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  • Information
    Information regarding recent vulnerabilities

    HP is aware of the recent vulnerabilities commonly referred to as "Spectre" and "Meltdown". HP has published a security bulletin with patches for these issues and a list of impacted systems. We will continue to update the bulletin as more information becomes available and encourage customers to check the bulletin frequently.

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HP ProOne 600 G2 21.5-inch All-in-One Business PC - Specifications

Ports
Specification
Description
USB 3.0
2 - side (including 1 fast charging)
4 - rear center facing
Serial (RS-232)
1 (optional)
PS/2
Optional legacy card
1 keyboard (purple)
1 mouse (green)
Video
1 DisplayPort with multi-stream
Audio
Side - headphone/mic
Rear - line out
3.5 mm diameter
Network interface
RJ-45
Slots
Turbo drive G2 (M.2 PCIe)
1 - M.2 PCIe x4-2230 (for WLAN)
1 - M.2 PCIe x4-2280 (for storage)
Bays
Specification
Description
9 mm Slim ODD
1 each
2.5 in internal storage driver
1 each
Operating systems
Specification
Description
Preinstalled
Windows 10 Pro 64
Windows 10 Home 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 64
Windows 7 Professional 32
Web-supported
Windows 10 Pro 64
Windows 10 Home 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 7 Professional 64
Windows 7 Professional 32
Windows 10 Enterprise 64
Windows 8.1 Enterprise 64
Windows 7 Enterprise 64
Windows 7 Enterprise 32
Software and security
Specification
Description
BIOS
HP BIOSphere
HP DriveLock
HP BIOS Protection
BIOS Update via Network
Master Boot Record Security
Power On Authentication
Secure Erase
Hybrid Boot (Windows 8.1 & higher)
Measured Boot (Windows 8.1 & higher)
Secure Boot (Windows 8.1 & higher)
Absolute Persistence Module
Multimedia
Cyberlink Power DVD, BD
Cyberlink Power2Go (Secure Burn)
Communication
Intel Wireless Display (WiDi) Software for Windows
Native Miracast Support
HP value add software
HP ePrint Driver
HP Recovery Disc Creator (Windows 7 only)
HP Recovery Manager
HP Support Assistant
Windows 10 Welcome App
3rd party
Foxit PhantomPDF Express for HP
Microsoft products
Buy Office
Bing Search
Skype
Manageability
HP SoftPaq Download Manager (SDM)
HP System Software Manager (SSM)
HP BIOS Config Utility (BCU)
HP Client Catalog
HP CIK for Microsoft SCCM
LANDESK Management
HP BIOS Config Utility (BCU)
Discover HP Touchpoint Manager
Client security software
HP Drive Encryption
HP Client Security Manager
Microsoft Security Essentials
Microsoft Defender
TPM 1.2/2.0
Graphics card
Intel HP graphics (integrated)
Specification
Description
VGA controller
Integrated
DisplayPort
Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and Multi-Stream Technology for a maximum of 3 displays (including the integrated panel)
Bus type
N/A
RAMDAC
N/A
Memory
Intel graphics do not have dedicated memory but utilizes some of the computer’s system memory The amount of memory used for graphics depending on the amount of system memory installed, BIOS settings, operating system, and system load. 32 MB is pre-allocated for graphics use at system boot time. Additional memory can be allocated at boot time by the BIOS for PAVP (Protected Audio Video Playback) support for playback of protected video content.
Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an optimal balance between graphics and system memory use.
Maximum graphics memory
Windows 7: Up to 1.7 GB
Windows 8.1: Up to 1.8 GB
Maximum color depth
32 bits/pixel
Graphics/video API support
6th generation core processors:
The Processor Graphics contains a refresh of the seventh generation graphics core enabling substantial gains in performance and lower power consumption. Up to 16 EU support.
Next Generation Intel Clear Video Technology HD Support is a collection of video playback and enhancement features that improve the end user's viewing experience.
  • Encode/transcode HD content
  • Playback of high definition content including Blu-ray Disc
  • Superior image quality with sharper, more colorful images
DirectX Video Acceleration (DXVA) support for accelerating video processing
  • Full AVC/VC1/MPEG2 HW Decode
Advanced Scheduler 2.0, 1.0
Windows 7, Windows 8, Linux OS Support
DirectX 11.1
Open GL 4.3
Open CL 1.2
Supported display resolutions and refresh rates
Resolution
Refresh rates
800 x 600
60 Hz
1024 x 768
60 Hz
1152 x 864
60 Hz
1280 x 600
60 Hz
1280 x 720
60 Hz
1280 x 960
60 Hz
1280 x 1024
60 Hz
1360 x 768
60 Hz
1366 x 768
60 Hz
1400 x 1050
60 Hz
1440 x 900
60 Hz
1600 x 900
60 Hz
1600 x 1200
60 Hz
1680 x 1050
60 Hz
1920 x 1080
60 Hz
1920 x 1200
60 Hz
1920 x 1440
60 Hz
2560 x 1440
60 Hz
2560 x 1600
60 Hz
3840 x 2160
60 Hz
AMD Radeon R9 350 1 GB PCIe x16
Specification
Description
Memory
2 GB 128-bit wide frame buffer operating at 1150 MHz
Controller clock speed
AMD Radeon R9 350 GPU operating at 925 MHz
Multidisplay support
A maximum of 4 displays are supported by the card. A maximum of 2 legacy displays (Native VGA, DVI, or displays connected with passive DisplayPort adapters are considered as legacy)
Graphics/API support
DIRECTX 11.1, Open GL 4.3, Open CL1.2, UVD 3
Output connectors
1 x Dual-Link DVI-I, 2x DisplayPort; Includes DVI to VGA adapter
NVIDIA GeForce GT 730 2 GB PCIe x8 graphics card
Specification
Description
Introduction
Get impressive graphics and high resolution dual-display performance in a low profile, PCI Express x8 graphics add-in card based on the NVIDIA Kepler Graphics Processor. Improve your everyday PC, Web conferencing, and video or photo editing.
Memory
2 GB DDR3 64-bit wide frame buffer operating at 900 MHz
Controller clock speed
NVIDIA Kepler GPU operating at 902 MHz
Multi-display support
A maximum of 4 displays are supported by the card
Graphics/API support
Supports Microsoft DirectX 12, OpenGL 4.4 and OpenCL 2 APIs, Shade Model 5, UVD 4.2, VCE 2.0, and DirectCompute 11
Output connectors
1 x Dual-Link DVI-I, 1x DisplayPort; Includes DVI to VGA adapter Display Port output is multi-mode capable, support Audio, HBR2 and MST
Hard disk and solid state storage
120 GB SATA 2.5 non-SED SSD
Specification
Description
Unformatted capacity
120 GB
Architecture
Multi-level cell (MLC) NAND
Interface
Serial ATA 3.0 (6.0 Gb/s)
Form factor
2.5 inch
Height
Low profile, 7 mm height
Width
69.85 mm ± 0.25
Length
100.45 mm
Weight
Up to 78 g
Bandwidth performance
Sustained sequential read: up to 540 MB/s
Sustained sequential write: Up to 480 MB/s
Power consumption
Average read: < 3.7 W
Average write: 3.7 W
Standby: < 55 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms
120 GB SATA 2.5 in Opal2 SED Solid State Drive (Pro 2500)
Specification
Description
Unformatted capacity
120 GB
234,441,648 (total logical sectors)
Architecture
ATA 8 Compliant and SATA 3.0 compliant
Supports Mode 2 Multiword DMA
Supports Drive Failure Prediction
Supports SMART Offline Read Scan
Supports Mode 4 PIO
Supports Mode 5 UDMA
Supports HP Drive Protection System
ATA 8 ACS-2 Data / TRIM Support
Support DEVSLP feature
Supports TRIM Command per ATA8 / ACS 2
Supports FIPS-197 features
Support TCG Storage Architecture Core Specification 2.0
Interface
Serial ATA 3.0 (6.0 Gb/s)
Form factor
2.5 in
Height
Low profile, 7 mm height
Width
69.85 mm ± 0.25
Length
100.45 mm
Weight
78 g
Bandwidth performance
Sustained sequential read: up to 540 MB/s
Sustained sequential write: up to 480 MB/s
Power consumption
Average read: < 3.7 W
Write: 3.7 W
Standby: < 55 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms
128 GB SATA 2.5 in 3D non-SED Solid State Drive
Specification
Description
Unformatted capacity
128 GB
250,069,680 (user addressable sectors)
Architecture
Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface
Fully complies with ATA/ATAPI-7 Standard (Partially Complies with ATA/ATAPI-8)
Power Saving Modes: DIPM (Partial / Slumber mode)
Support NCQ : Up to 32 depth
Synchronous Signal Recovery
Interface
Serial ATA (6.0 Gb/s)
Form factor
2.5 in
Height
6.8 mm ± 0.2
Width
69.85 mm ± 0.25
Length
100.45 mm ± 0.25
Weight
54 g
Bandwidth performance
Sustained sequential read: up to 530 MB/s
Sustained sequential write: up to 140 MB/s
Power consumption
Average read: < 250 mW
Idle: 50 mW
Mean time between failures
1,500,000 hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms
128 GB SATA 2.5 in Opal2 SED Solid State Drive
Specification
Description
Unformatted capacity
128 GB
250,069,680 (user addressable sectors)
Architecture
Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface
Trusted Computing Group(TCG) OPAL compliant encrypted solid state drive
Interface
Serial ATA (6.0 Gb/s)
Form factor
2.5 in
Height
6.8 mm ± 0.2
Width
69.85 mm ± 0.25
Length
100.2 mm ± 0.25
Weight
73 g
Bandwidth performance
Sustained sequential read: up to 520 MB/s
Sustained sequential write: up to 340 MB/s
Power consumption
Average read: < 250 mW
Idle: 50 mW
Mean time between failures
1,500,000 hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms
HP 128 GB SATA 2.5 in (non-SED) Solid State Drive
Specification
Description
Unformatted capacity
128 GB
Architecture
Multi level cell (MLC) NAND
Interface
SATA 6 Gb/s
Dimensions (W x H x D)
6.985 x 0.7 x 10.05 cm (2.75 x 0.276 x 3.96 in)
Weight
73 g
Bandwidth performance
Sustained sequential read: up to 420 MB/s
Sustained sequential write: up to 260 MB/s
Random read: up to 46k IOPs
Random write: up to 56k IOPs
Latency
Read: 55 ms
Write: 55 ms
DC power requirement
4.5 V - 5.5 V
Total power consumption
Active: 160 mW
Idle: < 85 mW
Useful drive life
1.2 million device hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/1.0 msec
Regulations
UL, CSA, EN 60950-2000, CISPR Pub 22 Class B, CNS 13438, AS/NZS CISPR 22:2002 Class B, Korea KCC, CE Mark
Intel Pro 2500 180 GB Solid State Drive
Specification
Description
Unformatted capacity
180 GB
Architecture
Multi level cell (MLC) NAND
Interface
SATA 3.0 (6 Gb/s)
Dimensions (W x H x D)
6.985 x 0.7 x 10.05 cm (2.75 x 0.276 x 3.96 in)
Weight
78 g
Bandwidth performance
Sustained sequential read: up to 540 MB/s
Sustained sequential write: up to 490 MB/s
Random read: 41k IOPs
Random write: 80k IOPs
Latency
Read: 80 us
Write: 85 us
DC power requirement
5 VDC 5% - 100 mV ripple p-p
Total power consumption
Active: 195 mW
Idle: < 85 mW
Useful drive life
72 TB written, up to 40 GB/day for 5 years
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
180 GB SATA Opal2 SED SSD (Intel Pro 2500)
Specification
Description
Formatted capacity
180 GB
Architecture
Solid State Drive with SATA interface; ATA 8 Compliant and SATA 3.0 compliant
Interface
SATA 3.0 (6 Gb/s)
Form factor
2.5 in
Dimensions (W x H x L)
69.85 x 7 mm x 100.45 mm (2.75 x 0.27 x 3.95 in)
Weight
78 g
Data transfer rate
Sustained sequential read: up to 540 MB/s
Sustained sequential write: up to 490 MB/s
Power consumption
Power-up: 6 W
Read: < 3.7 W
Write: 3.7 W
Standby: <55 mW
DEVSLP: < 7 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1500 G
HP 1 TB SATA 6G 3.5 in 8 GB Solid State Hybrid Drive (SSHD)
Specification
Description
Formatted capacity
1 TB
Spindle speed
7200 rpm
Drive capacity
Solid State Hybrid Drive (SSHD) technology with NAND flash
Interface
Serial ATA
Cache buffer
64 MB
NAND flash commercial multilevel cell (cMLC)
8 GB
Number of sectors
1,953,525,168
Seek time
Single track: 2 ms
Average: 11 ms
Dimensions (W x H x L)
10.2 x 2.01 x 14.7 cm (4 x 0.78 x 5.79 in)
Weight
400 g (0.88 lb)
Operating temperature
5° to 55° C (41° to 131° F)
HP 1 TB 7.2K rpm SATA 6.0Gb/s 3.5 in Hard Disk Drive
Specification
Description
Formatted capacity
1 TB
Rotational speed
7200 rpm
Interface
Serial ATA
Buffer size
16 MB
Logical blocks
1,953,525,168
Number of sectors
1,953,525,168
Seek time
Single track: 2 ms
Average: 11 ms
Full-stroke: 21 ms
Dimensions (W x H)
10.2 x 2.54 cm (4 x 1 in)
Media dimensions (W x H)
8.89 x 2.54 cm (3.5 x 1 in)
Operating temperature
5° to 55° C (41° to 131° F)
HP 1 TB SATA 6G 2.5 in 8 GB Solid State Hybrid Drive (SSHD)
Specification
Description
Formatted capacity
1 TB
Spindle speed
5,400 rpm ± 0.2%
Drive type
Solid State Hybrid Drive (SSHD) technology with NAND Flash
Interface
SATA 6 GB/s
Cache buffer
64 MB
NAND Flash Commercial Multilevel Cell (cMLC)
8 GB
Number of sectors
976,773,168
Seek time
Single track: 2 ms
Average: 12 ms
Dimensions (W x H x L)
69.85 x 9.5 x 100.35 mm (2.75 x 0.37 x 3.95 in)
Weight
115 g (0.25 lb)
Operating temperature
0° to 60° C (32° to 140° F)
256 GB SATA 2.5 in 3D Non-SED Solid State Drive
Specification
Description
Unformatted capacity
256 GB
500,118,192 (User Addressable Sectors)
Architecture
Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface.
Fully complies with ATA/ATAPI-7 Standard (Partially Complies with ATA/ATAPI-8)
Power Saving Modes: DIPM (Partial / Slumber mode)
Support NCQ: Up to 32 depth
Synchronous Signal Recovery
Interface
SATA 6 GB/s
Form factor
2.5 in
Bandwidth performance
Sustained sequential read: 540 MB/s
Sustained sequential write: 280 MB/s
Power consumption
Active: 250 mW
Idle: 50 mW
Mean time between failure
1,500,000 hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms
Dimensions (W x H x L)
69.85 x 6.8 x 100.2 mm (2.75 x 0.26 x 3.94 in)
HP 256 GB SATA 2.5 in Self-Encrypting (SED) Opal 2 Solid State Drive
Specification
Description
Unformatted capacity
256 GB
Architecture
Self-Encrypting (SED) Solid State Drive with 25nm MLC NAND Flash and SATA interface
Interface
SATA 2 (3 GB/s)
NAND flash
25 nm MLC NAND flash
Dimensions (W x H x L)
69.85 x 7 x 100.5 mm (2.75 x 0.27 x 3.95 in)
Weight
73 g (0.16 lb)
Bandwidth performance
Sustained sequential 128k read: 450 MB/s
Sustained sequential 128k write: 260 MB/s
Random 4k read: 46k IOPs
Random 4k write: 56k IOPs
Latency
Read: 55
Write: 55
Power consumption
Active: 160 mW
Idle: < 85 mW
Useful drive life
72 TB written, up to 40GB/day for 5 years
Environmental
Operating temperature: 32° to 158° F (0° to 70° C)
Relative humidity: 5% - 95%
Shock: 1,500 G/1 ms
HP 256 GB SATA 6Gb/s SSD
Specification
Description
Capacity
256 GB
Interface
SATA 2 (6 GB/s)
Synchronous transfer rate
Sustained read: 560 MB/s
Sustained write: 510 MB/s
Random read: 100k IOPs
Random write: 88k IOPs
Power consumption
Active: 170 mW
Idle: 70 mW
Operating temperature
0° to 70° C (32° to 158° F)
HP 2 TB 7.2K rpm SATA 6.0Gb/s 3.5 in Hard Disk Drive
Specification
Description
Formatted capacity
2 TB
Rotational speed
7,200 rpm
Interface
SATA 2 (6 GB/s NCQ)
Cache (multisegmented)
64 MB
Seek time
Read: < 8.5 ms
Write: < 9.5 ms
Dimensions (W x H x L)
101.6 x 26.11 x 146.99 mm (4 x 1.02 x 5.78 in)
Weight
626 g (1.38 lb)
Operating temperature
0° to 60° C (32° to 140° F)
500 GB 2.5 in FIPS 140-2 SED Solid State Drive
Specification
Description
Formatted capacity
500 GB
Architecture
Self-Encrypting (SED) Solid State Drive with SATA interface
Interface
SATA 2 (6 GB/s)
Form factor
2.5 in
Dimensions (W x H x L)
69.85 x 6.8 x 100.35 mm (2.75 x 0.26 x 3.95 in)
Weight
< 95 g (0.2 lb)
Bandwidth performance
Sustained data transfer rate OD: 100 MB/s
I/O data transfer rate: 600 MB/s
Power
Spinup: 1 A
Idle: 0.7 W
Sleep: 0.18 W
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)
Relative humidity: 5% to 95%
Shock: 400 G/2 ms
HP 500 GB 7.2K SATA 6.0Gb/s 2.5 in Hard Disk Drive
Specification
Description
Capacity
500 GB
Rotational speed
7,200 rpm
Interface
SATA 6 GB/s
Buffer size
16 MB
Logical blocks
976,773,168
Seek time
Single track: 2 ms
Average: 12 ms
Full-stroke: 25 ms
Dimensions (W x H)
70 x 6.8 mm (2.75 x 0.26 in)
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)
HP 500 GB 7.2K SATA 6.0Gb/s 2.5 in Opal2 Hard Disk Drive
Specification
Description
Capacity
500 GB
Rotational speed
7,200 rpm
Interface
SATA 6 GB/s
Buffer size
32 MB
Logical blocks
976,773,168
Seek time
Single track: 1.5 ms
Average: 12 ms
Full-stroke: 25 ms
Dimensions (W x H)
70 x 6.8 mm (2.75 x 0.26 in)
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)
500 GB 7.2K rpm SATA 6.0Gb/s 3.5 in Hard Disk Drive
Specification
Description
Formatted capacity
500 GB
Spindle speed
7,200 rpm
Interface
SATA 3.0 (6 GB/s)
Buffer size
16 MB
Logical blocks
976,773,168
Seek time
Single track: 2 ms
Average: 11 ms
Full-stroke: 21 ms
Dimensions (W x H)
101.6 x 25.4 mm (4 x 1 in)
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)
HP 500 GB SATA 6G 2.5 in 8 GB Solid State Hybrid Drive (SSHD)
Specification
Description
Formatted capacity
500 GB
Spindle speed
5,400 rpm
Drive type
Solid State Hybrid Drive (SSHD) technology with NAND Flash
Interface
SATA 6 GB/s
Cache buffer
64 MB
NAND Flash Commercial Multilevel Cell (cMLC)
8 GB
Number of sectors
976,773,168
Seek time
Single track: 2 ms
Average: 12 ms
Dimensions (W x H x L)
69.85 x 6.8 x 100.35 mm (2.75 x 0.26 x 3.95 in)
Weight
95 g (0.2 lb)
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)
HP 512 GB Turbo Drive G2 SSD-M.2 PCIe Card
Specification
Description
Formatted capacity
512 GB
Architecture
Solid State Drive M.2 PCIe Gen 3 x4 NVMe; NVMe 1.1a Compliant
Interface
M.2 PCIe Gen 3 x4 NVMe
Form factor
M.2 2280 DS
Dimensions (W x H x L)
0.8 x 22 x 50 mm (0.03 x 0.86 x 1.96 in)
Weight
10 g
Data transfer rate
Sequential read: 2150 MB/s
Sequential write: 1550 MB/s
Power watts
Power-up: N/A
Read: 4.3 W
Write: 6.5 W
Standby: 700 mW
Idle: 70 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1000 G peak (operating)
HP 128 GB Turbo Drive SSD-M.2 PCIe Card
Specification
Description
Unformatted capacity
128 GB
Interface
M.2 PCIe x4 Gen 2
Architecture
Solid State Drive M.2 PCIe Gen 2 x4 AHCI; NCQ Command Set
Form factor
M.2 2280
Dimensions (W x H x L)
22 x 80 x 3.73 mm (0.89 x 3.14 x 0.14 in)
Weight
8 g (0.01 lb)
Bandwidth performance
Sustained sequential read: 920 MB/s
Sustained sequential write: 430 MB/s
Random read: 8500 IOPs
Random write: 32000 IOPs
Power
Allowable voltage: 3.3V ± 5%
Total power consumption
Active: 5.8 W
Idle: 80 mW
Mean time before failure
1.5 M hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1500 G
Regulations
Safety TUV UL CB c-UL-us
  • TUV
  • UL CB
  • c-UL-us
  • TUV
EMC/EMI
  • CE (EU)
  • BSMI (Taiwan)
  • KCC (South Korea)
  • VCCI (Japan)
  • C-Tick (Australia)
  • FCC (USA)
HP 256 GB Turbo Drive SSD-M.2 PCIe Card
Specification
Description
Unformatted capacity
256 GB
Interface
M.2 PCIe Gen 2 x4
Architecture
Solid State Drive M.2 PCIe Gen 2 x4 AHCI; NCQ Command Set
Form factor
M.2 2280
Dimensions (W x H x L)
0.8 x 7 x 50 mm (0.03 x 0.27 x 1.96 in)
Weight
10 g
Data transfer rate
Sequential read: 2150 MB/s
Sequential write: 1200 MB/s
Power
Power-up: N/A
Read: 4 W
Write: 5.1 W
Standby: 700 mW
Idle: 70 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1000 G peak (operating)
Optical drives
HP Slim SuperMulti DVD Writer Drive
Specification
Description
Height
12.7 mm (0.5 in)
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Disc recording capacity
Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x L)
128 x 12.7 x 127 mm (5.04 x 0.5 x 5 in) without bezel
Weight
190 g (0.42 lb)
Write speeds
DVD-RAM: Up to 5x
DVD-R DL: Up to 6x
DVD+R: Up to 8x
DVD+RW: Up to 8x
DVD+R DL: Up to 6x
DVD-R: Up to 8x
DVD-RW: Up to 6x
CD-R: Up to 24x
CD-RW: Up to 24x
Read speeds
DVD-RAM: Up to 5x
DVD-RW, DVD+RW: Up to 8x
DVD-R DL, DVD+R DL: Up to 8x
DVD+R, DVD-R: Up to 8x
DVD-ROM DL, DVD-ROM: Up to 8x
CD-ROM, CD-R: Up to 24x
CD-RW: Up to 24x
Access time (typical)
Random: DVD-ROM and CD-ROM 170 ms
Full stroke: DVD-ROM and CD-ROM 320 ms
Stop time: 6 seconds
Power
Source: Slimline SATA DC power receptacle
DC power requirement: 5 VDC ± 5%-100 mV ripple p-p
DC current: 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental (non-condensing)
Temperature: 5° to 50° C (41° to 122° F)
Relative humidity: 10% - 80%
Maximum wet bulb temperature: 29° C (84° F)
HP Slim Blu-ray BDXL Drive
Specification
Description
Height
12.7 mm (0.5 in)
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Disc recording capacity
Up to 128 GB QL, 100 GB TL, 50 GB DL or 25 GB standard SL
Dimensions (W x H x L)
128 x 12.7 x 127 mm (5.04 x 0.5 x 5 in) without bezel
Weight
170 g (0.37 lb)
Write speeds
Triple-layer
Quadruple-layer
BD-R
Up to 4x
Up to 4x
BD-RE
Up to 2x
Note supported
Single-layer
Double-layer
BD-R
Up to 6x
Up to 6x
BD-RE
Up to 2x
Up to 2x
DVD-R
Up to 8x
Up to 6x
DVD-RW
Up to 6x
Not supported
DVD+R
Up to 8x
Up to 6x
DVD+RW
Up to 8x
Not supported
DVD-RAM
Up to 5x
CD-R
Up to 24x
CD-RW
Up to 24x
Triple-layer
Quadruple-layer
BD-R
Up to 4x
Up to 4x
BD-RE
Up to 4x
Note supported
Read speeds
Single-layer
Double-layer
BD-ROM
Up to 6x
Up to 6x
BD-R
Up to 6x
Up to 6x
BD-RE
Up to 6x
Up to 6x
DVD-ROM
Up to 8x
Up to 8x
DVD-R
Up to 8x
Up to 8x
DVD-RW
Up to 8x
DVD+R
Up to 8x
Up to 8x
DVD+RW
Up to 8x
BDMV (AACS Compliant Disc)
Up to 6x/2x (Read/Play)
DVD-RAM
Up to 5x
DVD-Video (CSS Compliant Disc)
Up to 8x/4x (Read/Play)
CD-R/RW/ROM
Up to 24x
CD-DA (DAE)
Up to 20x/10x (Read/Play)
Access time (typical)
Random
BD-ROM: 350 ms
DVD-ROM: 185 ms
CD-ROM: 165 ms
Full stroke
BD-ROM: 350 ms
DVD-ROM: 345 ms
CD-ROM: 340 ms
Power
Source: Slimline SATA DC power receptacle
DC power requirement: 5 VDC ± 5%-100 mV ripple p-p
DC current: 5 VDC -1200 mA typical, 2000 mA maximum
Environmental (non-condensing)
Temperature: 5° to 50° C (41° to 122° F)
Relative humidity: 10% - 80%
Maximum wet bulb temperature: 29° C (84° F)
HP Slim DVD-ROM Drive
Specification
Description
Height
12.7 mm (0.5 in)
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Dimensions (W x H x L)
128 x 12.7 x 127 mm (5.04 x 0.5 x 5 in) without bezel
Weight
170 g (0.37 lb)
Read speeds
DVD+R/-R/+RW/ -RW/+R DL /-R DL: Up to 8x
DVD-ROM: Up to 8x
CD-ROM,CD-R: Up to 24x
CD-RW: Up to 24x
Access time (typical)
Random
DVD-ROM: 170 ms
CD-ROM: 170 ms
Full stroke
DVD-ROM: 320 ms
CD-ROM: 320 ms
Power
Source: Slimline SATA DC power receptacle
DC power requirement: 5 VDC ± 5%-100 mV ripple p-p
DC current: 5 VDC - < 1000 mA typical, < 1600 mA maximum
Environmental (non-condensing)
Temperature: 5° to 50° C (41° to 122° F)
Relative humidity: 10% - 80%
Maximum wet bulb temperature: 29° C (84° F)
Networking and communications
Intel I219LM gigabit network connection LOM
Specification
Description
Connector
RJ-45
System interface
PCIe + SMBus
Controller
Intel I219LM Gigabit Ethernet Controller
Data rates supported
Supports operation at 10/100/1000 Mb/s data rates
IEEE compliance
IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASETX, and 10BASET applications (802.3ab, 802.3u, and 802.3i, respectively).
IEEE 802.3az support [Low Power Idle (LPI) mode]
IEEE 802.3u auto-negotiation conformance
Performance
Jumbo Frames (up to 9 kB)
802.1Q & 802.1p
Receive Side Scaling (RSS)
Two Queues (Tx & Rx)
Power
Ultra Low Power at cable disconnect enables platform support for connected standby
Reduced power consumption during normal operation and power down modes
Integrated Intel Auto Connect Battery Saver (ACBS)
Single-pin LAN Disable for easier BIOS implementation
Fully integrated Switching Voltage Regulator (iSVR)
Low Power Link-Up (LPLU)
MAC/PHY interconnect
PCIe-based interface for active state operation (S0 state)
SMBus-based interface for host and management traffic (Sx low power state)
Management interface
MDC/MDIO management interface
Security and manageability
Intel vPro support with appropriate Intel chipset components
Intel Ethernet I210-T1 gigabit network adapter
Specification
Description
Connector
RJ-45
System interface
PCIe + SMBus
Controller
Intel I210 Gigabit Ethernet Controller
Memory
Integrated Dual 48K configurable transmit receive FIFO Buffers
Data rates supported
10/100/1000 Mbps
IEEE compliance
802.1P
802.1Q
802.2
802.3
802.3AB
802.3u
802.3x flow control
Bus architecture
PCI-E 2.1
Data path width
Bus-master DMA
Hardware certifications
FCC, B, CE, TUV-c, TUVus Mark Canada and United States, TUV-GS Mark for European Union
Power requirement
Aux 3.3 V, 3.0 Watts in 1000 base-T and 1.0 Watts in 100 Base-T
Boot ROM support
Yes
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
Network transfer rate
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI bus)
Environmental
Operating temperature: 0° to 55° C (32° to 132° F)
Operating humidity: 85% at 55° C (131° F)
Management
WOL, PXE, DMI, WFM 2.0
Broadcom BCM943228Z 802.11n 2x2 DualBand combo PCIe x1 card
Specification
Description
Wireless LAN standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Interoperability
Wi-Fi certified
Frequency band
802.11b/g/n
  • 2.402 - 2.482 GHz
      note:
    The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
802.11a/n
  • 4.9 - 4.95 GHz (Japan)
  • 5.15 - 5.25 GHz
  • 5.25 - 5.35 GHz
  • 5.47 - 5.725 GHz
  • 5.47 - 5.85 GHz
      note:
    Band not supported in Indonesia
Antenna structure
2 transmit
2 receive
Data rates
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
Modulation
Direct Sequence Spread Spectrum
CCK, BPSK, QPSK, 16-QAM, 64-QAM
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
Sub-channels
Multinational support with frequency bands and channels compliant to local regulations
Network architecture models
Ad-hoc (peer to peer)
Infrastructure (access point required)
Roaming
IEEE 802.11 compliant roaming between band Access Points
Output power
802.11b: +16 dBm minimum
802.11g: +14 dBm minimum
802.11a: +14 dBm minimum
802.11n HT20 (2.4 GHz): +13 dBm minimum
802.11n HT40 (2.4 GHz): +13 dBm minimum
802.11n HT20 (5 GHz): +12 dBm minimum
802.11n HT40 (5 GHz): +12 dBm minimum
Power consumption
Transmit: 2.0 W (max)
Receive: 1.6 W (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver sensitivity
802.11b, 1Mbps: -94dBm maximum
802.11b, 11Mbps: -86dBm maximum
802.11g, 6Mbps: -88dBm maximum
802.11g, 54Mbps: -74dBm maximum
802.11a, 6Mbps: -86dBm maximum
802.11a, 54Mbps: -72dBm maximum
802.11n, MCS07: -69dBm maximum
802.11n, MCS15: -66dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO and Bluetooth communications
Form factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22 x 30 mm
Type 1630: 2.3 x 16 x 30 mm
Weight
Type 2230: 2.8 g
Type 1630: 2 g
Operating voltage
3.3v +/- 9%
Temperature
Operating: -10° to 70° C (14° to 158° F)
Non-operating: -40° to 80° C (-40° to 176° F)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 3,048 m (10,000 ft)
Non-operating: 0 to 15,240 m (50,000 ft)
LED activity
LED Amber - Radio OFF; LED White - Radio ON
HP Integrated Module with Bluetooth 4.0+EDR wireless technology
Specification
Description
Bluetooth specification
4.0+EDR compliant
Frequency band
2402 to 2480 MHz
Number of available channels
79 (1 MHz) available channels
Data rates and throughput
3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric or 1306.9 kbps symmetric
Transmit power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR
Receiver sensitivity
Modulation
0.01% BER
0.001% BER
GFSK
-80 dBm
-70 dBm
π/4-DQPSK
-80 dBm
-70 dBm
8DPSK
-80 dBm
-70 dBm
Power consumption
Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range
Up to 10 m (33 ft)
Electrical interface
USB 2.0 compliant
Bluetooth software supported link topology
Microsoft Windows Bluetooth Software
Electrical interface Bluetooth software supported
Point to Point, Multipoint Pico Nets up to 7 slaves
Full support of Bluetooth Security Provisions
Power management certifications
Microsoft Windows ACPI, and USB Bus Support
Self-configurable to optimize power conservation in all operating modes, including Standby, Hold, Park, and Sniff
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
Security
All necessary regulatory approvals for supported countries, including FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications Bluetooth profiles supported
UL, CSA, and CE Mark Serial Port Profile (SPP)
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)
Generic Object Exchange Profile (GOEP)
Object Push Profile (OPP)
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)
Personal Area Networking Profile (PAN)
Human Interface Device Profile (HID)
FAX Profile (FAX)
Basic Imaging Profile (BIP)
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Intel 7265 802.11ac 2x2 DualBand combo PCIe x1 card
Specification
Description
Wireless LAN standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability
Wi-Fi certified
Frequency band
802.11b/g/n
  • 2.402 - 2.482 GHz
      note:
    The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
802.11a/n
  • 4.9 - 4.95 GHz (Japan)
  • 5.15 - 5.25 GHz
  • 5.25 - 5.35 GHz
  • 5.47 - 5.725 GHz
  • 5.825 - 5.85 GHz
      note:
    Band not supported Indonesia
Data rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: MCS 0 ~ MCS 15, (20 MHz, and 40 MHz)
802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20 MHz, 40 MHz, and 80 MHz)
Modulation
Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security
IEEE and Wi-Fi compliant 64/128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
Network architecture models
Ad-hoc (peer to peer)
Infrastructure (access point required)
Roaming
IEEE 802.11 compliant roaming between access points
Output power
802.11b: +16 dBm minimum
802.11g: +14 dBm minimum
802.11a: +14 dBm minimum
802.11n HT20 (2.4 GHz): +13 dBm minimum
802.11n HT40 (2.4 GHz): +13 dBm minimum
802.11n HT20 (5 GHz): +12 dBm minimum
802.11n HT40 (5 GHz): +12 dBm minimum
802.11ac 80 MHz (5 GHz): +11 dBm minimum
Power consumption
Transmit: 2.0 W (max)
Receive: 1.6 W
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver sensitivity
802.11b, 1Mbps: -94 dBm maximum
802.11b, 11Mbps: -86 dBm maximum
802.11g, 6Mbps: -88 dBm maximum
802.11g, 54Mbps: -74 dBm maximum
802.11a, 6Mbps: -86 dBm maximum
802.11a, 54Mbps: -72 dBm maximum
802.11n, MCS07: -69 dBm maximum
802.11n, MCS15: -66 dBm maximum
802.11ac, 1SS, MCS-0: -86 dBm maximum
802.11ac, 1SS, MCS-9: -61 dBm maximum
802.11ac, 2SS, MCS-0: -83 dBm maximum
802.11ac, 2SS, MCS-9: -58 dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form factor
PCI-express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22 x 30 mm
Type 1630: 2.3 x 16 x 30 mm
Weight
Type 2230: 2.8 g
Type 1630: 2 g
Operating voltage
3.3v +/- 9%
Temperature
Operating: –10° to 70° C (14° to 158° F)
Non-operating: –40° to 80° C (–40° to 176° F)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 3,048 m (10,000 ft)
Non-operating: 0 to 15,240 m (50,000 ft)
LED activity
LED Amber – Radio OFF; LED White – Radio ON
HP integrated module with Bluetooth 4.0+EDR wireless technology
Specification
Description
Bluetooth specification
4.0+EDR compliant
Frequency band
2402 to 2480 MHz
Number of channels
79 (1 MHz) available channels
Data rates and throughput
3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric or 1306.9 kbps symmetric
Transmit power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR
Receiver sensitivity
Modulation
0.01% BER
0.001% BER
GFSK
-80 dBm
-70 dBm
π/4-DQPSK
-80 dBm
-70 dBm
8DPSK
-80 dBm
-70 dBm
Power consumption
Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range
Up to 10 m (33 ft)
Electrical interface
USB 2.0 compliant
Bluetooth software supported link topology
Microsoft Windows Bluetooth Software
Electrical interface Bluetooth software supported security
Point to Point, Multipoint Pico Nets up to 7 slaves
Full support of Bluetooth Security Provisions
Power management certifications
Microsoft Windows ACPI, and USB Bus Support
Self-configurable to optimize power conservation in all operating modes, including Standby, Hold, Park, and Sniff
Security
All necessary regulatory approvals for supported countries, including FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power management certifications
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950
Certifications Bluetooth profiles supported
UL, CSA, and CE Mark
Serial Port Profile (SPP)
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)
Generic Object Exchange Profile (GOEP)
Object Push Profile (OPP)
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)
Personal Area Networking Profile (PAN)
Human Interface Device Profile (HID)
FAX Profile (FAX)
Basic Imaging Profile (BIP)
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Intel 8260 2x2 dual band 802.11ac WLAN/Bluetooth combo
Specification
Description
Wireless LAN standards
IEEE 802.11 ac/a/b/g/n
Interoperability
Wi-Fi certification
WLAN + Bluetooth Combo M.2 Card device shall meet all of the requirements to support Bluetooth 4.1 and backwards compatible with 2.1 with EDR
Frequency band
802.11b/g/n
  • 2.402-2.482 GHz
802.11a/n/ac
  • 4.9 - 4.95 GHz (Japan)
  • 5.15 - 5.25 Ghz
  • 5.25 - 5.35 GHz
  • 5.47 - 5.725 GHz
  • 5.825 - 5.85
      note:
    Band not supported in Indonesia
Antenna interface
With antennas installed in the system, the antenna peak gain is less than +3dBi in the 2.4GHz band and less than +4dBi in the 5GHz band to allow the device to meet regulatory limits.
Data rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80 MHz channels. 433Mbps for 1x1 and 867Mbps for 2x2
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through V5
WAPI
Roaming
802.11r Fast Roaming
Output power (transmitting)
802.11b: +16 dBm minimum
802.11g: +14 dBm minimum
802.11a: +14 dBm minimum
802.11n HT20 (2.4 GHz): +14 dBm minimum
802.11n HT40 (2.4 GHz): +12 dBm minimum
802.11n HT20 (5 GHz) : +14 dBm minimum
802.11n HT40 (5 GHz): +12 dBm minimum
Power consumption
Transmit: 2.0 Watts
Receive: 1.6 Watts
Idle mode (PSP): 180 mW (WLAN associated)
Idle mode: 50 mW (WLAN unassociated)
Connect Standby 10mW (WLAN+BT)
Radio off: 5 mW
Bluetooth power consumption
Peak operating: 330 mW
Receive: 230 mW
USB selective suspend: 17 mW
Power management
The product conforms to the ACPI and PCI Express M.2 bus methods to manage power of the WLAN components
Supports all 802.11 compliant power-save modes. These include the basic Power Save Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in 802.11e
Receiver sensitivity for FER < 10%
802.11b, 1Mbps: -94 dBm maximum
802.11b, 11Mbps: -86 dBm maximum
802.11a/g, 6Mbps: -88 dBm maximum
802.11a/g, 54Mbps : -74 dBm maximum
802.11n, MCS07: -69 dBm maximum
802.11n, MCS15: -66 dBm maximum
802.11ac, 1SS, MCS-0: -86 dBm maximum
802.11ac, 1SS, MCS-9: -61 dBm maximum
802.11ac, 2SS, MCS-0: -83 dBm maximum
802.11ac, 2SS, MCS-9: -58 dBm maximum
Form factors
PCI Express M.2 form factor
Operating voltage
The card will be powered by a 3.3V, ± 9% supply from the host system
Temperature
Operating: -10° to 70° C (14° to 158° F)
Non-operating: -40° to 80° C (-40° to 176° F)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 3,048 m (10,000 ft)
Non-operating: 0 to 15,240 m (50,000 ft)
Intel 3165 1x1 Dual Band 802.11ac WLAN/ Bluetooth combo
Specification
Description
Wireless LAN standards
IEEE 802.11 ac/a/b/g/n
Interoperability
Wi-Fi certification
WLAN + Bluetooth Combo M.2 Card device shall meet all of the requirements to support Bluetooth 4.1 and backwards compatible with 2.1 with EDR
Frequency band
802.11b/g/n
  • 2.402-2.482 GHz
802.11a/n/ac
  • 4.9 - 4.95 GHz (Japan)
  • 5.15 - 5.25 Ghz
  • 5.25 - 5.35 GHz
  • 5.47 - 5.725 GHz
  • 5.825 - 5.85
      note:
    Band not supported in Indonesia
Antenna interface
With antennas installed in the system, the antenna peak gain is less than +3dBi in the 2.4GHz band and less than +4dBi in the 5GHz band to allow the device to meet regulatory limits.
Data rates
02.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported
802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80 MHz channels. 433Mbps for 1x.
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through V5
WAPI
Roaming
802.11r Fast Roaming
Output power (transmitting)
802.11b: +16 dBm minimum
802.11g: +14 dBm minimum
802.11a: +14 dBm minimum
802.11n HT20 (2.4 GHz): +14 dBm minimum
802.11n HT40 (2.4 GHz): +12 dBm minimum
802.11n HT20 (5 GHz) : +14 dBm minimum
802.11n HT40 (5 GHz): +12 dBm minimum
Power consumption
Transmit: 2.0 Watts
Receive: 1.6 Watts
Idle mode (PSP): 180 mW (WLAN associated)
Idle mode: 50 mW (WLAN unassociated)
Connect Standby 10mW (WLAN+BT)
Radio off: 5 mW
Bluetooth power consumption
Peak operating: 330 mW
Receive: 230 mW
USB selective suspend: 17 mW
Power management
The product conforms to the ACPI and PCI Express M.2 bus methods to manage power of the WLAN components
Supports all 802.11 compliant power-save modes. These include the basic Power Save Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in 802.11e
Receiver sensitivity for FER < 10%
802.11b, 1Mbps: -94 dBm maximum
802.11b, 11Mbps: -86 dBm maximum
802.11a/g, 6Mbps: -88 dBm maximum
802.11a/g, 54Mbps : -74 dBm maximum
802.11n, MCS07: -69 dBm maximum
802.11n, MCS15: -66 dBm maximum
802.11ac, 1SS, MCS-0: -86 dBm maximum
802.11ac, 1SS, MCS-9: -61 dBm maximum
802.11ac, 2SS, MCS-0: -83 dBm maximum
802.11ac, 2SS, MCS-9: -58 dBm maximum
Form factors
PCI Express M.2 form factor
Operating voltage
The card will be powered by a 3.3V, ± 9% supply from the host system
Temperature
Operating: -10° to 70° C (14° to 158° F)
Non-operating: -40° to 80° C (-40° to 176° F)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 3,048 m (10,000 ft)
Non-operating: 0 to 15,240 m (50,000 ft)
Audio
High definition audio
Specification
Description
Type
Integrated
HD stereo codec
Conexant 2-channel CX5001 codec
Audio I/O ports
Side headphone
Side headphone/microphone/line-in (function is configurable by audio driver; re-task able to provide headphone, microphone, or line-in)
Rear line-out
All ports are 3.5 mm
Internal speaker amplifier
2W amplifier for the internal speaker only. External speakers must be powered externally.
Multi-streaming capable
Multi-streaming can be enabled in the DTS control panel
Sampling
44.1 kHz - 192 kHz
Wavetable syntheses
Yes - uses OS soft wavetable
Analog audio
Yes
Number of channels on line-out
Stereo (left and right channels)
Internal speakers
Yes
External speaker jack
Yes

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