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HP Z240 Small Form Factor Workstation Specifications

Product image

Figure : HP Z240 Small Form Factor Workstation
HP Z240 Small Form Factor Workstation

System board

Specification
Description
System board form factor
ATX 24.38 x 24.38 mm (9.6 x 9.6 in)
Processor socket
Single LGA 1151
CPU bus speed
DMI
Chipset
Intel PCH C236
Memory expansion slots
4 DDR4 memory slots
Memory type supported
DDR4, UDIMM (unbuffered), ECC and non-ECC
Memory modes
Non-Interleaved for single channel. Interleaved when both channels are populated.
Memory speed supported
2133MT/s DDR4
Memory protection
ECC available on data
Maximum memory
64 GB
Memory configuration
4GB, 8GB and 16GB non-ECC/4GB, 8GB and 16GB ECC unbuffered DIMMs are supported. ECC and non-ECC memory DIMMs cannot be mixed on the same system.
PCI express connectors
1 PCI Express Gen3 slot x 1 mechanical/ x 1 electrical (LP, half length)
1 PCI Express Gen3 slot x 16 mechanical/ x 16 electrical (LP, half length)
1 PCI Express Gen3 slot x 1 mechanical/ x 1 electrical (LP, half length)
1 PCI Express Gen3 slot x 16 mechanical/ x 4 electrical (LP, half length)
note:
In the PCIe Gen3 (x 16 electrical/x 16 mechanical) slot, if it is not being used for a graphics card, only cards certified as After Market Options for this platform are supported.
Supported drive interfaces
SATA: Integrated (4) Serial ATA interfaces (6 Gb/s SATA). One port can optionally be used for eSATA. RAID 0 and 1 supported. Factory integrated RAID is Microsoft Windows only. RAID 5 is supported by Software XOR.
Serial Attached SCSI: None.
Integrated RAID:
note:
Requires identical hard drives (speeds, capacity, interface)
Integrated graphics:
  • Intel HD Graphics 530 (on Core i3/i5/i7-6xxx processors); Intel Integrated Graphics for Xeon processors
  • Based on Unified Memory Architecture (UMA) - a region of system memory is reserved and dedicated to the graphics display.
  • Support for Microsoft DirectX 11, OpenGL 4.0 and OpenCL 1.2 on Intel HD Graphics P530
  • 3 DP 1.2 graphics ports integrated in motherboard; Supports up to three simultaneous displays across DP outputs. Max resolution supported: 3840 x 2160 at 60Hz
Network Controller: Integrated Ethernet PHY Connection I219LM. Management capabilities: WOL, PXE 2.1 and AMT 9
IDE connector: No
Floppy connector: No
Serial: 1 rear port
2nd Serial: Yes (optional serial port adapter kit required)
Parallel: 1 internal header (optional parallel port adapter required)
HD integrated audio: Yes
USB Connectors
Front: 2 USB 3.0, 2 USB 2.0
Rear: 6 USB 3.0
Internal: 1 USB 3.0, 2 USB 2.0
HD integrated audio
Yes
Flash ROM
Yes
Chassis fan header
N/A
Front control panel/speaker header
Yes
CMOS battery holder - lithium
Yes
Integrated trusted platform module
Integrated TPM 1.2.
Power supply headers
Yes
Power switch, power LED & hard drive LED header
Yes
Clear password jumper
Yes
Keyboard/mouse
USB or PS/2
Operating voltage range
90-264 VAC
Rated voltage range
100-240 VAC
Rated line frequency
50-60 Hz
Operating line frequency range
47-63 Hz
Rated input current
4A at 100-240 V
Heat dissipation
Typical: 444 btu/hr (112 kcal/hr)
Maximum: 890 btu/hr (224 kcal/hr)
Power supply fan
70 mm x 70 mm x 25 mm 4-wire PWM
ENERGY STAR qualified (config dependent)
Yes
FEMP standby power compliant
Yes, with wake-on-LAN disabled: <2W in 55 - Power Off
Surge tolerant full ranging power supply (withstands power surges up to 2000 V)
Yes
Hood lock header
Yes
DrP Lot 6- Tier 2 Compliance at 230 V
Yes
Environmental requirements
Temperature:
Operating: 5° to 35° C (40° to 95° F)
Non-operating: -40° to 60° C (-40° to 140° F)
Maximum altitude
Operating: 3,000 m (10,000 ft)
Non-operating: 9,100 m (30,000 ft)
Humidity:
Operating: 8% to 85% RH (non-condensing)
Non-operating: 8% to 90%
Shock
Operating: 40 g, 2-3 ms, half-sine
Non-operating: 160 cm/s, 2-3 ms, (~100g) Square: 422 cm/s, 20 g
Cooling
Above 1524 m (5,000 ft) altitude, maximum operating temperature is de-rated by 1° C (1.8° F) per 305 m (1000 ft) elevation increase.

Physical security and serviceability

Specification
Description
Access panel
Tool-less
Includes system board and memory information
Hard drives
Tool-less (internal bays)
Expansion cards
Tool-less
Processor socket
Tool-less, except for the processor heatsink
Green user touch points
Yes, on tool-less internal chassis mechanisms
Color-coordinated cables and connectors
Yes
Memory
Tool-less
System board
Screw-in
Dual color power and HD LED on front of computer
Yes.
Configuration record SW
Yes
Over-temp warning on screen
Yes
Restore CD/DVD set
Consists of an operating system DVD (OSDVD) and a driver DVD (DRDVD). OSDVD restores the original operating system. DRDVD will provide all drivers for the system. The DRDVD may also contain applications that originally shipped with the system for optional installation. Applications can also be obtained from HP.com. OSDVD and DRDVD are orderable with the system and available from HP Support.
Dual function front power switch
Yes, causes a fail-safe power off when held for 4 seconds
Padlock support
Yes (optional): Locks side cover and secures chassis from theft
0.22 in diameter padlock loop at rear of system
Cable lock support
Yes, Kensington Cable Lock (optional): Locks side cover and secures chassis from theft 3 x 7 mm slot at rear of system
Universal chassis clamp lock support
Yes (optional): Locks side cover and locks cables to chassis. Secures chassis from theft and allows multiple units to be chained together when used with optional cable Threaded feature at rear of system
Solenoid lock and hood sensor
Yes (optional)
The Solenoid Hood Lock eliminates the need for a physical key by making the chassis lockable through software and a password. You can also lock and unlock the chassis remotely over the network. The Sensor Kit detects when the access panel has been removed.
Rear port control cover
Yes, locks rear IO cables to prevent cable theft
Serial, parallel, USB, audio, network, enable/disable port control
Yes, enables or disables serial, USB, audio, and network ports
Removable media write/boot control
Yes, prevents ability to boot from removable media on supported devices (and can disable writes to media)
Power-on password
Yes, prevents an unauthorized person from booting up the workstation
Setup password
Yes, prevents an unauthorized person from changing the workstation configuration
NIC LEDs (integrated) (Green & Amber)
Yes
3.3V aux power LED on system PCA
No
CPUs and heatsinks
A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be removed. CPU removal is tool-less
Power Supply Diagnostic LED
No
Front power LED
Yes, white (normal), red (fault)
Front hard drive activity LED
Yes, white
Front ODD activity LED
Yes
Internal speaker
Yes
System/emergency ROM flash recovery
Recovers corrupted system BIOS
Cooling solutions
Air cooled forced convection
Power supply fans
70 x 70 x 25 mm (2.75 x 2.75 x 0.98 in)4-wire PWM (non-serviceable)
CPU heatsink fan
Mainstream (<=65W): 93 x 86 x 75.8 mm (3.66 x 3.38 x 2.98 in)
Performance: (<=95W): 93 x 102.7 x 75.8 mm (3.66 x 4.04 x 2.98 in)
Chassis fan
CPU heatsink fan also operates as the chassis fan.
Memory heatsink fan
No
HP PC Hardware Diagnostics UEFI
HP PC Hardware Diagnostics (UEFI) enables hardware level testing outside the operating system on many components. The diagnostics can be invoked by pressing F2 at POST, and is available as a download from HP Support.
Access panel key lock
No
ACPI-ready hardware
Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode and controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system
Trusted platform module chip
Yes
Integrated chassis handles
No
Power supply
Requires T15 Torx or flat blade screwdriver
PCI card retention
Yes, rear (all), middle (none), front (none)
CMOS battery holder
Yes
DIMM connectors
Yes
Flash ROM
Yes
Diagnostic power switch LED on board
Yes
Clear password jumper
Yes
Clear CMOS button
Yes

BIOS

Specification
Description
BIOS 32-bit services
Standard BIOS 32-bit Service Directory Proposal v0.4
PCI 3.0 support
Full BIOS support for PCI Express through industry standard interfaces..
ATAPI
ATAPI Removable Media Device BIOS Specification Version 1.0.
BBS
BIOS Boot Specification v1.01.
Provides more control over how and from what devices the workstation will boot.
WMI support
WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM) and WBEM specifications.
BIOS power on
Users can define a specific day-of-week and time for the system to power on.
ROM Based Computer Setup Utility (F10)
Review and customize system configuration settings controlled by the BIOS
System/emergency ROM flash recovery with video
Recovers system BIOS in corrupted Flash ROM
Replicated setup
Saves BIOS settings to USB flash device in human readable file. Repset.exe utility can then replicate these settings on machines being deployed without entering Computer Configuration Utility (F10 Setup)
SMBIOS
System Management BIOS 2.7.1, for system management information
Boot control
Disables the ability to boot from removable media on supported devices
Memory change alert
Alerts management console if memory is removed or changed
Thermal alert
Monitors the temperature state within the chassis.
Three modes:
  • NORMAL - normal temperature ranges
  • ALERTED - excessive temperatures are detected, raises a flag so action can be taken to avoid shutdown or provide for a smoother system shutdown.
  • SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the computer without warning before hardware component damage occurs.
Remote ROM flash
Provides secure, fail-safe ROM image management from a central network console.
Updates can be performed before starting the OS. Updates can be periodically scheduled.
ACPI (Advanced Configuration and Power Management Interface)
Allows the system to enter and resume from low power modes (sleep states). Enables an operating system to control system power consumption based on the dynamic workload.
Makes it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. Supports ACPI 4.0 for full compatibility with 64-bit operating systems.
Ownership Tag
A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen.
Remote Wakeup/Remote Shutdown
System administrators can power on, restart, and power off a client computer
ASF 2.0 Compliant
No
Instantly Available PC (Suspend to RAM - ACPI sleep state S3)
Allows for very low power consumption with quick resume time
Remote System Installation via F12 (PXE 2.1) (Remote Boot from Server)
Allows a new or existing system to boot over the network and download software, including the operating system
ROM revision levels
Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is available through an industry standard interface (SMBIOS) so that management SW applications can use and report this information
System board revision level
Allows management SW to read revision level of the system board. Revision level is digitally encoded into the HW and cannot be modified
Start-up Diagnostics (Power-on Self-Test)
Assesses system health at boot time with selectable levels of testing.
Auto Setup when new hardware installed
System automatically detects addition of new hardware.
Keyboard-less Operation
The system can be booted without a keyboard.
Localized ROM Setup
Common BIOS image supports System Configuration Utility (F10 Setup) menus in 12 languages with local keyboard mappings.
Asset Tag
The user or IT administrator to set a unique tag string in non-volatile memory.
Per-slot Control
Allows I/O slot parameters (option ROM enable/disable) to be configured individually.
Adaptive cooling
Control parameters are set according to detected hardware configuration for optimal acoustics.
Pre-boot diagnostics
(Pre-video) critical errors are reported via beeps and blinks on the power LED.
Intel Active Management Technology (AMT)
AMT 11.0; Allows workstation status to be monitored on a remote console
Digitally and Cryptographically Signed BIOS
Helps to prevent the installation of unauthorized versions of a BIOS (a rogue BIOS) from a virus, malware, or other code that could lead to compromised system security, data access, physical service, or even system board replacement.
Master Boot Record Protection
A feature in the HP BIOS that prevents changes and/or infections to the Master Boot Record. Useful in protecting from viruses.
Boot Block Emergency Recovery Mode (BIOS Recovery)
The HP BIOS offers a write-protected boot block ROM that provides recovery from a failed flashing of the computer BIOS. This special recovery mode prevents the system from becoming unusable or “bricked” when a BIOS update is interrupted.
Industry Standard
Revision Supported by the BIOS
UEFI specification revision
UEFI 2.4.0
ACPI
Advanced Configuration and Power Management Interface, Version 4.0
ASF
Alert Standard Format Specification, Version 2.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b
CD Boot
"El Torito" Bootable CD-ROM Format Specification Version 1.0
EDD
Enhanced Disk Drive Specification Version 1.1
BIOS Enhanced Disk Drive Specification Version 3.0
PCI Express
PCI Express Base Specification, Revision 2.0
PCI Express Base Specification, Revision 3.0.
PMM
POST Memory Manager Specification, Version 1.01
Serial ATA II: Extensions to Serial ATA 1.0, Revision 1.0a
Serial ATA II Cables and Connectors Volume 2 Gold
SATA-IO SATA Revision 3.0 Specification
SATA
Serial ATA Specification, Revision 1.0a
SPD
PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B
TPM
Trusted Computing Group TPM Specification Version 1.2 (TPM 2.0 via Firmware Update)
USB
Universal Serial Bus Revision 1.1 Specification
Universal Serial Bus Revision 2.0 Specification
Universal Serial Bus Revision 3.0 Specification

Manageability

Specification
Description
Intel Active Management Technology (AMT)
An advanced set of remote management features and functionality which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked client systems regardless of the system's health or power state. AMT 11.0 includes the following advanced management functions:
  • Power Management (on, off, standby, reset)
  • Hardware/Software Inventory (includes BIOS and firmware revisions
  • Hardware Alerting
  • Agent Presence
  • System Defense Filters
  • SOL (Serial Over LAN)
  • ME Wake-on-LAN
  • DASH 1.1 compliance
  • IPv6 Support
  • Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS screen, periodic connections, or alert triggered connection
  • Remote Scheduled Maintenance - pre-schedule when the PC connects to the IT or service provider console for maintenance. Remote PCs can get required patches, be inventoried, etc by connecting to their IT console or Service Provider when it's convenient
  • Remote Alerts - automatically alert IT or service provider if issues arise
  • Access Monitor - Provides oversight into Intel AMT actions to support security requirements
  • PC Alarm Clock
  • Protected Audio Video Path (PAVP)
  • Microsoft NAP Support
  • Host Base set-up and configuration
  • Management Engine (ME) firmware roll back
  • Enhanced KVM resolution (Up to 4K)
Intel vPro technology
The HP Z240 workstations support Intel vPro technology when purchased with a vPro technology capable CPU: Intel Xeon processor family or 6th Generation Intel Core i5/i7 processors with Intel VT-d/VT-x and Intel TXT technology
Service, support, and warranty
  • Program to proactively communicate Product Change Notifications (PCNs) and Customer Advisories by email to customers, based on a user-defined profile.
  • PCNs provide advance notification of hardware and software changes to be implemented in the factory providing time to plan for transition.
  • Customer Advisories provide concise, effective problem resolution, greatly reducing the need to call technical support.

Processors

Specification
Description
Processors
Intel CoreTM i7-6700 3.4 2133 4C CPU
Intel CoreTM i7-6600 3.3 2133 4C CPU
Intel CoreTM i7-6500 3.2 2133 4C CPU

Storage/hard drives

PCIe SSDs for HP workstations

Graphics

Optical and removable storage

Networking and communications

Supported drive interfaces

Specification
Description
SATA
Integrated (5) Serial ATA interfaces (6 Gb/s SATA). One port can optionally be used for eSATA.
RAID 0 and 1 supported. Factory integrated RAID is Microsoft Windows only.
Integrated graphics
Intel HD Graphics 530 (on Core i3/i5/i7-6xxx processors)
Intel Integrated Graphics for Xeon E3 processors
Based on Unified Memory Architecture (UMA) - A region of system memory is reserved and dedicated to the graphics display.
Support for Microsoft DirectX 11, OpenGL 4.0 and OpenCL 1.2 on Intel HD Graphics P530;.
Supports up to three simultaneous displays across DP outputs.
Max. resolution supported: 3840 x 2160 at 60Hz
Network controller
Integrated Ethernet PHY Connection I217LM. Management capabilities: WOL, PXE 2.1 and AMT 11.0

Physical specifications

Feature
Description
Dimensions (W x H x D)
100 x 338 x 381 mm (3.95 x 13.3 x 15 in)

Social and environmental

Specification
Description
Eco-Label Certifications and Declarations
This product is low halogen except for power cords, cables and peripherals. Service parts obtained after purchase may not be Low Halogen.
  • ENERGY STAR (energy-saving features available on selected configurations -Windows only)
  • US Federal Energy Management Program (FEMP)
  • China Energy Conservation Program (CECP)
  • IT ECO declaration
Batteries
The battery in this product complies with EU Directive 2006/66/EC
Battery size: CR2032 (coin cell)
Battery type: Lithium Metal
The battery in this product does not contain:
  • Mercury greater than 5ppm by weight
  • Cadmium greater than 10ppm by weight
  • Lead greater than 40ppm by weight
Restricted material usage
Restricted Material Usage This product meets the material restrictions specified in HP's General Specification for the Environment. HP is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.
Low halogen statement
This product is low halogen except for power cords, cables and peripherals, as well as the following customer-configurable internal components: Creative Recon3D PCIe Audio Card is not Low Halogen. Service parts obtained after purchase may not be Low Halogen.
End-of-Life management and recycling
HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. This product is greater than 90% recyclable by weight when properly disposed of at end of life.
Additional information
This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive - 2002/96/EC.
Plastic parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.
This product is >90% recycle-able when properly disposed of at end of life
EPEAT Gold registered in the U.S. EPEAT registration varies by country.
Packaging
HP Workstation product packaging meets the HP General Specification
  • Does not contain restricted substances listed in HP Standard 011-1 General Specification for the Environment
  • Does not contain ozone-depleting substances (ODS)
  • Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of 100 ppm sum total for all heavy metals listed
  • Maximizes the use of post-consumer recycled content materials in packaging materials
  • All packaging material is recyclable
  • All packaging material is designed for ease of disassembly
  • Reduced size and weight of packages to improve transportation fuel efficiency
  • Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards formatting
Internal
Cushions made from fabricated recycled expanded-polyethylene (EPE) or recycled expanded-polypropylene (EPP). May also be made from recycled molded paper-pulp (MPP).
External
Carton made from corrugated fiberboard with at least 25% recycled content.

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