9,842 ft), with no direct, sustained sunlight. Upper limit may be limited by the type and number of options installed.

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