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HP ProDesk 600 G2 Desktop Mini PC Specifications

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HP ProDesk 600 G2 Desktop Mini PC

Core processors

Specification
Description
Intel 6th generation processors
All HP ProDesk 600 G2 Business PC models featuring this technology include processors that are part of the Intel Stable Image Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP ProDesk and ProOne 600 G2 Business PC, thus making these models the most stable, secure, and manageable platforms available to enterprises today.
Intel Advanced Management Technology (AMT) v9.0 – an advanced set of remote management features and functionality which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked client systems regardless of the system's health or power state. AMT 9.0 includes the following advanced management functions:
  • Power management (on, off, reset)
  • Hardware inventory (includes BIOS and firmware revisions)
  • Hardware alerting
  • Agent presence
  • System defense filters
  • SOL/IDER
  • Cisco NAC/SDN support
  • ME Wake-on-LAN
  • DASH 1.1 compliance
  • IPv6 support
  • Fast call for help - a client inside or outside the firewall may initiate a call for help via BIOS screen, periodic connections, or alert triggered connection
  • Remote scheduled maintenance - pre-schedule when the PC connects to the IT or service provider console for maintenance. Remote PCs can get required patches, be inventoried, by connecting to their IT console or service provider when it's convenient
  • Remote alerts - automatically alert IT or service provider if issues arise
  • Access monitor - provides oversight into Intel AMT actions to support security requirements
  • PC alarm clock
  • Microsoft NAP support
  • Host base set-up and configuration
  • Management Engine (ME) firmware roll back
  • Wireless AMT functionality on Desktop (WoDT)
  • Enhanced KVM resolution

Graphics

Intel HP graphics (integrated)

Specification
Description
VGA controller
Integrated
Display port
Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and Multi-Stream Technology for a maximum of 3 displays (including the integrated panel)
Bus type
N/A
RAMDAC
N/A
Memory
Intel graphics do not have dedicated memory but utilizes some of the computer’s system memory The amount of memory used for graphics depending on the amount of system memory installed, BIOS settings, operating system, and system load. 32 MB is pre-allocated for graphics use at system boot time. Additional memory can be allocated at boot time by the BIOS for PAVP (Protected Audio Video Playback) support for playback of protected video content.
Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an optimal balance between graphics and system memory use.
Maximum graphics memory
Windows 7: Up to 1.7 GB
Windows 8.1: Up to 1.8 GB
Maximum color depth
32 bits/pixel
Graphics/video API support
6th generation core processors:
The Processor graphics contains a refresh of the seventh generation graphics core enabling substantial gains in performance and lower power consumption. Up to 16 EU support.
Next Generation Intel Clear Video Technology HD Support is a collection of video playback and enhancement features that improve the end user's viewing experience.
  • Encode/transcode HD content
  • Playback of high definition content including Blu-ray disc
  • Superior image quality with sharper, more colorful images
DirectX Video Acceleration (DXVA) support for accelerating video processing
  • Full AVC/VC1/MPEG2 HW Decode
Advanced Scheduler 2.0, 1.0
Windows 7, Windows 8, Linux OS Support
DirectX 11.1
Open GL 4.3
Open CL 1.2
Supported display resolutions and refresh rates
Resolution
Refresh rates
800 x 600
60 Hz
1024 x 768
60 Hz
1152 x 864
60 Hz
1280 x 600
60 Hz
1280 x 720
60 Hz
1280 x 960
60 Hz
1280 x 1024
60 Hz
1360 x 768
60 Hz
1366 x 768
60 Hz
1400 x 1050
60 Hz
1440 x 900
60 Hz
1600 x 900
60 Hz
1600 x 1200
60 Hz
1680 x 1050
60 Hz
1920 x 1080
60 Hz
1920 x 1200
60 Hz
1920 x 1440
60 Hz
2560 x 1440
60 Hz
2560 x 1600
60 Hz
3840 x 2160
60 Hz

AMD Radeon R9 350 1 GB PCIe x16

Specification
Description
Memory
2 GB 128-bit wide frame buffer operating at 1150 MHz
Controller clock speed
AMD Radeon R9 350 GPU operating at 925 MHz
Multidisplay support
A maximum of 4 displays are supported by the card. A maximum of 2 legacy displays (Native VGA, DVI, or displays connected with passive DisplayPort adapters are considered as legacy)
Graphics/API support
DIRECTX 11.1, Open GL 4.3, Open CL1.2, UVD 3
Output connectors
1 x Dual-Link DVI-I, 2x DisplayPort; Includes DVI to VGA adapter

NVIDIA GeForce GT 730 2 GB PCIe x8 graphics card

Specification
Description
Introduction
Get impressive graphics and high resolution dual-display performance in a low profile, PCI Express x8 graphics add-in card based on the NVIDIA Kepler Graphics Processor. Improve your everyday PC, Web conferencing, and video or photo editing.
Memory
2 GB DDR3 64-bit wide frame buffer operating at 900 MHz
Controller clock speed
NVIDIA Kepler GPU operating at 902 MHz
Multi-display support
A maximum of 4 displays are supported by the card
Graphics/API support
Microsoft DirectX 12, OpenGL 4.4 and OpenCL 2 APIs, Shade Model 5, UVD 4.2, VCE 2.0, and DirectCompute 11
Output connectors
1 x Dual-Link DVI-I, 1x DisplayPort; Includes DVI to VGA adapter Display Port output is multi-mode capable, support Audio, HBR2 and MST

Hard disk and solid state storage

120 GB SATA 2.5 non-SED SSD

Specification
Description
Unformatted capacity
120 GB
Architecture
Multi-level cell (MLC) NAND
Interface
Serial ATA 3.0 (6.0 Gb/s)
Form factor
2.5 inch
Height
Low profile, 7 mm height
Width
69.85 mm ± 0.25
Length
100.45 mm
Weight
Up to 78 g
Bandwidth performance
Sustained read: up to 540 MB/s
Sustained write: Up to 480 MB/s
Power consumption
Average read: < 3.7 W
Average write: 3.7 W
Standby: < 55 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms

120 GB SATA 2.5 in Opal2 SED Solid State Drive (Pro 2500)

Specification
Description
Unformatted capacity
120 GB
234,441,648 (total logical sectors)
Architecture
ATA 8 Compliant and SATA 3.0 compliant
Supports Mode 2 Multiword DMA
Supports Drive Failure Prediction
Supports SMART Offline Read Scan
Supports Mode 4 PIO
Supports Mode 5 UDMA
Supports HP Drive Protection System
ATA 8 ACS-2 Data / TRIM Support
Support DEVSLP feature
Supports TRIM Command per ATA8 / ACS 2
Supports FIPS-197 features
Support TCG Storage Architecture Core Specification 2.0
Interface
Serial ATA 3.0 (6.0 Gb/s)
Form factor
2.5 in
Height
Low profile, 7 mm height
Width
69.85 mm ± 0.25
Length
100.45 mm
Weight
78 g
Bandwidth performance
Sustained sequential read: up to 540 MB/s
Sustained sequential write: up to 480 MB/s
Power consumption
Average read: < 3.7 W
Write: 3.7 W
Standby: < 55 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms

128 GB SATA 2.5 in 3D non-SED Solid State Drive

Specification
Description
Unformatted capacity
128 GB
250,069,680 (user addressable sectors)
Architecture
Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface
Fully complies with ATA/ATAPI-7 Standard (Partially Complies with ATA/ATAPI-8)
Power Saving Modes: DIPM (Partial / Slumber mode)
Support NCQ : Up to 32 depth
Synchronous Signal Recovery
Interface
Serial ATA (6.0 Gb/s)
Form factor
2.5 in
Height
6.8 mm ± 0.2
Width
69.85 mm ± 0.25
Length
100.45 mm ± 0.25
Weight
54 g
Bandwidth performance
Sustained sequential read: up to 530 MB/s
Sustained sequential write: up to 140 MB/s
Power consumption
Average read: < 250 mW
Idle: 50 mW
Mean time between failures
1,500,000 hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms

128 GB SATA 2.5 in Opal2 SED Solid State Drive

Specification
Description
Unformatted capacity
128 GB
250,069,680 (user addressable sectors)
Architecture
Self-Encrypting (SED) Solid State Drive with NAND Flash and SATA interface
Trusted Computing Group(TCG) OPAL compliant encrypted solid state drive
Interface
Serial ATA (6.0 Gb/s)
Form factor
2.5 in
Height
6.8 mm ± 0.2
Width
69.85 mm ± 0.25
Length
100.2 mm ± 0.25
Weight
73 g
Bandwidth performance
Sustained sequential read: up to 520 MB/s
Sustained sequential write: up to 340 MB/s
Power consumption
Average read: < 250 mW
Idle: 50 mW
Mean time between failures
1,500,000 hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/0.5 ms

HP 128 GB SATA 2.5 in (non-SED) Solid state drive

Specification
Description
Unformatted capacity
128 GB
Architecture
Multi level cell (MLC) NAND
Interface
SATA 6 Gb/s
Dimensions (W x H x D)
6.985 x 0.7 x 10.05 cm (2.75 x 0.276 x 3.96 in)
Weight
73 g
Bandwidth performance
Sustained sequential read: up to 420 MB/s
Sustained sequential write: up to 260 MB/s
Random read: up to 46k IOPs
Random write: up to 56k IOPs
Latency
Read: 55 ms
Write: 55 ms
DC power requirement
4.5 V - 5.5 V
Total power consumption
Active: 160 mW
Idle: < 85 mW
Useful drive life
1.2 million device hours
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/1.0 msec
Regulations
UL, CSA, EN 60950-2000, CISPR Pub 22 Class B, CNS 13438, AS/NZS CISPR 22:2002 Class B, Korea KCC, CE Mark

Intel Pro 2500 180 GB Solid State Drive

Specification
Description
Unformatted capacity
180 GB
Architecture
Multi level cell (MLC) NAND
Interface
SATA 3.0 (6 Gb/s)
Dimensions (W x H x D)
6.985 x 0.7 x 10.05 cm (2.75 x 0.276 x 3.96 in)
Weight
78 g
Bandwidth performance
Sustained sequential read: up to 540 MB/s
Sustained sequential write: up to 490 MB/s
Random read: 41k IOPs
Random write: 80k IOPs
Latency
Read: 80 us
Write: 85 us
DC power requirement
5 VDC 5% - 100 mV ripple p-p
Total power consumption
Active: 195 mW
Idle: < 85 mW
Useful drive life
72 TB written, up to 40 GB/day for 5 years
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%

180 GB SATA Opal2 SED SSD (Intel Pro 2500)

Specification
Description
Formatted capacity
180 GB
Architecture
Solid State Drive with SATA interface; ATA 8 Compliant and SATA 3.0 compliant
Interface
SATA 3.0 (6 Gb/s)
Form factor
2.5 in
Dimensions (W x H x L)
69.85 x 7 mm x 100.45 mm (2.75 x 0.27 x 3.95 in)
Weight
78 g
Data transfer rate
Sustained sequential read: up to 540 MB/s
Sustained sequential write: up to 490 MB/s
Power consumption
Power-up: 6 W
Read: < 3.7 W
Write: 3.7 W
Standby: <55 mW
DEVSLP: < 7 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1500 G

HP 1 TB SATA 6G 3.5 in 8 GB Solid State Hybrid Drive (SSHD)

Specification
Description
Formatted capacity
1 TB
Spindle speed
7200 rpm
Drive capacity
Solid State Hybrid Drive (SSHD) technology with NAND flash
Interface
Serial ATA
Cache buffer
64 MB
NAND flash commercial multilevel cell (cMLC)
8 GB
Number of sectors
1,953,525,168
Seek time
Single track: 2 ms
Average: 11 ms
Dimensions (W x H x L)
10.2 x 2.01 x 14.7 cm (4 x 0.78 x 5.79 in)
Weight
400 g (0.88 lb)
Operating temperature
5° to 55° C (41° to 131° F)

HP 1 TB 7.2K rpm SATA 6.0Gb/s 3.5 in hard disk drive

Specification
Description
Formatted capacity
1 TB
Rotational speed
7,200 rpm
Interface
Serial ATA
Buffer size
16MB
Logical blocks
1,953,525,168
Seek time
Single track: 2 ms
Average: 11 ms
Full-stroke: 21 ms
Height
1 in/2.54 cm
Width
1 in/2.54 cm
Operating temperature
5° to 55° C (41° to 131° F)

HP 1 TB SATA 6G 2.5 in 8GB solid state hybrid drive (SSHD)

Specification
Description
Formatted capacity
1 TB
Spindle speed
5,400 rpm +/- 0.2%
Drive type
Serial ATA
Interface
Solid State Hybrid Drive (SSHD) technology with NAND Flash
Cache buffer
64 MB
NAND Flash Commercial Multilevel Cell (cMLC)
8 GB
Number of sectors
976,773,168
Seek time
Single track: 2 ms
Average: 12 ms
Height
9.5 +/- 0.2 mm
Width
69.85 +/- 0.25 mm
Length
100.35 +0.20 / -0.25 mm
Weight
115 g/0.254 lb (max)
Operating temperature
0° to 60° C (32° to 140° F)

256GB SATA 2.5 in 3D Non-SED Solid State Drive

Specification
Description
Unformatted capacity
256 GB
500,118,192 (User Addressable Sectors)
Architecture
Self-encrypting (SED) solid state drive with NAND flash and SATA interface
Fully complies with ATA/ATAPI-7 standard (partially complies with ATA/ATAPI-8)
Power saving modes: DIPM (partial / slumber mode)
Support NCQ : Up to 32 depth
Synchronous signal recovery
Interface
Serial ATA (6.0 Gb/s)
Form factor
2.5 in
Height
6.80 mm ± 0.20
Width
Up to 54 g
Bandwidth performance
Sustained sequential read: Up to 540 MB/s
Average: 11 ms
Power
Power consumption:
Active: typical 250mW
Idle: Typical 50mW
Mean time between failure (MTBF)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% to 95%
Shock: 1,500 G/0.5 ms

HP 256 GB SATA 2.5 in Self-Encrypting (SED) Opal 2 Solid State Drive

Specification
Description
Unformatted capacity
256 GB
Architecture
Self-Encrypting (SED) Solid State Drive with 25nm MLC NAND Flash and SATA interface
Interface
SATA 2 (3 GB/s)
NAND flash
25 nm MLC NAND flash
Dimensions (W x H x L)
69.85 x 7 x 100.5 mm (2.75 x 0.27 x 3.95 in)
Weight
73 g (0.16 lb)
Bandwidth performance
Sustained sequential 128k read: 450 MB/s
Sustained sequential 128k write: 260 MB/s
Random 4k read: 46k IOPs
Random 4k write: 56k IOPs
Latency
Read: 55
Write: 55
Power consumption
Active: 160 mW
Idle: < 85 mW
Useful drive life
72 TB written, up to 40 GB/day for 5 years
Environmental
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G/1 ms

HP 256 GB SATA 6Gb/s SSD

Specification
Description
Capacity
256 GB
Interface
SATA 6 Gb/s
Dimensions (W x H x D)
6.985 x 0.7 x 10.05 cm (2.75 x 0.276 x 3.96 in)
Weight
78 g
Bandwidth performance
Sustained sequential read: up to 540 MB/s
Sustained sequential write: up to 490 MB/s
Random read: 41k IOPs
Random write: 80k IOPs
Latency
Read: 80 us
Write: 85 us
DC power requirement
5 VDC 5% - 100 mV ripple p-p
Total power consumption
Active: 195 mW
Idle: < 85 mW
Useful drive life
72 TB written, up to 40 GB/day for 5 years
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%

HP 2 TB 7.2K rpm SATA 6.0Gb/s 3.5 in hard disk drive

Specification
Description
Formatted capacity
2 TB
Rotational speed
7,200 rpm
Interface
SATA 6Gb/s NCQ
Cache, multisegmented
64 MB
Seek time
Read: < 8.5 ms
Write: < 9.5 ms
Height
26.11 mm /1.028 in
Width
101.6 mm / 4.0 in
Depth
146.99 mm /5.787 in
Seek time
Single track: 2 ms
Average: 11 ms
Weight
626 g (1.38 lb)
Operating temperature
0° to 60° C (32° to 140° F)

500 GB 2.5 in FIPS 140-2 SED solid state drive

Specification
Description
Formatted capacity
500 GB
Architecture
Self-encrypting (SED) solid state drive with SATA interface
Interface
Serial ATA 2 (6 GB/s)
Form factor
2.5 in
Height
6.80 mm ± 0.20
Width
69.85 mm ± 0.25
Length
100.35 mm ± 0.25/0.20
Weight
< 95 g (0.2 lb)
Bandwidth performance
Sustained data transfer rate OD: 100 MB/s
I/O data transfer rate: 600 MB/s
Power
Spinup: 1 A
Idle: 0.7 W
Sleep: 0.18 W
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)
Relative humidity: 5% to 95%
Shock: 400 G/2 ms

HP 500 GB 7.2K SATA 6.0Gb/s 2.5 in hard disk drive

Specification
Description
Unformatted capacity
466 GB
Rotational speed
7,200 rpm
Interface
Serial ATA 3.0 (6.0 Gb/s)
Buffer size
16 MB
Logical blocks
976,773,168
Seek time
Single Track: 2.0 ms
Average: 12 ms
Full-stroke: 25 ms
Height
6.8 mm (0.267 in)
Width
Media diameter: 63.5 mm/2.5 in
Physical size: 70 mm/2.75 in
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)

HP 500 GB 7.2K SATA 6.0Gb/s 2.5 in Opal2 hard disk drive

Specification
Description
Unformatted capacity
500 GB
Rotational speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer size
32 MB
Logical blocks
976,773,168
Seek time
Single Track: 1.5 ms
Average: 12 ms
Full-stroke: 25 ms
Height
6.8 mm (0.267 in)
Width
Media diameter: 63.5 mm/2.5 in
Physical size: 70 mm/2.75 in
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)

500GB 7.2K rpm SATA 6.0Gb/s 3.5 in hard disk drive

Specification
Description
Unformatted capacity
500 GB
Rotational speed
7,200 rpm
Interface
Serial ATA 3.0 (6.0 Gb/s)
Buffer size
16 MB
Logical blocks
976,773,168
Seek time
Single Track: 2.0 ms
Average: 11 ms
Full-stroke: 21 ms
Height
2.54 mm (1 in)
Width
Media diameter: 8.89mm/3.5 in
Physical size: 10.2 cm/4 in
Environmental (non-condensing)
Operating temperature: 5° to 55° C (41° to 131° F)

HP 500 GB SATA 6G 2.5 in 8GB solid state hybrid drive (SSHD)

Specification
Description
Formatted capacity
500 GB
Spindle speed
5,400 rpm +/- 0.2%
Drive type
Solid State Hybrid Drive (SSHD) technology with NAND Flash
Interface
SATA 6 Gb/s
Cache buffer
64 MB
NAND flash commercial multilevel cell (cMLC)
8 GB
Number of sectors
976,773,168
Seek time
Single track: 2 ms
Average: 12 ms
Height
6.8 +/- 0.2 mm (0.268 +/-.008 in )
Width
69.85 +/- 0.25 mm (2.750 +/- 0.010 in)
Length
100.35 +0.20 / -0.25 mm (3.951 +0.008 / -0.010)
Weight
95 g (0.209 lb)
Operating temperature
5° to 55° C (41° to 131° F)

HP 512GB turbo drive G2 SSD-M.2 PCIe Card

Specification
Description
Unformatted capacity
500 GB
Architecture
Solid State Drive M.2 PCIe Gen 3 x4 NVMe
NVMe 1.1a Compliant
Interface
M.2 PCIe Gen 3 x4 NVMe
Form factor
2.5 in
Height
Low profile, 7 mm height
Width
69.85 mm ± 0.25
Length
50 mm ± 0.15
Weight
Up to 10 g
Data transfer rate (128k Sequential )
Sustained read: up to 2150 MB/s
Sustained write: up to 1550 MB/s
Power
Average read: 4.3 W
Average write: 605 W
Idle: 70 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1000 G peak (operating)

HP 128 GB turbo drive SSD-M.2 PCIe Card

Specification
Description
Unformatted capacity
128 GB
Architecture
Solid State Drive M.2 PCIe Gen 2 x4 AHCI; NCQ Command Set
Interface
M.2 PCIe x4 Gen 2
Form factor
M.2 2280
Dimensions (W x H x L)
22 x 80 x 3.73 mm (0.899 x 3.149 x .146 in)
Weight
8 g (0.017 lb)
Bandwidth performance
Sustained read: up to 920 MB/ss
Sustained write: up to 430 MB/s
Power
Allowable voltage: 3.3V ± 5%
Total power consumption: 5.8 W (Active) ; 80 mW; (Idle)
MTBF
1.5 M hrs
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1,500 G peak (operating)
Regulations
Safety TUV UL CB c-UL-us:
  • TUV
  • UL CB
  • c-UL-us
  • c-UL-us
EMC/EMI:
  • CE (EU)
  • BSMI (Taiwan)
  • KCC (South Korea)
  • C-Tick (Australia)

HP 256 GB turbo drive SSD-M.2 PCIe Card

Specification
Description
Formatted capacity
256 GB
Architecture
Solid State Drive M.2 PCIe Gen 2 x4 AHCI
NCQ Command Set
Interface
M.2 PCIe Gen 2 x 4
Form factor
M.2 2280
Height
7 mm ± 0.20
Width
69.85 mm ± 0.25
Length
50 mm ± 0.15
Weight
Up to 10 g
Data transfer rate (128k Sequential )
Sustained read: up to 2150 MB/s
Sustained write: up to 1200 MB/s
Power
Average read: 4 W
Average write: 5.1 W
Standby: 700 mW
Idle: 70 mW
Environmental (non-condensing)
Operating temperature: 0° to 70° C (32° to 158° F)
Relative humidity: 5% - 95%
Shock: 1000 G peak (operating)

Optical drives

HP Slim SuperMulti DVD Writer Drive

Specification
Description
Height
12.7 mm (0.5 in)
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Disc recording capacity
Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x L)
128 x 12.7 x 127 mm (5.04 x 0.5 x 5 in) without bezel
Weight
190 g (0.42 lb)
Write speeds
DVD-RAM: Up to 5x
DVD-R DL: Up to 6x
DVD+R: Up to 8x
DVD+RW: Up to 8x
DVD+R DL: Up to 6x
DVD-R: Up to 8x
DVD-RW: Up to 6x
CD-R: Up to 24x
CD-RW: Up to 24x
Read speeds
DVD-RAM: Up to 5x
DVD-RW, DVD+RW: Up to 8x
DVD-R DL, DVD+R DL: Up to 8x
DVD+R, DVD-R: Up to 8x
DVD-ROM DL, DVD-ROM: Up to 8x
CD-ROM, CD-R: Up to 24x
CD-RW: Up to 24x
Access time (typical)
Random: DVD-ROM and CD-ROM 170 ms
Full stroke: DVD-ROM and CD-ROM 320 ms
Stop time: 6 seconds
Power
Source: Slimline SATA DC power receptacle
DC power requirement: 5 VDC ± 5%-100 mV ripple p-p
DC current: 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental (non-condensing)
Temperature: 5° to 50° C (41° to 122° F)
Relative humidity: 10% - 80%

HP Slim Blu-ray BDXL Drive

Specification
Description
Height
12.7 mm (0.5 in)
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Disc recording capacity
Up to 128 GB QL, 100 GB TL, 50 GB DL or 25 GB standard SL
Dimensions (W x H x L)
128 x 12.7 x 127 mm (5.04 x 0.5 x 5 in) without bezel
Weight
170 g (0.37 lb)
Write speeds
Triple-layer
Quadruple-layer
BD-R
Up to 4x
Up to 4x
BD-RE
Up to 2x
Note supported
Single-layer
Double-layer
BD-R
Up to 6x
Up to 6x
BD-RE
Up to 2x
Up to 2x
DVD-R
Up to 8x
Up to 6x
DVD-RW
Up to 6x
Not supported
DVD+R
Up to 8x
Up to 6x
DVD+RW
Up to 8x
Not supported
DVD-RAM
Up to 5x
CD-R
Up to 24x
CD-RW
Up to 24x
Triple-layer
Quadruple-layer
BD-R
Up to 4x
Up to 4x
BD-RE
Up to 4x
Note supported
Read speeds
Single-layer
Double-layer
BD-ROM
Up to 6x
Up to 6x
BD-R
Up to 6x
Up to 6x
BD-RE
Up to 6x
Up to 6x
DVD-ROM
Up to 8x
Up to 8x
DVD-R
Up to 8x
Up to 8x
DVD-RW
Up to 8x
DVD+R
Up to 8x
Up to 8x
DVD+RW
Up to 8x
BDMV (AACS Compliant Disc)
Up to 6x/2x (Read/Play)
DVD-RAM
Up to 5x
DVD-Video (CSS Compliant Disc)
Up to 8x/4x (Read/Play)
CD-R/RW/ROM
Up to 24x
CD-DA (DAE)
Up to 20x/10x (Read/Play)
Access time (typical)
Random
BD-ROM: 350 ms
DVD-ROM: 185 ms
CD-ROM: 165 ms
Full stroke
BD-ROM: 350 ms
DVD-ROM: 345 ms
CD-ROM: 340 ms
Power
Source: Slimline SATA DC power receptacle
DC power requirement: 5 VDC ± 5%-100 mV ripple p-p
DC current: 5 VDC -1200 mA typical, 2000 mA maximum
Environmental (non-condensing)
Temperature: 5° to 50° C (41° to 122° F)
Relative humidity: 10% - 80%
Maximum wet bulb temperature: 29° C (84° F)

HP Slim DVD-ROM Drive

Specification
Description
Height
12.7 mm (0.5 in)
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Dimensions (W x H x L)
128 x 12.7 x 127 mm (5.04 x 0.5 x 5 in) without bezel
Weight
170 g (0.37 lb)
Read speeds
DVD+R/-R/+RW/ -RW/+R DL /-R DL: Up to 8x
DVD-ROM: Up to 8x
CD-ROM,CD-R: Up to 24x
CD-RW: Up to 24x
Access time (typical)
Random
DVD-ROM: 170 ms
CD-ROM: 170 ms
Full stroke
DVD-ROM: 320 ms
CD-ROM: 320 ms
Power
Source: Slimline SATA DC power receptacle
DC power requirement: 5 VDC ± 5%-100 mV ripple p-p
DC current: 5 VDC - < 1000 mA typical, < 1600 mA maximum
Environmental (non-condensing)
Temperature: 5° to 50° C (41° to 122° F)
Relative humidity: 10% - 80%
Maximum wet bulb temperature: 29° C (84° F)

Networking and communications

Intel I219LM gigabit network connection LOM

Specification
Description
Connector
RJ-45
System interface
PCIe + SMBus
Controller
Intel I219LM Gigabit Ethernet Controller
Data rates supported
Supports operation at 10/100/1000 Mb/s data rates
IEEE compliance
IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASETX, and 10BASET applications (802.3ab, 802.3u, and 802.3i, respectively).
IEEE 802.3az support [Low Power Idle (LPI) mode]
IEEE 802.3u auto-negotiation conformance
Performance
Jumbo Frames (up to 9 kB)
802.1Q & 802.1p
Receive Side Scaling (RSS)
Two Queues (Tx & Rx)
Power
Ultra Low Power at cable disconnect enables platform support for connected standby
Reduced power consumption during normal operation and power down modes
Integrated Intel Auto Connect Battery Saver (ACBS)
Single-pin LAN Disable for easier BIOS implementation
Fully integrated Switching Voltage Regulator (iSVR)
Low Power Link-Up (LPLU)
MAC/PHY interconnect
PCIe-based interface for active state operation (S0 state)
SMBus-based interface for host and management traffic (Sx low power state)
Management interface
MDC/MDIO management interface
Security and manageability
Intel vPro support with appropriate Intel chipset components

Intel Ethernet I210-T1 gigabit network adapter

Specification
Description
Connector
RJ-45
System interface
PCIe + SMBus
Controller
Intel I210 Gigabit Ethernet Controller
Memory
Integrated Dual 48K configurable transmit receive FIFO Buffers
Data rates supported
10/100/1000 Mbps
IEEE compliance
802.1P
802.1Q
802.2
802.3
802.3AB
802.3u
802.3x flow control
Bus architecture
PCI-E 2.1
Data path width
Bus-master DMA
Hardware certifications
FCC, B, CE, TUV-c, TUVus Mark Canada and United States, TUV-GS Mark for European Union
Power requirement
Aux 3.3 V, 3.0 Watts in 1000 base-T and 1.0 Watts in 100 Base-T
Boot ROM support
Yes
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
Network transfer rate
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps (actual rate limited by PCI bus)
Environmental
Operating temperature: 0° to 55° C (32° to 132° F)
Operating humidity: 85% at 55° C (131° F)
Management
WOL, PXE, DMI, WFM 2.0

Broadcom BCM943228Z 802.11n 2x2 dual band combo PCIe x1 card

Specification
Description
Wireless LAN standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Interoperability
Wi-Fi certified
Frequency band
802.11b/g/n
  • 2.402 - 2.482 GHz
    note:
    The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
802.11a/n
  • 4.9 - 4.95 GHz (Japan)
  • 5.15 - 5.25 GHz
  • 5.25 - 5.35 GHz
  • 5.47 - 5.725 GHz
  • 5.47 - 5.85 GHz
    note:
    Band not supported in Indonesia
Antenna structure
2 transmit
2 receive
Data rates
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
Modulation
Direct Sequence Spread Spectrum
CCK, BPSK, QPSK, 16-QAM, 64-QAM
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
Sub-channels
Multinational support with frequency bands and channels compliant to local regulations
Network architecture models
Ad-hoc (peer to peer)
Infrastructure (access point required)
Roaming
IEEE 802.11 compliant roaming between band Access Points
Output power
802.11b: +16 dBm minimum
802.11g: +14 dBm minimum
802.11a: +14 dBm minimum
802.11n HT20 (2.4 GHz): +13 dBm minimum
802.11n HT40 (2.4 GHz): +13 dBm minimum
802.11n HT20 (5 GHz): +12 dBm minimum
802.11n HT40 (5 GHz): +12 dBm minimum
Power consumption
Transmit: 2.0 W (max)
Receive: 1.6 W (max)
Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 60 mW (WLAN unassociated)
Radio disabled: 30 mW
Power management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver sensitivity
802.11b, 1Mbps: -94 dBm maximum
802.11b, 11Mbps: -86 dBm maximum
802.11g, 6Mbps: -88 dBm maximum
802.11g, 54Mbps: -74 dBm maximum
802.11a, 6Mbps: -86 dBm maximum
802.11a, 54Mbps: -72 dBm maximum
802.11n, MCS07: -69 dBm maximum
802.11n, MCS15: -66 dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO and Bluetooth communications
Form factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22 x 30 mm
Type 1630: 2.3 x 16 x 30 mm
Weight
Type 2230: 2.8 g
Type 1630: 2 g
Operating voltage
3.3v +/- 9%
Temperature
Operating: -10° to 70° C (14° to 158° F)
Non-operating: -40° to 80° C (-40° to 176° F)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 3,048 m (10,000 ft)
Non-operating: 0 to 15,240 m (50,000 ft)
LED activity
LED Amber - Radio OFF; LED White - Radio ON

HP Integrated Module with Bluetooth 4.0+EDR wireless technology

Specification
Description
Bluetooth specification
4.0+EDR compliant
Frequency band
2402 to 2480 MHz
Number of available channels
79 (1 MHz) available channels
Data rates and throughput
3 Mbps data rate; throughput up to 2.17 Mbps
Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric or 1306.9 kbps symmetric
Transmit power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR
Receiver sensitivity
Modulation
0.01% BER
0.001% BER
GFSK
-80 dBm
-70 dBm
π/4-DQPSK
-80 dBm
-70 dBm
8DPSK
-80 dBm
-70 dBm
Power consumption
Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range
Up to 10 m (33 ft)
Electrical interface
USB 2.0 compliant
Bluetooth software supported link topology
Microsoft Windows Bluetooth Software
Electrical interface Bluetooth software supported
Point to Point, Multipoint Pico Nets up to 7 slaves
Full support of Bluetooth Security Provisions
Power management certifications
Microsoft Windows ACPI, and USB Bus Support
Self-configurable to optimize power conservation in all operating modes, including Standby, Hold, Park, and Sniff
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
Security
All necessary regulatory approvals for supported countries, including FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications Bluetooth profiles supported
UL, CSA, and CE Mark Serial Port Profile (SPP)
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)
Generic Object Exchange Profile (GOEP)
Object Push Profile (OPP)
File Transfer Profile (FTP)
Synchronization Profile (SYNC)
Hard Copy Cable Replacement (HCRP)
Personal Area Networking Profile (PAN)
Human Interface Device Profile (HID)
FAX Profile (FAX)
Basic Imaging Profile (BIP)
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)

Intel 8260 2x2 dual band 802.11ac WLAN/ Bluetooth combo

Specification
Description
Wireless LAN standards
IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
Interoperability
Wi-Fi certified
Frequency band
802.11b/g/n
  • 2.402 - 2.482 GHz
    note:
    The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
802.11a/n
  • 4.9 - 4.95 GHz (Japan)
  • 5.15 - 5.25 GHz
  • 5.25 - 5.35 GHz
  • 5.47 - 5.725 GHz
  • 5.825 - 5.85 GHz
    note:
    Band not supported Indonesia
Antenna interface
With antennas installed in the system, the antenna peak gain is less than +3dBi in the 2.4 GHz band and less than +4 dBi in the 5 GHz band to allow the device to meet regulatory limits.
Data rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80 MHz channels. 433Mbps for 1x1 and 867Mbps for 2x2
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
WAPI
Roaming
802.11r fast roaming
Output Power (Transmitting)
802.11b: +16 dBm minimum
802.11g: +14 dBm minimum
802.11a: +14 dBm minimum
802.11n HT20 (2.4 GHz): +14 dBm minimum
802.11n HT40 (2.4 GHz): +12 dBm minimum
802.11n HT20 (5 GHz): +14 dBm minimum
802.11n HT40 (5 GHz): +12 dBm minimum
802.11ac 80 MHz (5 GHz): +12 dBm minimum
Power consumption
Transmit: 2.0 Watts
Receive: 1.6 Watts
Idle mode (PSP): 180 mW (WLAN associated)
Idle mode: 50 mW (WLAN unassociated)
Connect standby 10mW (WLAN+BT)
Radio off: 5 mW
Bluetooth power consumption
Peak operating: 330 mW
Receive: 230 mW
USB selective suspend: 17 mW
Power management
The product conforms to the ACPI and PCI Express M.2 bus methods to manage power of the WLAN components
Supports all 802.11 compliant power-save modes. These include the basic Power Save Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in 802.11e
Receiver sensitivity
802.11b, 1Mbps: -94 dBm maximum
802.11b, 11Mbps: -86 dBm maximum
802.11g, 6Mbps: -88 dBm maximum
802.11g, 54Mbps: -74 dBm maximum
802.11a, 6Mbps: -86 dBm maximum
802.11a, 54Mbps: -72 dBm maximum
802.11n, MCS07: -69 dBm maximum
802.11n, MCS15: -66 dBm maximum
802.11ac, 1SS, MCS-0: -86 dBm maximum
802.11ac, 1SS, MCS-9: -61 dBm maximum
802.11ac, 2SS, MCS-0: -83 dBm maximum
802.11ac, 2SS, MCS-9: -58 dBm maximum
Form factor
PCI-express M.2 form factor
Dimensions
Type 2230: 2.3 x 22 x 30 mm
Type 1630: 2.3 x 16 x 30 mm
Operating voltage
3.3v +/- 9%
Temperature
Operating: –10° to 70° C (14° to 158° F)
Non-operating: –40° to 80° C (–40° to 176° F)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 3,048 m (10,000 ft)
Non-operating: 0 to 15,240 m (50,000 ft)

Intel 3165 1x1 Dual Band 802.11ac WLAN/ Bluetooth combo

Specification
Description
Wireless LAN standards
IEEE 802.11 ac/a/b/g/n
Interoperability
Wi-Fi certification
WLAN + Bluetooth Combo M.2 Card device shall meet all of the requirements to support Bluetooth 4.1 and backwards compatible with 2.1 with EDR
Frequency band
802.11b/g/n
  • 2.402-2.482 GHz
802.11a/n/ac
  • 4.9 - 4.95 GHz (Japan)
  • 5.15 - 5.25 Ghz
  • 5.25 - 5.35 GHz
  • 5.47 - 5.725 GHz
  • 5.825 - 5.85
    note:
    Band not supported in Indonesia
Antenna interface
With antennas installed in the system, the antenna peak gain is less than +3dBi in the 2.4GHz band and less than +4dBi in the 5GHz band to allow the device to meet regulatory limits.
Data rates
02.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20 and 40 MHz channels. Short and long guard interval shall be supported
802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80 MHz channels. 433Mbps for 1x.
Security
IEEE and Wi-Fi compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through V5
WAPI
Roaming
802.11r Fast Roaming
Output power (transmitting)
802.11b: +16 dBm minimum
802.11g: +14 dBm minimum
802.11a: +14 dBm minimum
802.11n HT20 (2.4 GHz): +14 dBm minimum
802.11n HT40 (2.4 GHz): +12 dBm minimum
802.11n HT20 (5 GHz) : +14 dBm minimum
802.11n HT40 (5 GHz): +12 dBm minimum
Power consumption
Transmit: 2.0 Watts
Receive: 1.6 Watts
Idle mode (PSP): 180 mW (WLAN associated)
Idle mode: 50 mW (WLAN unassociated)
Connect Standby 10mW (WLAN+BT)
Radio off: 5 mW
Bluetooth power consumption
Peak operating: 330 mW
Receive: 230 mW
USB selective suspend: 17 mW
Power management
The product conforms to the ACPI and PCI Express M.2 bus methods to manage power of the WLAN components
Supports all 802.11 compliant power-save modes. These include the basic Power Save Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in 802.11e
Receiver sensitivity for FER < 10%
802.11b, 1Mbps: -94 dBm maximum
802.11b, 11Mbps: -86 dBm maximum
802.11a/g, 6Mbps: -88 dBm maximum
802.11a/g, 54Mbps : -74 dBm maximum
802.11n, MCS07: -69 dBm maximum
802.11n, MCS15: -66 dBm maximum
802.11ac, 1SS, MCS-0: -86 dBm maximum
802.11ac, 1SS, MCS-9: -61 dBm maximum
802.11ac, 2SS, MCS-0: -83 dBm maximum
802.11ac, 2SS, MCS-9: -58 dBm maximum
Form factors
PCI Express M.2 form factor
Operating voltage
The card will be powered by a 3.3V, ± 9% supply from the host system
Temperature
Operating: -10° to 70° C (14° to 158° F)
Non-operating: -40° to 80° C (-40° to 176° F)
Humidity
Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude
Operating: 0 to 3,048 m (10,000 ft)
Non-operating: 0 to 15,240 m (50,000 ft)

Audio specifications

Specification
Description
Type
Integrated
HD stereo codec
Realtek 2-channel ALC221 codec
Audio I/O ports
Front microphone-in (150-K ohm input impedance)
Rear line-In/microphone input (150-K ohm input impedance, function is configurable by audio driver)
Rear line-out (190 ohms Output Impedance, expects at least a 10-K ohm load)
Front headphone-out (0.5 Ohm output impedance, expects at least a 32 ohm load)
Front microphone/headphone jack is re-task able to provide microphone input
Line-in or headphone output to support connecting two headphones to the front of the system. When configured as a second front headphone output, both front headphone outputs are always driven with the same signal.
All ports are 3.5 mm
Internal speaker amplifier
1.5 W amplifier for the internal speaker only. External speakers must be powered externally. Rear line-in audio port is re-taskable as either line-in or microphone-in.
Multi-streaming capable
Multi-streaming can be enabled in the Realtek control panel to allow independent audio streams to be sent to and from the front and rear jacks.
Sampling
8 kHz - 192 kHz
Wavetable syntheses
Yes - uses OS soft wavetable
Analog audio
Yes
Number of channels on line-0ut
Stereo (left and right channels)
Internal speaker
Yes
External speaker jack
Yes
Specification
Description
HD stereo codec
Conexant 2-channel CX5001 codec
Audio I/O ports
Side headphone
Side headphone/microphone/Line-In (function is configurable by audio driver; re-task able to provide headphone, microphone, or line-In
Rear line out
All ports are 3.5 mm
Internal speaker amplifier
2 W amplifier for the internal speaker only. External speakers must be powered externally.
Multi-streaming capable
Multi-streaming can be enabled in the DTS control panel
Sampling
44.1 kHz - 192 kHz
Wavetable syntheses
Yes - Uses OS soft wavetable
Analog audio
Yes
Number of channels on line-out
Stereo (Left and right channels)
Internal speaker
Yes
External speaker jack
Yes

Input/output devices

HP Conferencing Keyboard

Specification
Description
Physical characteristics
Keys
110 (US) Layout, 111 (EU) Layout – depending upon country
Dimensions (L x W x H)
2.16 x 44.05 x 15.50 cm (0.85 x 17.34 x 6.10 in)
Weight
700 g (24.69 lb)
Connectivity
USB cable
Feature summary
Full-size ultra-quiet keyboard with numerical pad and 12 function keys
One-touch simplicity for Microsoft Lync or Skype for Business calls with dedicated keys and LED light indicators
Illuminated keys
Incoming call – Blinks Green
Call in progress –Green
Microphone mute – Orange
Audio mute – Orange
Screen sharing – Orange
Stop webcam – Orange
Other call control keys
End/decline Call
Volume up and down rocker key
Microsoft Lync / Outlook
Fn+F12 – Lync or Skype for Business Calendar will open. If Lync or Skype for Business is not available will bring Outlook Calendar
Fn+F11 – Lync or Skype for Business Contact will open. If Lync or Skype for Business is not available will bring Outlook Contact list
note:
* Fn+11 and Fn+12 function keys are not supported in Microsoft Windows 8.x Metro mode
Functions keys
Fn+F10 – System settings
Fn+F9 – Devices
Fn+F8 – Search
Fn+F7 – Blank
Fn+F6 – Up brightness adjustment
Fn+F5 – Down brightness adjustment
Fn+F4 – Display options
Fn+F3 – File explorer
Fn+F2 – System lock
Fn+F1 – System sleep
System requirements
Available USB port
Windows 7, Windows 8.x, and Windows 10
Server: Microsoft Lync Server 2010 or 2013 and Skype for Business Server 2015
Client: Microsoft Lync 2013 version 15.0.46xx or newer or Skype for Business
note:
Limited support for Microsoft Lync 2010, Microsoft Lync 2013 Basic and Microsoft Metro Mode
Screen brightness functions supported in select HP systems
Approvals EMC product safety
FCC; CE; ACA (C-tick); EAC, UL, CE Mark

HP USB Business Slim Keyboard

Specification
Description
Physical characteristics
Keys
104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H)
436.8 ± 1.5 x 137.6 ± 1.0 x 21.0 ± 1.0 cm (171.97 x 68.35 x 8.27 in)
Weight
0.6± 0.08 kg (1.32 lb) minimum
Electrical
Operating voltage
+ 4.4 – 5.25 VDC
Power consumption
50 mA maximum (with 5 VDC power supplied and three LEDs ON)
System interface
USB Type A plug connector
ESD
Contact discharge: 2, 4,6,8 KV
Air discharge: 2, 4, 8,10,12.5 KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001
Functionally compliant
Mechanical
Keycaps
Low-profile design
Switch actuation
60 ± 12.5 g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
1.8 m (6 ft)
Microsoft PC 99 - 2001
Mechanically compliant
Environmental
Acoustics
43 dBA maximum sound pressure level
Temperature
Operating: 10° to 50° C (50° to 122° F)
Non-operating: -30° to 60° C (-22° to 140° F)
Humidity
Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 20% to 80% (non-condensing at ambient)
Shock
Operating: 40 g, six surfaces
Non-operating: 80 g, six surfaces
Vibration
Operating: 2 g peak acceleration
Non-operating: 4 g peak acceleration
Drop (out of box)
66 cm (26 in) on carpet, six-drop sequence
Drop (in box)
76.2 cm (30 in) on concrete, 16-drop sequence
Approvals
UL, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, KC
Ergonomic compliance
ANSI HFS 100, ISO 9241-4, and TUVGS
Kit contents
Keyboard
Installation guide
Warranty card
Safety and comfort guide

HP PS/2 Keyboard

Specification
Description
Physical characteristics
Keys
104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H)
46.28 x 16.43 x 2.79 cm (18.22 x 6.47 x 1.1 in)
Weight
0.9 kg (2 lb) minimum
Electrical
Operating voltage
+ 5 VDC ± 10%
Power consumption
50 mA maximum (with three LEDs ON)
System interface
PS/2 6-pin mini din connector
ESD
CE level 4, 15 kV air discharge
EMI - RFI
Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001
Functionally compliant
Mechanical
Keycaps
Low-profile design
Switch actuation
55 g nominal peak force with tactile feedback
Switch life
20 million keystrokes (using Hasco modified tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
1.8 m (6 ft)
Microsoft PC 99 - 2001
Mechanically compliant
Environmental
Acoustics
50 dBA maximum sound pressure level
Temperature
Operating: 0° to 40° C (32° to 104° F)
Non-operating: -30° to 65° C (-22° to 149° F)
Humidity
Operating: 15% to 80% (non-condensing at ambient)
Non-operating: 15% to 90% (non-condensing at ambient)
Shock
Operating: N/A
Non-operating: 65 in 2.9 ms, six surface; 30g 266 inch/second; 50 g 266 inch/second six surface
Vibration
Operating: 2 g peak acceleration
Non-operating: Starting at 5 Hz, vary the frequency of vibration from 5 to 500 Hz and back to 5 Hz at a Logarithmic sweep rate of 1 octave per minute.
Drop (out of box)
66 cm (26 in) on carpet, six-drop sequence
Drop (in box)
76 cm (29.93 in) on concrete, 16-drop sequence
Approvals
CUL, ICES-003 Class B, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC
Ergonomic compliance
ANSI HFS 100, ISO 9241-4, and TUVGS

HP PS/2 Business Slim Keyboard

Specification
Description
Physical characteristics
Keys
104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H)
436.8 ± 1.5 x 137.6 ± 1 x 21.0 ± 1 cm (171.97 x 68.35 x 8.27 in)
Weight
600 ± 80 g (1.32 lb)
Electrical
Operating voltage
+ 4.4 – 5.25VDC
Power consumption
50 mA maximum (with 5 VDC power supplied and three LEDs ON
System interface
PS/2 6-pin mini din connector
ESD
Contact discharge: 2, 4,6,8KV
Air discharge: 2, 4, 8,10,12.5KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001
Functionally compliant
Mechanical
Keycaps
Low-profile design
Switch actuation
60 ± 12.5 g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
1.8 m (6 ft)
Microsoft PC 99 - 2001
Mechanically compliant
Environmental
Acoustics
43 dBA maximum sound pressure level
Temperature
Operating:
10° to 50° C (50° to 122° F)
Non-operating:
-30° to 60° C (-22° to 140° F)
Operating humidity
Operating:
10% to 90% (non-condensing at ambient)
Non-operating:
20% to 80% (non-condensing at ambient)
Operating shock
Operating:
N/A
Non-operating:
65 inch 2.9 ms, six surface; 30 g 266 inch/second; 50 g 266 inch/second six surface
Operating vibration
Operating:
2 g peak acceleration
Non-operating:
Starting at 5 Hz, vary the frequency of vibration from 5 to 500 Hz and back to 5 Hz at a Logarithmic sweep rate of 1 octave per minute.
Drop (out of box)
66 cm (26 in) on carpet, six-drop sequence
Drop (in box)
76 cm (29.93 in) on concrete, 16-drop sequence
Approvals
UL, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, KC
Ergonomic compliance
ANSI HFS 100, ISO 9241-4, and TUVGS

HP Wireless Business Slim Keyboard and Mouse

Specification
Description
Keyboard
Dimensions (H x L x W)
436.8 ± 1.5 x 137.6 ± 1 x 21 ± 1 cm (171.97 x 68.35 x 8.27 in)
Weight - without two AA Alkaline batteries
560 ± 80 g (1.23 lb)
Mouse
Dimensions (H x L x W)
37 x 115 x 62.9 mm (1.46 x 4.53 x 2.47 in)
Weight - without two AA Alkaline batteries
67 g (0.15 lb)
Receiver
Dimensions (H x L x W)
8.4 x 45.5 x 18.4 mm (0.33 x 1.79 x 0.72 in)
Weight
5.9 g (0.21 oz)
Cable length - minimum
1.8 m (6 ft)
Range
10 m (32.8 ft)
System requirements1
Available USB port for the receiver
CD-ROM Drive
note:
This system may require upgraded and/or separately purchased hardware and/or a DVD drive to install the Windows 7 software and take full advantage of Windows 7 functionality. See http://www.microsoft.com/windows/windows-7/ for details.
Approvals
Product safety
UL; CSA /TUV (Europe only); CE Mark; CB Report
Ergonomics
ANSI; ISO (Europe only); GS Mark (Germany only)
EMC
FCC; CE; ACA (-tick); BSMI; KC ; VCCI
CE mark
EN 55022:2010; EN 55024; EN 301489-1; EN 61000
Design guidelines for PCs
PC 99 – connector overmold colors; PC 2001 – full functionality
Telecom
All local telecom requirements and approvals for intended markets
USA
FCC Title 47 CFR, Par 15, Subpart C; other local requirements
Country support
Argentina, Australia, Austria, Belgium, Brazil, Bulgaria, Canada, Chile, China, Croatia Czech Republic, Cyprus, Denmark, Ecuador, Estonia, Finland, France, Germany, Greece, HK, Hungary, India, Indonesia, Ireland, Israel, Italy, Japan, Korea, Latvia, Lithuania, Luxemburg, Malta, Mexico, Malaysia, Netherlands, Norway, NZ, Peru, Philippines, Poland, Portugal, Romania, Russia, Singapore, Slovakia, Slovenia, South Africa, Spain, Sweden, Switzerland, Taiwan, Thailand, Turkey, UK, Ukraine, United Arab Emirates, US, Venezuela, Vietnam, and up to 193 countries worldwide
Environmental
Keyboard contains 25% post-consumer recycled plastic material.

HP USB PS/2 Washable Keyboard

Specification
Description
Physical Characteristics
Dimensions (H x L x W)
449 x 168 x 35 mm (17.67x 6.62 x 1.38 in)
Weight
0.77 kg (1.7 lb)
Keys
104 (US) Layout, 105 (EU) layout – depending upon country
Electrical
Operating voltage
+ 5VDC ± 5%
Power consumption
50 mA maximum (with three LEDs ON)
System interface
USB Type A plug connector
ESD
CE level 4, 15 kV air discharge
EMI - RFI
Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001
Functionally compliant
Mechanical
Keycaps
Stepped profile design
Switch actuation
55 g nominal peak force with tactile feedback
Switch life
20 million keystrokes
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
2.2 m (7 ft)
Microsoft PC 99 - 2001
Mechanically compliant
Acoustics
43 dBA maximum sound pressure level
Environmental
Temperature
Operating: 10° to 50° C (50° to 122° F)
Non-operating: -20° to 65° C (4° to 149° F)
Humidity
Operating: 10% to 95% (non-condensing at ambient)
Non-operating: 0% to 95% (non-condensing at ambient)
Shock
Operating: 40 g, six surfaces
Non-operating: 80 g, six surfaces
Vibration
Operating: 2 g peak acceleration
Non-operating: 4 g peak acceleration
Drop (out of box)
66 cm (26 in) on carpet, six-drop sequence
Drop (in box)
107 cm (42 in) on concrete, 16-drop sequence
Operating system support
Windows 7
Windows Vista
Windows XP Professional
Approvals
UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, C-Tick, KCC, USB-IF, WHQL, EN/IEC 60601-1, IP66/NEMA4X
Ergonomic compliance
ANSI HFS 100, ISO 9241-4, and TUVGS

HP USB Smart Card (CCID) Keyboard

Specification
Description
Physical characteristics
Dimensions (H x L x W)
46.3 x 16.1 x 3.3 cm (18.2 x 6.3 x 1.3 in)
Weight
0.9 kg (2 lb) minimum
Keys
104, 105, 106, 107, 109 layout (depending upon country)
Form factor
USB basic smart card keyboard
Colors
Carbonite/Silver
Electrical
Operating voltage
+ 5 VDC ± 5%
Power consumption
100 mA maximum (with four LEDs ON)
System interface
USB Type A plug connector
ESD
CE level 4, 15 kV air discharge
EMI - RFI
Conforms to FCC rules for a Class B computing device
Microsoft PC 99 - 2001
Functionally compliant
Mechanical
Languages
30+ available
Keycaps
Standard design
Switch actuation
55 g nominal peak force with tactile feedback
Switch life
20 million keystrokes (using Hasco modified tester)
Switch type
Contamination-resistant membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
1.8 m (6 ft)
Microsoft PC 99 - 2001
Mechanically compliant
Acoustics
43 dBA maximum sound pressure level
Environmental
Temperature
Operating: 10° to 50° C (50° to 122° F)
Non-operating: -30° to 60° C (-22° to 140° F)
Humidity
Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 20% to 80% (non-condensing at ambient)
Shock
Operating: 40 g, six surfaces
Non-operating: 80 g, six surfaces
Vibration
Operating: 2 g peak acceleration
Non-operating: 4 g peak acceleration
Drop (out of box)
66 cm (26 in) on carpet, six-drop sequence
Drop (in box)
107 cm (42 in) on concrete, 16-drop sequence
SmartCard function
Support
All ISO 7816 smart cards
Interface
Reads from and writes to all ISO7816-1, 2, 3, 4 memory and microprocessor smart cards (T = 0, T = 1)
Chipset
SCM STCIII
Standard APIs supported
PC/SC, EMV2000, CT-API
Power
USB Port
Short circuit detection (protects smart card and reader)
Power supply compliant with ISO7816 and EMV (5V, 60 mA)
Supports 3-V and 5-V cards
Power consumption
100-mA maximum draw
Communication
From card: 9600 bps to 330,000 bps
From computer: 12 Mbps (USB transfer speed)
Landing mechanism
Contact device: Friction contact
Card insertions rating: Up to 100,000 insertion cycles
Interface modes
CCID protocol
Reader performance interface
USB connection
Electro-magnetic standards
Europe: 2004/108/EC
USA: USAFCC part 15
Approvals
CE-Mark, UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC, EMV2000, USB-IF
Ergonomic compliance
ISO 9241-4, TUVGS
Kit contents
Keyboard, I/O Security and Documentation CD, warranty card

HP USB 1000dpi Laser Mouse

Specification
Description
Dimensions (H x L x W)
37.3 x 114.97 x 62.86 mm (1.47 x 4.53 x 2.47 in)
Weight
102 g (3.360 oz)
Cable length
180 cm (70.9 in)
System requirements
Available USB port
Environmental
Temperature
Operating: 0° to 40° C (32° to 104° F)
Non-operating: -20° to 60° C (-4° to 140° F)
Humidity
Operating: 10% to 90% (non-condensing at ambient)
Mechanical
Resolution
1000 dpi
Tracking speed
45 cm/s
Cable length
180 cm (70.9 in)

Software and security

Specification
Description
BIOS
HP BIOSphere
HP driveLock
HP BIOS protection
BIOS update via network
Master boot record security
Power on authentication
Secure erase
Hybrid boot (Windows 8.1 & higher)
Measured boot (Windows 8.1 & higher)
Secure boot (Windows 8.1 & higher)
Absolute persistence module
Multimedia
Cyberlink Power DVD, BD
Cyberlink Power2Go (Secure Burn)
Communication
Intel Wireless Display (WiDi) Software for Windows
Native Miracast Support
HP value add software
HP ePrint Driver
HP Recovery Disc Creator (Windows 7 only)
HP Recovery Manager
HP Support Assistant
Windows 10 Welcome App
Third party
Foxit PhantomPDF Express for HP
Microsoft products
Buy Office
Bing search
Skype
Manageability
HP SoftPaq Download Manager (SDM)
HP System Software Manager (SSM)
HP BIOS Config Utility (BCU)
HP Client Catalog
HP CIK for Microsoft SCCM8
LANDESK Management
HP BIOS Config Utility (BCU)
Discover HP Touchpoint Manager
Client security software
HP Drive Encryption
HP Client Security Manager
Microsoft Security Essentials
Microsoft Defender
TPM 1.2/2.0

Power supply specifications

Specification
Description
Standard efficiency
65W active PFC 89% average efficiency at 115V
90W active PFC 89% average efficiency at 115V
80 PLUS bronze
N/A
80 PLUS gold
N/A
80 PLUS platinum
N/A
91/93/90% efficient at 20/50/100% load (230 V)
Operating voltage range
90 - 264 VAC
Rated voltage range
100 - 240 VAC
Rated line frequency
50/60 Hz
Operating line frequency
47 – 63 Hz
Rated input current
N/A
DC Output
+19.5V
Current leakage (NFPA 99: 2102)
Less than 500 microamps of leakage current at 120 VAC with the ground wire disconnected, as required for non-patient electrical appliances and equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1.
Less than 100 microamps of leakage current at 120 VAC with the ground wire intact with normal polarity, as required for non-patient electrical appliances and equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1.
Power supply fan
N/A
Power cord length
N/A
External power adapter
N/A
Dimensions
N/A
Total cord length
N/A

Physical specifications

Specification
Description
Chassis (W x H x D)
175 x 34 x 177 mm (6.9 x 1.3 x 7.0 in)
System volume
1.05 L (62.79 cu in)
System weight
1.3 kg (2.9 lb)
Max supported weight
35.0 kg (77.0 lb)
Stand dimensions
19.5 x 117 x 160 mm (77x 4.6 x 6.3 in)
Weight: 477 g (0.1 lbs)
Packaging (H x W x D)
198 x 290 x 500 mm (7.8 x 11.4 x 19.7 in)
Shipping weight
4.1 kg (9 lb)
Palletization Profile
8 units per layer
10/12 layer max
80/96 per pallet
47.126 x 39.291 x 99.252 in (including pallet)

Operating systems

Specification
Description
Preinstalled
Windows 10 Pro 64
Windows 10 Home 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro
Windows 7 Professional 64
Windows 7 Professional 32
Preinstalled (other)
FreeDOS 2.0
NeoKylin Linux 64 (China only)
Web-supported
Windows 10 Pro 64
Windows 10 Home 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 7 Professional 64 (available through downgrade rights from Windows 10 Pro)
Windows 7 Professional 32 (available through downgrade rights from Windows 10 Pro
Windows 10 Enterprise 64
Windows 8.1 Enterprise 64
Windows 7 Enterprise 64
Windows 7 Enterprise 32

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Country/Region: Flag Australia

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