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SUPPORT COMMUNICATION- PRODUCT CHANGE NOTIFICATION

Document ID: c03614649

Version: 1

NOTEBOOK - System BIOS Update F.34 for 2570p

Release date : 21-Dec-2012

Last updated : 21-Dec-2012

DETAILS OF CHANGE
  • Added support to always bypass the power-on password on warm boots by using the Windows Management Instrumentation (WMI) interface.
  • Fixed an issue where when pressing the esc key at POST would interrupt the normal boot process to the Windows operating system.
  • Combined the WWAN and GPS devices as one component in the F10 (BIOS) Setup.
  • Removed TPM power on authentication support.
  • Fixed an issue where some F10 (BIOS) Setup settings are missing from the WMI interface.
  • Updated the BIOS System Diagnostics to version 1.6.
  • Fixed an issue where some USB keyboards would not work at POST environment when attached to a docking station.

sourceInformation

REASON FOR CHANGE
To implement changes under "Details of Change."
IMPACT OF CHANGE
After upgrading to this BIOS version, the system will not be able to downgrade to versions older than F.30 if the Secure Boot option has been enabled in F10 (BIOS) Setup. After upgrading to this BIOS version, it is recommended that the user restores the defaults in F10 (BIOS) Setup.
Components affected:
HP EliteBook 2570p Notebook PC

DATE OF CHANGE

Effective date : 14-Dec-2012

Hardware platforms affected : HP EliteBook 2570p Notebook PC

HP Inc. shall not be liable for technical or editorial errors or omissions contained herein.The information provided is provided "as is" without warranty of any kind.To the extent permitted by law, neither HP or its affiliates, subcontractors or suppliers will be liable for incidental, special or consequential damages including downtime cost; lost profits; damages relating to the procurement of substitute products or services; or damages for loss of data, or software restorationThe information in this document is subject to change without notice.HP Inc. and the names of HP products referenced herein are trademarks of HP Inc. in the United States and other countries.Other product and company names mentioned herein may be trademarks of their respective owners.

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